Keynote Speaker
Dinesh Ramanathan, Ph.D.
Senior Vice President, Corporate Strategy
Powering the Future of EVs by Driving Power Density
Day 1 / 14:40 - 15:00
As the world moves towards global electrification, innovation on multiple fronts is required to create highly efficient EV systems. Innovations on control systems, modules for power stages, semiconductors, new materials for thermal management and operating systems at higher frequencies allow for EV systems to become more efficient.
In this talk, we will discuss new semiconductors that can switch high voltages at higher frequencies. The advantages of switching at higher frequencies translates to higher efficiency of the EV motor and inverter leading to lower costs for the EV. We will also discuss thermal management options for the power stages so we can push the existing semiconductors to deliver more power increasing the power density of the system.
Dinesh Ramanathan joined onsemi in May 2023 and currently serves as senior vice president for corporate strategy, responsible for driving our strategy development and annual strategic planning initiatives.
He has been in the hardware industry for 25 years, designing semiconductor devices software and systems. He is experienced in transforming commodity device businesses to proprietary, software defined device businesses with higher gross margins and larger addressable markets.
Before joining onsemi Dinesh focused on vertical gallium nitride (GaN) technology and products; co-founding NexGen Power Systems in 2017. He successfully secured over $100M in funding for a state-of-the-art GaN manufacturing facility where NexGen created the first manufacturable, cost competitive vertical GaN transistors, enabling the business to address a $6B power semiconductor market. Prior to that, Dinesh was CEO and president of Avogy Inc., and was executive vice president at Cypress Semiconductors for over 9 years.
Dinesh holds a Ph.D. in Information and Computer Science from the University of California, Irvine, as well as a Bachelor of Engineering in Computer Science and a Master of Science in Mathematics from BITS, Pilani, India.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Speaker
Wei Liu
Vice President of Infineon’s Power & Sensor Systems Division for Greater China and General Manager of Infineon Shenzhen
Day 2 / 09:55 - 10:15
Data Center Power 数据中心电源
Infineon 英飞凌
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Speaker
Tzu Kun Ku, Ph.D.
VP of Process Technology Development, CPO
The evolution of SiC MOSFET technology
Day 1 / 12:00 - 12:20
Silicon Carbide (SiC)-based devices are rapidly emerging as a transformative force in power electronics, with growing adoption across sectors such as automotive, photovoltaics (PV), energy storage, and uninterruptible power supplies (UPS). The paradigm shift from traditional silicon-based devices (IGBTs and MOSFETs) to SiC MOSFETs is largely driven by the superior figure-of-merit (FOM) of SiC materials, enabling higher efficiency, faster switching, and better thermal performance.
For decades, planar MOSFETs have been the mainstream choice for discrete SiC power devices due to their simplified structure, mature fabrication processes and proven reliability. As SiC process technology has advanced, the specific on-resistance (Ron,sp = Ron × A) has been continuously reduced by shrinking the cell pitch, thereby increasing the number of effective cells within a fixed die area. Today, commercial SiC MOSFETs feature cell pitches below 4.0 µm, approaching the scaling limits of planar MOS structures due to: intrinsic JFET resistance and difficulty of feature size scaling. The industry now faces a critical decision point: Continue pushing the limits of planar MOSFETs, or transition to trench MOSFET architectures. While trench MOSFETs introduce challenges such as: Elevated electric fields at the trench bottom, raising reliability concerns and more complex process integration. They also offer compelling advantages: higher channel mobility and reduced JFET resistance. These benefits make trench MOSFETs an attractive successor from the perspective of planar MOSFET manufacturers seeking performance gains.
In this presentation, we will review the evolution of SiC MOSFET technology, highlighting:
• Technological advancements in planar MOSFETs
• Emerging perspectives on trench MOSFET architectures
• Insights from ongoing R&D activities at Hunan Sanan Semiconductor, aimed at overcoming scaling barriers and unlocking the next generation of high-performance SiC power devices.
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape and Compliance Practices in the Automotive Chip Industry
车规级芯片产业的全球格局与合规实践
Over 29 years R&D and Manufacture experience in semiconductor process & device technologies including wide bandgap power electronics, advanced Si CMOS， More than Moore technologies and 3D TSV stack packaging.
Company Profile
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
Speaker
Prof. Shaojun Wei
Professor
Welcome Speech
Day 1 / 09:00 - 09:05
Dr. Shaojun Wei is the professor of Tsinghua University; Member of the National Integrated Circuit Industry Development Advisory Committee; Vice President of China Semiconductor Industry Association (CSIA) and President of Fabless Chapter CSIA. Dr. Wei was the President & CEO of Datang Telecom Technology Co., Ltd. and the CTO of Datang Telecom Industry Group between 2001-2006.
Dr. Wei has been working on VLSI design methodologies research and reconfigurable computing technology research. He has published more than 200 peer-reviewed papers and 6 monographs. He owns more than 130 patents, including 18 US patents. Dr. Wei is the IEEE Fellow, the Fellow of Chinese Institute of Electronics (CIE), the Fellow of Asia-Pacific AI Association, and the academician of the International Eurasian Academy of Science (IEAS).
