Yaojian Lin

Mr. Lin is VP Advanced Packaging at TF-AMD (Penang). He holds M.S. degree in Materials Science from University of Rochester (UR) at NY US,  M.S. degree in Composite Materials  from Shanghai Jiaotong University (SJTU), and B.S. degree in Metal Materials & Thermal Processing from Huazhong University of Science and Technology (HUST).  Prior to joining TF-AMD,  Mr. Lin worked as VP of R&D at JCET Group  for 7 years.  He also once worked at Shanghai Jiaotong University, Sychip (at Bell-Labs, Murray Hill, NJ), STATS ChipPAC (Singapore) at different R&D and Engineering positions . He has 30 years R&D and technology transfer experiences in materials and semiconductor packaging development, especially in IPD, Wafer Bumping, WLCSP, eWLB, 2.5D PKG, fcCSP, fcBGA, High Density SiP, and SiPh PKG. So far, he has over 200 US patents granted in the field of semiconductor advanced packaging, especially on Wafer Level Package.