Mark Fuselier photo

Mark Fuselier

SVP Technology & Product Engineering


Mark Fuselier is senior vice president of Technology and Product Engineering at AMD.

He is responsible for silicon and packaging technology development and new product introduction engineering.

Fuselier has more than 27 years of semiconductor industry experience and has been involved in the development and production of process technology generations spanning from 35 micron through 3nm across multiple fabs and product families. He played a central role in the development and productization of computing solutions such as multi-core CPU and GPU SoC integration, heterogenous APUs, 2.5D and 3D chip-packaging, and chiplet System in Package (SiP) integration.

Fuselier holds a Master of Science degree in electrical engineering and Master of Business Administration from the University of Texas at Austin. He is a member of IEEE and the Electron Devices Society.

Company Profile


For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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