Dr. Wei had won many awards including China National Second Award for Technology Invention (2015), China National Second Award for Technology Progress (2001), SIPO & WIPO Patent Golden Award (2003, 2015), First Award for Science and Technology of Ministry of Education (2014, 2019), China, First Award for Technology Invention of CIE (2012, 2017, 2020), EETimes China IC Design Achievement Award (2018), Aspencore Outstanding Contribution Award of the Year/Global Electronic Achievement Awards (2018), SEMI Special Contribution Award (2019) and IEEE CAS Industrial Pioneer Award (2020).
魏少军，现任清华大学教授，国际电气和电子工程师协会会士（IEEE Fellow），中国电子学会会士（CIE Fellow），亚太人工智能学会会士（AAIA Fellow），国际欧亚科学院院士，国家集成电路产业发展咨询委员会委员，北京超弦存储器研究院院长。曾任“核高基”国家科技重大专项技术总师，八六三计划微电子与光电子主题召集人，大唐微电子技术有限公司总经理/董事长、大唐电信科技股份有限公司总裁兼首席执行官、大唐电信科技产业集团总工程师。
魏少军长期致力于超大规模集成电路设计方法学的研究、可重构计算架构研究和通信专用集成电路技术研究，发表学术论文近 300 篇，出版专著 5 册，先后获得国家科技进步二等奖、国家技术发明二等奖、教育部技术发明一等奖（2项）、中国电子学会技术发明一等奖（4 项），国家知识产
权局和世界知识产权组织中国专利金奖（2 项）、国际半导体产业协会（SEMI）突出贡献奖、第五届世界互联网大会全球领先科技成果等。2020 年 5 月，获 IEEE 电路与系统协会产业先驱奖，旨在表彰他为当代计算机和通信系统智能芯片和电子身份证芯片的设计实现和批量生产所做出的开拓性
贡献。魏少军曾获全国五一劳动奖章，中国科协求是青年奖，享受国务院特殊津贴，是百千万人才工程国家级人选.
Company Profile
The campus of Tsinghua University is situated in northwest Beijing on the site of the former imperial gardens of the Qing Dynasty, and surrounded by a number of historical sites.
Tsinghua University was established in 1911, originally under the name “Tsinghua Xuetang”. The school was renamed “Tsinghua School” in 1912. The university section was founded in 1925. The name “National Tsinghua University” was adopted in 1928.
The faculty greatly valued the interaction between Chinese and Western cultures, the sciences and humanities, the ancient and modern. Tsinghua scholars Wang Guowei, Liang Qichao, Chen Yinque and Zhao Yuanren, renowned as the “Four Tutors” in the Institute of Chinese Classics, advocated this belief and had a profound impact on Tsinghua’s later development.
Tsinghua University was forced to move to Kunming and join with Peking University and Nankai University to form the Southwest Associated University due to the Resistance War against the Japanese Invasion in 1937. In 1946 The University was moved back to its original location in Beijing after the war.
After the founding of the People’s Republic of China, the University was molded into a polytechnic institute focusing on engineering in the nationwide restructuring of universities and colleges undertaken in 1952. In November 1952, Mr. Jiang Nanxiang became the President of the University. He made significant contributions in leading Tsinghua to become the national center for training engineers and scientists with both professional proficiency and personal integrity.
Since China opened up to the world in 1978, Tsinghua University has developed at a breathtaking pace into a comprehensive research university. At present, the university has 20 schools and 59 departments with faculties in science, engineering, humanities, law, medicine, history, philosophy, economics, management, education and art.
With the motto of “Self-Discipline and Social Commitment” and the spirit of “Actions Speak Louder than Words”, Tsinghua University is dedicated to the well-being of Chinese society and to world development. As one of China’s most prestigious and influential universities, Tsinghua is committed to cultivating global citizens who will thrive in today’s world and become tomorrow’s leaders. Through the pursuit of education and research at the highest level of excellence, Tsinghua is developing innovative solutions that will help solve pressing problems in China and the world.
Speaker
Francesco Muggeri
VP Marketing & Applications, Power Discrete & Analog, China
Driving Innovation and Ensuring Competitiveness in GaN & SiC
Day 1 / 14:15 - 14:35
Francesco Muggeri is Vice President, Power Discrete and Analog Products China at STMicroelectronics. In his role, Francesco leads ST’s Industrial Focused Competence Centers including the Motor Control Competence Center, Power & Energy Competence Center and Automation Competence Center in Asia and coordinates ST’s global Mass Market Industrial Task Force, with regards to consumer segment. He has been further appointed Industrial Power and Energy Segment Global Leader in July 2024. In recognition of his contribution to the electronics industry, Muggeri was awarded the 2023 Asia Executive of the Year by EETimes and EDN from Aspencore.
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Speaker
Bruno Schuster
Director Power Semiconductors – Regional business development Asia Pacific
Bosch advanced SiC chips and modules – Green engine to boost China EV development
Day 1 / 11:35 - 11:55
Bosch, as worldwide leading automotive Tier 1, is also providing SiC trench technology to support the EV ramp-up in China.
Since 2021 Bosch successfully achieved serial launch of automotive level SiC MOSFETS at the Chinese leading OEM customers.
Based on the patented trench technology, so far Bosch delivered over 42 Mio. pieces high quality and high performance SiC chips to the automotive market.
Starting from 2025, Bosch mastered the transition to 8-inch manufacturing, providing scaled capacity to support Chinese EV customers’ demand expansion.
