27-28 August 2025
Suwon
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As Augmented Reality (AR) and Virtual Reality (VR) devices continue to mature, the need for lower size, weight, and power (SWaP) components will only increase. One solution to this demand is with Micro-Electromechanical Systems (MEMS). MEMS devices have become ubiquitous within the consumer electronics industry, and their unique balance of SWaP and performance present a unique opportunity to address the challenges associated with AR/VR development.
In this talk, I will introduce the AR/VR technology space and discuss multiple ways in which the sensing and compute demands push beyond previous methods of interacting with digital content. Current MEMS integration within these devices will be highlighted along with the constraints and opportunities for future MEMS integration.
Ken Diest
Research Manager and Tech Lead
Meta