As price competition in the electric vehicle (EV) market intensifies, new challenges have emerged for SiC module technology. The focus has shifted from merely pursuing performance to maximizing the capabilities of SiC chips. This involves achieving higher current, operating at higher temperatures, and extending the lifespan of the modules. This section will introduce the latest trends around these directions.

随着电动汽车价格竞争越来越激烈，也给SiC模块技术带来新的挑战，从过去的性能的追求，已经转变为如何最大挖出SiC芯片的能力，更高的电流，更高的使用温度，更长的寿命等，围绕这个方向来介绍新趋势。