In a nutshell, Bosch Semiconductors provides a holistic power semiconductor portfolio to the customers, offering chips, discretes and power modules.
Work Experience
- Robert Bosch GmbH Mobility Electronics 07/2025- present Director Power Semiconductors – Regional business development Asia Pacific
- Robert Bosch GmbH Mobility Electronics 06/2020-06/2025 Director Head of Product Area Power Semiconductors External
- Robert Bosch GmbH Powertrain Solutions 02/2017- 05/2020 Product Manager Power Electronics
- Bosch Automotive Diesel Systems Co. Ltd. 05/2012-01/2017 Senior Manager Sales Controlling & Pricing and PMO
- Robert Bosch GmbH Gasoline Systems 10/2008-04/2012 Customer Project Manager – Engineering
- Robert Bosch GmbH Diesel Systems 10/2005-09/2008 Project Manager Sales and Application
- Berata GmbH 05/2004 – 09/2005 Business Unit Manager Engineering Consulting
- Berata GmbH 02/2003 – 04/2004 Engineering Consultant
Education
- Project Management 10/2014 – 09/2015 Project Management Professional (PMP®)Project Management Institute (PMI)
- Post graduate study 09/2001 – 08/2002 Master of Business Engineering (MBE) –General Management Steinbeis University Berlin
- Study 10/1995 – 08/2001 Mechanical Engineering (Dipl.-Ing.) University of Karlsruhe (TH)
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Speaker
Tobias Keller
Vice President, Head of global Product Mgt., Portfolio & Marketing
Power Semiconductors – The silent Heroes of the future power grid
Day 1 / 16:30 - 16:50
Power semiconductors are the unsung enablers of the energy transition. As the backbone of efficient energy conversion and control, they ensure stability, scalability, and sustainability in tomorrow’s power grids. From integrating renewables to managing smart loads and enabling bidirectional energy flow, these components silently drive innovation and resilience in modern energy systems—making them indispensable to a carbon-neutral future.
Tobias Keller graduated from University of applied science Aargau with a degree in power electronics, thermodynamics and el. machines. He joined ABB’s Excitation and Synchronizing business. He was the Vice President global Products and Marketing. Afterwards he held the Vice President position for Vehicle Integration Engineering in ABB’s traction business. Since 2019, he is the Vice President global Product Management, Portfolio & Marketing in Hitachi Energy Semiconductor. Tobias Keller is a senior member of IEEE.
Company Profile
We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.
Speaker
Gary Huang
Corporate VP, Asia
Innovations in Power Electronics for xEV and Data Center Applications: The Evolving Roles of Silicon, SiC, and GaN
Day 1 / 17:50 - 18:10
xEV 与数据中心应用中的电力电子创新：硅、碳化硅与氮化镓的角色演进
The global push for electrification and digitalization is accelerating innovation in power electronics, especially in two critical sectors: electric and hybrid electric vehicles (xEVs) and data centers. This presentation explores the latest technological trends and market dynamics shaping the future of power devices in these applications, with a special focus on the evolving roles of Silicon, Silicon Carbide (SiC), and Gallium Nitride (GaN) semiconductor technologies.
In the xEV domain, sustainability goals and electrification trends are driving long-term growth, with the market expected to reach 64.3 million vehicles by 2030. The corresponding power device market is projected to reach nearly $14.9 billion, fueled by the trend toward full vehicle electrification and the increased adoption of Wide Bandgap (WBG) technologies and high-voltage architectures such as 800V and the emerging 1,000V systems. These platforms are being accelerated by advances in SiC technology, reduced substrate costs, and expanded high-power charging infrastructure. SiC’s superior efficiency, thermal performance, and compactness are key enablers of higher power density, longer driving range, and smaller system footprints—particularly in traction inverters for BEVs. Chinese OEMs are leading this shift through the aggressive integration of SiC. PHEVs, currently still almost exclusively based on IGBTs, are also beginning to adopt SiC in their main inverters as battery capacities increase. Silicon devices remain the technology of choice primarily for hybrid electric vehicles and low-power electric vehicles. GaN remains a promising contender in xEVs, with potential deployment in onboard chargers and DC-DC converters—and, in the longer term, in main inverters—though its adoption is hindered by cost, supply chain, and technology challenges.In data centers, the surge in AI workloads has triggered an urgent need for higher-efficiency power conversion. Power Supply Units (PSUs) are central to this transformation, with the market expected to grow at a 15.5% CAGR, reaching $14.1 billion by 2030. The introduction of the 80 PLUS Ruby certification sets a new efficiency benchmark, demanding up to 96.5% efficiency at 50% load. To meet such stringent targets and rising power densities—now exceeding 100 W/in³—PSU designers are rapidly adopting WBG semiconductors. SiC and GaN together are expected to account for 24% of PSU power device shipments by 2030.
Hybrid designs combining Si, SiC, and GaN in optimized topologies are emerging as the new standard. Infineon’s new 400V SiC class targets three-level PSU topologies to further push efficiency boundaries. These innovations are key to addressing the dual challenges of energy efficiency and power scalability in future AI-driven data centers.
Company Profile
Yole Group is a leading international market research and strategy consulting firm, delivering in-depth analyses across market trends, technology developments, teardowns, and reverse costing. Leveraging deep semiconductor expertise, its team of analysts also provides custom consulting services, offering strategic, technical, and market insights tailored to address specific business challenges and opportunities.
