Keynote Speaker
Dinesh Ramanathan, Ph.D.
Senior Vice President, Corporate Strategy
Powering the Future of EVs by Driving Power Density
Day 1 / 14:40 - 15:00
以功率密度提升，驱动电动汽车的未来发展
As the world moves towards global electrification, innovation on multiple fronts is required to create highly efficient EV systems. Innovations on control systems, modules for power stages, semiconductors, new materials for thermal management and operating systems at higher frequencies allow for EV systems to become more efficient.
In this talk, we will discuss new semiconductors that can switch high voltages at higher frequencies. The advantages of switching at higher frequencies translates to higher efficiency of the EV motor and inverter leading to lower costs for the EV. We will also discuss thermal management options for the power stages so we can push the existing semiconductors to deliver more power increasing the power density of the system.
Dinesh Ramanathan joined onsemi in May 2023 and currently serves as senior vice president for corporate strategy, responsible for driving our strategy development and annual strategic planning initiatives.
He has been in the hardware industry for 25 years, designing semiconductor devices software and systems. He is experienced in transforming commodity device businesses to proprietary, software defined device businesses with higher gross margins and larger addressable markets.
Before joining onsemi Dinesh focused on vertical gallium nitride (GaN) technology and products; co-founding NexGen Power Systems in 2017. He successfully secured over $100M in funding for a state-of-the-art GaN manufacturing facility where NexGen created the first manufacturable, cost competitive vertical GaN transistors, enabling the business to address a $6B power semiconductor market. Prior to that, Dinesh was CEO and president of Avogy Inc., and was executive vice president at Cypress Semiconductors for over 9 years.
Dinesh holds a Ph.D. in Information and Computer Science from the University of California, Irvine, as well as a Bachelor of Engineering in Computer Science and a Master of Science in Mathematics from BITS, Pilani, India.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Keynote Speaker
Francesco Muggeri
Vice President, Power Discrete and Analog Products China
Driving Innovation and Ensuring Competitiveness in GaN & SiC
Day 1 / 14:15 - 14:35
以创新赋能 GaN 与 SiC 发展，筑牢产业竞争优势
Francesco Muggeri is Vice President, Power Discrete and Analog Products China at STMicroelectronics. In his role, Francesco leads ST’s Industrial Focused Competence Centers including the Motor Control Competence Center, Power & Energy Competence Center and Automation Competence Center in Asia and coordinates ST’s global Mass Market Industrial Task Force, with regards to consumer segment. He has been further appointed Industrial Power and Energy Segment Global Leader in July 2024. In recognition of his contribution to the electronics industry, Muggeri was awarded the 2023 Asia Executive of the Year by EETimes and EDN from Aspencore.
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Keynote Speaker
Tzu Kun Ku, Ph.D.
VP of Process Technology Development, CPO
The evolution of SiC MOSFET technology
Day 1 / 11:55 - 12:15
碳化硅 MOSFET 技术的演进路径与突破
Silicon Carbide (SiC)-based devices are rapidly emerging as a transformative force in power electronics, with growing adoption across sectors such as automotive, photovoltaics (PV), energy storage, and uninterruptible power supplies (UPS). The paradigm shift from traditional silicon-based devices (IGBTs and MOSFETs) to SiC MOSFETs is largely driven by the superior figure-of-merit (FOM) of SiC materials, enabling higher efficiency, faster switching, and better thermal performance.
For decades, planar MOSFETs have been the mainstream choice for discrete SiC power devices due to their simplified structure, mature fabrication processes and proven reliability. As SiC process technology has advanced, the specific on-resistance (Ron,sp = Ron × A) has been continuously reduced by shrinking the cell pitch, thereby increasing the number of effective cells within a fixed die area. Today, commercial SiC MOSFETs feature cell pitches below 4.0 µm, approaching the scaling limits of planar MOS structures due to: intrinsic JFET resistance and difficulty of feature size scaling. The industry now faces a critical decision point: Continue pushing the limits of planar MOSFETs, or transition to trench MOSFET architectures. While trench MOSFETs introduce challenges such as: Elevated electric fields at the trench bottom, raising reliability concerns and more complex process integration. They also offer compelling advantages: higher channel mobility and reduced JFET resistance. These benefits make trench MOSFETs an attractive successor from the perspective of planar MOSFET manufacturers seeking performance gains.
In this presentation, we will review the evolution of SiC MOSFET technology, highlighting:
• Technological advancements in planar MOSFETs
• Emerging perspectives on trench MOSFET architectures
• Insights from ongoing R&D activities at Hunan Sanan Semiconductor, aimed at overcoming scaling barriers and unlocking the next generation of high-performance SiC power devices.
Dr. Ku brings over 29 years of experience in R&D and manufacturing across a broad spectrum of semiconductor device and process technologies. His expertise spans:
• Wide-bandgap power electronics, including SiC and GaN devices
•Advanced silicon CMOS technologies
•Next-generation non-volatile memory, such as MRAM and RRAM
•3D TSV packaging
Currently, Dr. Ku leads the SiC and GaN on Si process technology R&D teams at Hunan Sanan Semiconductor, driving breakthroughs in high-performance power electronic devices.
