A memory and storage hierarchy evolution is unfolding before us. Homogenous data centers that met our needs in the past, will not meet our future needs.

We must look to heterogenous solutions that require an expansion of the current memory hierarchy, and ultimately, a convergence of memory and storage.

Conventional scaling must continue, while disruptive 3D, and other advanced solutions will emerge to move us into the next few decades of memory advancement.

Advanced Packaging solutions will play a critical role in this expanded hierarchy, but to achieve this monumental shift, the collaboration, knowledge-sharing, and

innovation our industry has relied on to extend Moore’s Law over the past decade must now push the boundaries, to move the packaging supply chain to a front-end like model.

At the same time, we must keep focus on more sustainable and cost-effective solutions while building a strong talent-based workforce to support long-term growth.

We face many near-term challenges to enable this new ecosystem, but if successful, our industry will emerge with a longer-term roadmap that impacts and enriches lives for generations to come.