Speaker
Hidenori Abe
CTO for semiconductor materials, Resonac Holdings Corporation & Executive director, Electronics Business Headquarters, Resonac Corporation
Advanced Packaging Materials Innovation through Co-creative Activities
Day 2 / 15:35 - 15:55
In the semiconductor field that supports the evolution of generative AI, innovative packaging technology is attracting increasing attention.
Resonac, a co-creation chemical company, has established a Packaging Solution Center to provide one-stop solutions for its customers,
and has launched the evaluation platform “JOINT2” together with materials, substrate, and equipment manufacturers to accelerate the development of cutting-edge packaging technologies.
In this presentation, we will discuss trends in advanced packaging materials and the latest technologies related to panel interposers. We will also highlight the value and material innovations generated through co-creation activities.
Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.
Company Profile
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
Speaker
Johnny Guo
Director, Solutions
Renesas Automotive X-in-1 System Solution and Technology Driven by GaN
Day 1 / 16:50 - 17:10
The “X-in-1” approach in Electric Vehicles (EVs) refers to the integration of multiple essential components of the vehicle into a single, unified system or module. Renesas has created a reference design with all Renesas portfolios to show the system value of electronics integration. Diverse portfolios include MCU, PMIC, HV GaN, LV MOSFET, GDU, DC/DC converters, which can enable the entire system from a solution perspective, ensuring high efficiency and reliability. HV GaN adoption and new technology trend with bi-directional GaN is also under implementation in the system solution to show the benefit from system solution view.
Johnny is currently the Director of Solutions at Renesas Electronics, where he is contributing the focused effort that the Company is dedicating to business growth with system solution building across Industrial, Automotive and IoT market segments, with expanded portfolios of Embedded Processor, High Performance Computing, Power, Analog and Connectivity, able to lead a dedicated team focus on activities of global and regional market analysis, technology revolution trend understanding and system solution roadmap creation based on market and customer demand from each end-equipment level, as well as to formulate global and regional go-to-market strategy.
Company Profile
Renesas Electronics empowers a safer, smarter and more sustainable future where technology helps make our lives easier.
A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
Speaker
Elpin Goh
Senior Director, Strategic Marketing, CSBG
Day 1 / 17:15 - 17:25
Elpin Goh is Senior Director of Specialty Technologies Business Development at Lam Research. She is responsible for business strategy development and planning in Specialty Technologies in APAC region. She works with various Lam product owners to define product strategy and drive innovative product solutions in Specialty Technologies.
Prior to this, Elpin focused on the sales account management in Lam SEA. Elpin’s experience includes process integration, product management, sales and business development in the foundry and semiconductor equipment industry. She started her career as a process integration engineer at GlobalFoundries where she held various positions in process integration, customer engineering, product management and business development.
Elpin received a Master’s degree in Electrical Engineering from National University of Singapore, Singapore. She also holds a Bachelor’s degree from University of Manchester Institute of Science and Technology, UK.
Company Profile
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Speaker
Irene Deng
SVP
Small Components, Big Impact: From Power to Signal Integrity for AI Servers by Nexperia
Day 2 / 11:40 - 12:00
AI servers demand unprecedented levels of power efficiency, thermal resilience, and high-speed signal integrity – challenges that hinge on the performance of small but mission-critical components. In this presentation, I will show cases of Nexperia’s current portfolio and coming sampling Power Management ICs, Signal Interfacing iCs, advanced packaging technologies to ultra-low-loss power discrete and high-speed ESD protections that enables next-generation AI hardware. We explore Power Delivery, Signal Integrity, and System reliability. We’ll demonstrate component choices can reduce system bottlenecks, improve energy efficiency, and extend the lifespan of AI server platforms.
Panel Discussion 圆桌讨论
Day 2 / 13:45 - 14:30
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
Irene Deng serves as General Manager for IC Solutions division at Nexperia, placing her among the company’s executive leadership as SVP. She is the central figure driving Nexperia’s expansion to analog and power ICs. Anchored globally in China, Europe, US, and rest of Asia areas, she’s guiding broader strategy to diversify Nexperia’s offerings beyond its traditional discrete devices toward high-value integrated circuits and high-power products. Since 2023, IC Solutions division has been releasing over triple digit new products annually in various product categories of Power IC, Isolation, Interfacing, Voltage Translators, Signal Path, and Standard Logic.
Company Profile
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
Speaker
Henryk Dabrowski
SVP of Global Sales
Day 2 / 11:15 - 11:35
Company Profile
A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.
Operating at a market worth exceeding $30 billion, CGD completed several funding rounds to develop and deliver to the market a wide range of products for consumer and industrial applications.
In autumn 2021, the company was named Tech Scaleup of the Year by Business Weekly in the category of green electronics and was awarded the UK Business Angels Association (UKBAA) deep tech Investment of the Year.
Speaker
Jun Shi, Ph.D.
Power Module Division Deputy General Manager
Technological development and application, challenges and future trends of SiC power devices
Day 1 / 15:05 - 15:25
This article introduces the current development status and applications of SiC devices, especially in popular fields, the various problems faced by SiC devices, especially the reliability issue of SiC devices. Finally, the author provides the future and prospects of SiC devices, as well as the progress made by Yangjie Technology in SiC devices.
