The semiconductor industry is entering a decisive phase where traditional 2D scaling is no longer sufficient to sustain performance, energy efficiency, and cost targets. The path forward lies in 3D integration, where materials innovation and substrate engineering play a pivotal role. At Soitec, our mission is to provide the foundational technologies that make this transition possible.

Engineered substrates represent a strategic enabler for the next era of computing. By tailoring the substrate to the device, we unlock unique advantages: superior electrical isolation, reduced power consumption, enhanced thermal performance, and the ability to integrate diverse materials seamlessly. This flexibility is essential to meet the diverse requirements of high-performance computing, mobile communications, automotive intelligence, and edge AI.

At the heart of this innovation is Soitec’s Smart Cut™ layer transfer technology. This breakthrough makes it possible to detach and transfer ultra-thin crystalline layers with atomic precision, enabling stacking and heterogeneous integration at a scale and quality unmatched in the industry. With Smart Cut™, we can bring logic, memory, and interconnect layers closer together, shortening critical paths, reducing latency, and dramatically increasing bandwidth density.

What this means for the industry is profound: engineered substrates and precision layer transfer redefine the scaling roadmap. They extend Moore’s Law where transistor scaling alone cannot, and accelerate “More-than-Moore” solutions by enabling chiplet architectures, advanced system-in-package, and vertically integrated designs.

As we look ahead, Soitec is committed to driving collaboration across the ecosystem—foundries, device makers, and system integrators—to unlock the full potential of 3D integration. By aligning materials innovation with system-level needs, we ensure that the semiconductor industry continues to deliver the performance and efficiency breakthroughs that power our digital society.