Datacenter AI workloads are rewriting packaging rules. Bandwidth per millimeter, thermal density, and module yield now define system performance.

Participants will learn about the latest market forecasts for devices/packages driving the growth in this category, as well as application/technology trends. Beyond global industry players, we will highlight Japan’s strengths in chemicals, packaging materials, substrates and equipment that anchor CoWoS-class platforms and next-generation 3D assemblies.