From 1995 to 2005, studied at Zhejiang University and obtained bachelor’s and doctoral degrees. In 2005, was an academic visitor at the University of Sheffield in the United Kingdom; Subsequently, I was employed as a senior engineer at Siemens (China) Research Institute for the next 5 years, focusing on power electronics technology and its applications in the new energy industry. I have experienced several major power electronics related projects and achieved world leading technology. 3 years of entrepreneurial experience, focusing on the design and development of photovoltaic inverter products. Led a team to develop the 500KW photovoltaic inverter with the highest power density at that time. In 2012, selected as a “double innovation” entrepreneurial talent in Jiangsu Province; I started working at Infineon Technologies for 8 years in 2013 and worked at State Grid subsidiary company Nari Semiconductor for 4 years, focusing on the development and application of power devices (IGBT, SiC) products themselves. I have developed more than 30 IGBT and SiC power devices, which have been widely used in wind power, photovoltaics, energy storage, charging piles, electric vehicles, industrial power supply and other fields. I was selected for the “Purple Mountain Talent Plan High level Innovation and Entrepreneurship Talent Project” in 2023; The current Vice General Manager of Yangjie Technology’s Power Device Division is responsible for the product development, application, and market promotion of power devices such as IGBT and SiC. I have obtained over 10 invention patents.
Company Profile
Yangzhou Yangjie Electronic Technology Co., Ltd. is one of China’s leading vertically integrated (IDM) semiconductor enterprises, covering the entire industrial chain from the design and manufacturing of discrete semiconductor chips to device packaging and testing, as well as end-user sales and services. The company offers a comprehensive product portfolio, including discrete device chips, MOSFETs, IGBTs and power modules, SiC devices, rectifiers, protection devices, and small signal products, providing customers with one-stop product solutions.
Yangjie Electronic’s products are widely used in various key fields, including automotive electronics, clean energy, industrial control, 5G communications, security, artificial intelligence (AI), and consumer electronics. Through continuous efforts in technological innovation and market service, the company is committed to meeting the diverse needs of customers worldwide.
The company was listed on the Shenzhen Stock Exchange on January 23, 2014, under the stock code 300373.
扬州扬杰电子科技股份有限公司是国内少数集半导体分立器件芯片设计制造、器件封装测试、终端销售与服务等产业链垂直一体化（IDM）的杰出厂商。产品线含盖分立器件芯片、MOSFET、IGBT&功率模块、SiC、整流器件、保护器件、小信号等，为客户提供一揽子产品解决方案。
公司产品广泛应用于汽车电子、清洁能源、工控、5G通讯、安防、AI、消费电子等诸多领域。
公司于2014年1月23日在深交所上市，证券代码300373，相信在您的关怀支持下，我们一定能够成为世界信赖的功率半导体伙伴。
Speaker
Gang Jung
Vice President
Day 2 / 14:55 - 15:15
Korean veteran Automotive Electronic Expert, Currently serving as GM of JCET Automotive BU. With over 23years of profound expertise at the world’s top semiconductor packaging & testing companies and leading global Tier1 suppliers, he processes extensive experience in R&D, supply chain optimization，quality management and OEM customer service. Mr. Jung Gang has consistently pursued the mission of being the “Global Automotive Industry’s Best Partner.” Through technological innovation and lean management, he continues to drive globalization in the smart mobility sector.
Company Profile
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
Speaker
KeDa Xu
Founder & CEO
eVTOL marketing trend 低空飞行器未来市场趋势
Day 2 / 09:30 - 09:50
Panel Discussion 圆桌讨论
Day 2 / 13:45 - 14:30
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
Mr. Xu Keda holds a master’s degree from Renmin University of China and brings over 20 years of experience from the General Armament Department.
He has deep insights into both the Chinese and global aviation engine markets, which allow him to set a clear strategic direction for the company and to navigate opportunities in today’s complex, fast-changing environment.
许可达，中国人民大学硕士毕业，曾在总装工作20余年，对中国乃至世界航空发动机市场 的现状、趋势有着深刻理解，清晰定位企业发展方向，助力企业在复杂多变的市场环境中把 握发展机遇。
Company Profile
Falcon Aerospace Power Group, founded in 2020, specializes in the research and development, production, sales, and maintenance of power systems for general aviation and low-altitude applications. The company has established an R&D center in Zhuzhou, Hunan, and a heavy-fuel piston engine assembly base in Zhuhai, Guangdong. As of June 2025, Falcon has been recognized as a “Specialized and Innovative Enterprise” in Sichuan Province and as a National High-Tech Enterprise, holding over 40 patents. With leading capabilities in engine technology development, the company has launched three product lines—piston engines, turboprops, and hybrid power systems—providing practical power solutions for various types of low-altitude aircraft.
Speaker
Heming Li
Product Marketing VP
Session info not yet published
李和明先生，浙江大学电气工程学院工学硕士，现任飞锃半导体产品市场VP。他在功率半导体相关领域拥有超过15年的经验，专注于新能源相关市场，具有丰富的碳化硅功率器件市场与应用经验，曾就职于英飞凌、意法半导体等国际半导体公司。
Company Profile
Alpha Power Solutions (APS) is China’s leading supplier of wide band gap power semiconductor devices. It is one of the pioneering companies in China to engage in the research and development of SiC devices and is the first to successfully use 6-inch SiC technologies , helping China make a breakthrough in this field.
