27-28 August 2025
Suwon
JinYoung, formerly Sr. Vice President, Global R&D Strategy at Amkor Technology. He has more than 23 years’ experience in semiconductor package development and design including Wafer Level, Flip Chip, and MEMS & Sensors. JinYoung has been awarded thirty-five patents and published fifteen papers on advanced packaging technologies at several industry conferences. He holds a Ph.D. in mechanical engineering from Korea Advanced Institute of Science and Technology (KAIST) in Daejeon, Korea.