Ahmer Syed is a VP of Engineering at Qualcomm in Global Manufacturing Technology and Operations organization. He leads a global team responsible for packaging technology development, NPI, HVM deployment for 5G, mobile, IoT, Connectivity, Automotive, and Compute markets.
A 30+ years veteran of Semiconductor and electronics industry, Ahmer has extensive experience in developing advanced packaging technologies such as Flip Chip, WLCSP, FO-WLP, Package on Package (PoP), QFN, and System in Package (SiP). He has authored and contributed to more than 70 technical papers and articles on advanced packaging and reliability and has been a keynote speaker in various international conferences.
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.