APS adopts the CIDM strategy and has successfully deployed applications in leading domestic companies in the renew energy, photovoltaic energy storage, and EV-charging industries, providing them with Silicon carbide products and solutions for carbon neutrality.
SiC MOSFET, SiC Diode
Panel Moderator
Alan Zhou, Ph.D.
CEO, Shanghai
Panel Discussion 圆桌讨论
Day 2 / 17:00 - 17:45
Topic: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
投资与风险资本的关键作用 —— 驱动突破性技术，助力中国半导体生态发展
Dr. Alan Zhou has over 30 years of executive experience in multinational and startup companies within the semiconductor industry. Currently serving as the CEO of Shanghai Pixelworks Stock Limited Co. Formerly he was the CEO of BelGaN and Chairman of GaNcool. Before that, he was an Executive Vice President (EVP) of Pixelworks and the President of its China subsidiary, he was responsible for corporate restructuring, financing, acquisitions, and preparations for a STAR Market listing; He also served as the managing partner and Chief Strategy Officer (CTO) at the National IC Fund’s Fujian Anxin Capital, overseeing global investments and acquisitions for the third generation compound semiconductors; a Corporate Vice President at Qualcomm in charge of the smartphone chipset business worth over $3 billion; and a Managing Director at Lucent Technologies, where he led the development and design of China’s first local brand GSM mobile phone reference design and chipset. In 1998, he co-founded MEMSIC, a MEMS sensor company listed in NASDAQ around 2007; and in 1994, served as the General Manager of AT&T Bell Laboratories in Wuxi, managing the technology transfer and construction of China’s first sub-micron very large scale integrated circuit (VLSI) manufacturing Fab for the national 908 Project, which led to the establishment of CSMC went public in HongKong, then acquired by China Resources Group, now known as China Resources Microelectronics listed in the STAR exchange. Dr.Zhou graduated from MIT and earned a Master and Doctor degree in Microelectronics and Computer Science.
Company Profile
Pixelworks’ technology and solutions cover end to end, optimized video delivery that is true to its creator’s intent with a highly authentic viewing experience. Our innovations over two decades has resulted in a strong IP portfolio related to the visual display of digital image data. Our vision is that every screen, no matter how big or small, deserves the highest picture quality. This vision has driven us to develop technology that spans the range from digital projection systems and large flat panel displays to small, low power mobile devices such as smartphones. We also develop innovative methods to apply our core technologies to reduce overall system power and help reduce the bandwidth burden that comes with the display of HD and UHD video.
The relentless advancement of display technology and explosive growth of video consumption driven by digital delivery systems and mobile applications are increasing the necessity and demand for Video Display Processing technology. To meet this growing demand, we deliver our technology as IP cores, semiconductors, software and custom ASIC solutions. This flexible approach allows our customers to deliver the highest video quality in a multitude of applications and form factors while also providing the ability for end product differentiation. Our primary target markets include smartphones, tablets and digital projection systems.
We focus our investments on developing video enhancement solutions for Video Delivery, Mobile Devices and Projectors market segments, with particular attention to increasing performance, video quality, device functionality and saving power. Additionally, we look for ways to leverage our research and development investment into products that address other high-value markets where our innovative proprietary technology provides differentiation for us and our customers. We continually seek to expand our technology portfolio through internal development, co-development with business partners.
Panel Moderator
Joseph Chou
General Manager
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape and Compliance Practices in the Automotive Chip Industry
车规级芯片产业的全球格局与合规实践
Company Profile
POMME was established in 2015 and is located in Hsinchu, Taiwan. It is engaged in high-end wafer test integration and design services for the semiconductor industry, focusing on providing you with the most efficient wafer parameter test solutions. Such as IC Design house, foundry, IDM, testing company, assembly and packaging company, etc., to simplify work for engineers in different departments (such as: technology research and development, quality and reliability assurance, failure analysis, manufacturing, etc.). POMME can help turn all the measurement and analysis under numerous test results into a simple job, speeding up product throughput throughout semiconductor production.
POMME is the solution partner of Keysight Technologies, a world-renowned instrument manufacturer. With more than 16 years of long-term cooperation experience, POMME has developed into the only and most reliable partner of customers among semiconductor industry test integration system providers, with the most professional The technical team, adhering to the spirit of quality first and customer satisfaction, grows together with customers and employees.
Since its establishment, it has served the semiconductor industry chain in the Asia-Pacific region, with more than 300 customers. We use experienced teamwork to run your test work quickly and efficiently. We can provide test solutions that meet your unique needs every time.
POMME possesses the leading wide-bandgap semiconductor automotive electronic components and module test solution technology, and has officially become the exclusive distributor of ipTEST LTD. in the UK. It can provide a full range of measurement solutions more efficiently to meet your needs.
main products:
Power semiconductor wafers, chips, components, and power module testing solutions.
Electrical test probe station (manual/semi-automatic/automatic), all electrical test probe station standard/custom configuration.
Electrical test system upgrade/maintenance/calibration/expansion (HP/Agilent/HP/Keysight/Keithley).
OST (Entrusted Measurement)/WBG/Low Current/Reliability/Burn-In.
Panelist
Marcus Kneifel, Ph.D.
Sr. Vice President, Systems Engineering
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape and Compliance Practices in the Automotive Chip Industry
车规级芯片产业的全球格局与合规实践
Dr. Marcus Kneifel currently serves as senior vice president of systems engineering, responsible for delivering cutting-edge systems and executing best-in-class engineering practices to expand and support the automotive, industrial, AI and new emerging technologies in adjacent growth markets.Dr. Kneifel is a seasoned leader with deep industry knowledge and a proven track record, bringing valuable expertise into key target markets for the company.Before joining onsemi, Marcus was the Chief Technology Officer and Board Member at Preh Group, and the General Manager of Portfolio Management 800V BEV Power Electronics, Electrified Powertrain Technology at ZF Friedrichshafen. Prior to that, he spent more than 20 years at Robert Bosch, moving through the ranks to ultimately be the General Manager of Engineering Customer Projects, Driver Assistance Systems.He holds a master’s degree in electrical engineering from both the University of Applied Sciences Braunschweig and the University of Bremen, as well as a PhD. in Power Electronics from the University of Bremen.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Panelist
Jun Li
General Manager (FAE Head Quarter), Shanghai
Panel Discussion 圆桌讨论
Day 2 / 13:45 - 14:30
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
JUNLI joined ROHM in 2003, and have been in charge of ROHM China Technical Center for almost 20 years, including applications and promotions of ROHM semiconductors in consumers, automobile and industry.
Company Profile
ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.
Panelist
Wei Wenyuan
C-ASAM Secretary General
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape and Compliance Practices in the Automotive Chip Industry
车规级芯片产业的全球格局与合规实践
Company Profile
Panelist
Cynthia Zhang
Founder
Panel Discussion 圆桌讨论
Day 2 / 17:00 - 17:45
Topic: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
投资与风险资本的关键作用 —— 驱动突破性技术，助力中国半导体生态发展
Cynthia Zhang is the founder of FutureX Capital, a boutique all-stage fund focused on global high-tech and AI companies. Some of her notable portfolio includes Bytedance (TikTok), NIO (NYSE: NIO), Meituan (3690.HK), Xiaomi (1810.HK), and Kingsoft Cloud (NASDAQ: KC). She has been consistently recognized as one of the Top 50 Female Investors and Top Technology GP in China.
Prior to founding FutureX, Cynthia was the founder of the Private Equity Division at China Asset Management Company, one of the largest asset management firms in Asia.
Cynthia holds a bachelor’s degree in Computer Science from the National University of Singapore, an EMBA from Tsinghua University’s PBC School of Finance, and is an alumna of the Stanford Executive Program at Stanford Graduate School of Business.
Company Profile
FutureX Capital invests in visionary founders building transformative AI technologies across all stages. With $3B+ accumulated investment and deep roots in the US and China tech ecosystems, we’re positioned at the forefront of the next wave of innovation.
Panelist
Zhang Taizhi
Senior Engineer
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape and Compliance Practices in the Automotive Chip Industry
车规级芯片产业的全球格局与合规实践
2016–2020: Led power-hardware development for motor controllers, including power-module selection, chip junction-temperature estimation, discrete-pack development, and gate-driver and power-supply design; served as Senior Hardware Engineer in INOVANCE automotive.
2021–Present: Direct the development of automotive-grade power modules. Act as Technical Lead for Module Development in INOVANCE automotive.
Company Profile
Shenzhen Inovance Technology Co., Ltd. (stock code: SZ.300124) was founded in 2003 and has a market capitalization of about RMB 160Bn. Inovance is the key force in developing industrial automation and drive technologies in China, providing optical-mechatronics-hydraulic-pneumatic integrated solutions covering drive, control, motor, and precision machinery.
Headquartered in Shenzhen, Inovance has more than 20,000 employees and has established multiple production bases in Suzhou, Yueyang, Nanjing, Shanghai, Jinan, Jiaxing, Changchun, and Hungary, as well as having resident offices and service centers in over 30 countries and regions worldwide.
Panelist
Carsten Mohr
General Manager
Panel Discussion 圆桌讨论
Day 2 / 13:45 - 14:30
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
Carsten is Executive Vice President of the Metal Foils division at SCHLENK and supports CuNex in the same position. He is a mechanical engineer by training and has an extensive track record in the silver paste and copper fabricating industry.
Company Profile
CuNex offers copper sinter pastes and preforms for high-power electronics packaging (die attach, substrate attach, die topside attach). Our copper-based interconnect materials follow a low pressure and rapid sintering approach ensuring improved reliability and performance at a substantial cost advantage over silver sintering.
After 7 years of extensive research, CuNex launched the Cuprum series of sinter pastes and CuForm sinter preforms. The copper pastes and preforms are suitable for Si, SiC and GaN devices as well as high power LEDs.
Specialized engineering solutions also allow for sinter lamination of substrates and die attach supporting embedded chip technologies.
The product development and volume manufacturing are driven by SCHLENK with a history of 150 years in copper and copper alloys.
The Cuprum pastes and CuForm preforms have class leading features:
– Low cost
– Fast drying in air
– Low sintering temperature and pressure
– Rapid sintering process
– High thermal conductivity
– Flexibility on die size and standard metallizations
– No nanoparticles
– Storage at room temperature for up to 6 months
Panelist
Leon(Yenan) Wu, Ph.D.
Founding Partner & CEO
Panel Discussion 圆桌讨论
Day 2 / 17:00 - 17:45
Topic: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
投资与风险资本的关键作用 —— 驱动突破性技术，助力中国半导体生态发展
- Master’s degree from Xi’an Jiaotong University
- PhD from the School of Integrated Circuits, Tsinghua University
- With a background in Electronic Engineering, he has served as a member of the investment committee for integrated circuit and related industry funds under well-known large central enterprises such as Yizhuang Holding Co., Ltd., achieving remarkable investment performance
Company Profile
Xi’an Longding Investment Management Co., Ltd. (referred to as “Longding”) was established in 2014. It is a high-end investment management company focused on the needs of national development, with “finance” and “industry” as the core drivers, focusing on hard technology tracks such as semiconductors, new energy, and information technology.
西安龙鼎投资管理有限公司（简称“龙鼎投资”）成立于2014年，是一家以国家发展需求为核心导向，以“金融”+“产业”为核心引擎，专注半导 体、新能源、信息技术等硬科技赛道的精品投资管理公司。
Panelist
Wilson Hong
Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering
Welcome speech by Day 2 moderator
Day 2 / 09:00 - 09:05
Closing speech by moderator
Day 2 / 17:45 - 17:55
Panel Discussion 圆桌讨论
Day 2 / 13:45 - 14:30
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
Company Profile
NIO is a global smart electric vehicle company. Founded in 2014, NIO has been committed to shaping a joyful lifestyle by offering high-performance smart electric vehicles and ultimate experience. NIO is the first car company listed on the NYSE, HKSE and SGX. NIO currently has two major brands under its umbrella: NIO and ONVO. Nine years into establishment, NIO is one of the leading companies in the global premium smart electric vehicle market.
Moderator
Tong Wu, Ph.D.
Leader of Auto Marketing and Technical Team, Principal Expert, SiC Applications
Moderator:
Day 1 / 10:07 -
I.S.I.G. China Regional President
Closing Speech
Day 1 / 18:10 - 18:20
吴桐，安森美（onsemi）中国区汽车市场负责人，上海交通大学半导体物理专业，数学专业辅修本科毕业，美国田纳西大学电气工程博士学位。吴博士在半导体封装，碳化硅设计应用方面拥有 10 余年的研发和工业经验。 目前在安森美负责中国区汽车技术与市场，覆盖产品设计，制造，市场及应用，了解新能源行业的市场、供应链、开发流程以及解决方案。与国内多家车厂、Tier 1 保持着深度合作以及技术支持。曾就职于美国田纳西州橡树岭橡树岭国家实验室（ORNL），以及车厂研发团队，共在国际会议和期刊上发表了 40 多篇论文，同时获得了多项 半导体方面的美国专利。
Dr. Tong Wu is onsemi SiC Expert & Leader of China Auto Marketing & Technical Team, responsible for developing the SiC market in China, as well as providing technical support for car OEMs and Tier1s, and participating in multiple NPIs. He has more than 10 years of R&D and industrial experience in wide band-gap devices and its applications. Prior to joining onsemi, Dr. Wu conducted his research at Oak Ridge National Laboratory(ORNL) for multiple DOE-funded SiC-related projects.
Dr. Wu received his B.S. degree from Shanghai Jiao Tong University, majoring in semiconductor physics and minoring in mathematics. Dr. Wu received his Ph.D. in Power Electronics from the University of Tennessee, USA. He conducted his doctoral research at the Power Electronics and Electric Machinery Research Center of Oak Ridge National Laboratory(ORNL). Dr. Wu has authored/co-authored more than 40 papers in international conferences and journals and awarded several U.S. patents in SiC area.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Speaker
Gerald Yin, Ph.D.
Chairman and CEO
Welcome and Product speech
Day 1 / 09:05 - 09:20
Company Profile
Advanced Micro-Fabrication Equipment Inc. China (AMEC, stock code: 688012) is an innovative Asia-based semiconductor equipment company with a range of proprietary fabrication solutions designed to advance technology, increase productivity, and reduce manufacturing costs for leading global manufacturers of semiconductors and LEDs. Headquartered in Shanghai, the company is an entrenched supplier of dielectric and TSV etch tools, helping chipmakers build devices at process nodes as low as 5nm and beyond. In addition, AMEC’s MOCVD system has become a market leader in China for producers of LEDs and power devices. AMEC products are used today by technology leaders in Chinese mainland and Taiwan region, as well as Singapore, Korea, Germany, Italy and so on.
Speaker
Salah Nasri
CEO and Co-Founder
I.S.I.G. 15th Year Anniversary Panel Discussion I.S.I.G. 15周年特别企划
Day 1 / 09:20 - 10:05
Topic: Chinese Enterprises Going to Middle East 中国企业出海中东战略
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Panelist
Liu Yongshun
Senior Chief Engineer of Chips
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape and Compliance Practices in the Automotive Chip Industry
车规级芯片产业的全球格局与合规实践
Company Profile
Speaker
Marcus Lang
CTO
Day 2 / 15:20 - 15:30
Company Profile
Panel Moderator
Onto Innovation
Session info not yet published
Company Profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
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