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
Keynote Speaker
Wei Liu
VP, Infineon Technologies, Marketing Head of Consumer, Computing & Communication, Infineon Technologies Greater China, Site Head for Infineon Shenzhen
Powering AI Today and Tomorrow: Innovations in Power Conversion Solutions
Day 2 / 09:55 - 10:15
赋能当下与未来的人工智能：功率转换解决方案的创新
Data Center Power 数据中心电源
Mr. Liu Wei is Vice President of Infineon’s Power & Sensor Systems Division for Greater China and General Manager of Infineon Shenzhen. With over 20 years of experience in the semiconductor industry, he has a strong background in chip development, marketing, and business strategy. Since joining Infineon in 2021, he has led regional marketing for power ICs, power semiconductors, and sensors. In 2023, he was appointed General Manager of Infineon Shenzhen. Prior to Infineon, Mr. Liu held key leadership roles at Texas Instruments. He holds engineering degrees from Huazhong University of Science and Technology and North Carolina State University.
刘伟
英飞凌电源与传感系统事业部大中华区副总裁
英飞凌深圳总经理
刘伟先生目前担任英飞凌电源与传感系统事业部大中华区副总裁暨英飞凌深圳总经理，负责英飞凌电源与传感系统事业部在大中华区的市场管理事务及英飞凌深圳公司的日常管理。
刘伟先生拥有半导体领域20年的深厚经验，涵盖芯片产品研发、市场营销及推广。2021年，刘伟先生加入英飞凌，担任电源与传感系统事业部大中华区市场副总裁，负责电源芯片、功率半导体器件以及传感器等在大中华区的应用及产品市场营销策略。2023年10月，刘伟先生升任英飞凌深圳总经理。加入英飞凌前，刘伟先生曾就职于德州仪器负责产品线研发和运营管理，历任电源管理芯片系统开发经理、市场总监、产品线总经理等职务。
刘伟先生拥有华中科技大学电子工程学士学位及美国北卡罗莱纳州立大学电子工程硕士学位。
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Keynote Speaker
Bruno Schuster
Director Power Semiconductors – Regional business development Asia Pacific
Bosch advanced SiC chips and modules – Green engine to boost China EV development
Day 1 / 11:30 - 11:50
博世先进碳化硅（SiC）芯片与模块：赋能中国电动汽车产业的绿色驱动力
Bosch, as worldwide leading automotive Tier 1, is also providing SiC trench technology to support the EV ramp-up in China.
Since 2021 Bosch successfully achieved serial launch of automotive level SiC MOSFETS at the Chinese leading OEM customers.
Based on the patented trench technology, so far Bosch delivered over 42 Mio. pieces high quality and high performance SiC chips to the automotive market.
Starting from 2025, Bosch mastered the transition to 8-inch manufacturing, providing scaled capacity to support Chinese EV customers’ demand expansion.
In a nutshell, Bosch Semiconductors provides a holistic power semiconductor portfolio to the customers, offering chips, discretes and power modules.
Work Experience
- Robert Bosch GmbH Mobility Electronics 07/2025- present Director Power Semiconductors – Regional business development Asia Pacific
- Robert Bosch GmbH Mobility Electronics 06/2020-06/2025 Director Head of Product Area Power Semiconductors External
- Robert Bosch GmbH Powertrain Solutions 02/2017- 05/2020 Product Manager Power Electronics
- Bosch Automotive Diesel Systems Co. Ltd. 05/2012-01/2017 Senior Manager Sales Controlling & Pricing and PMO
- Robert Bosch GmbH Gasoline Systems 10/2008-04/2012 Customer Project Manager – Engineering
- Robert Bosch GmbH Diesel Systems 10/2005-09/2008 Project Manager Sales and Application
- Berata GmbH 05/2004 – 09/2005 Business Unit Manager Engineering Consulting
- Berata GmbH 02/2003 – 04/2004 Engineering Consultant
Education
- Project Management 10/2014 – 09/2015 Project Management Professional (PMP®)Project Management Institute (PMI)
- Post graduate study 09/2001 – 08/2002 Master of Business Engineering (MBE) –General Management Steinbeis University Berlin
- Study 10/1995 – 08/2001 Mechanical Engineering (Dipl.-Ing.) University of Karlsruhe (TH)
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Speaker
Shaojun Wei
Professor
Welcome Speech
Day 1 / 09:00 - 09:10
魏少军，应用科学博士，清华大学教授，国际电气和电子工程师协会会士（IEEE Fellow），中国电子学会会士（CIE Fellow），亚太人工智能学会会士（AAIA Fellow），国际欧亚科学院院士，俄罗斯工程院外籍院士；国家集成电路产业发展咨询委员会委员；中国半导体行业协会副理事长，世界半导体理事会中国 JSTC 主席，长期致力于超大规模集成电路设计方法学研究、可重构计算架构研究和通信专用集成电路技术研究，主要研究领域为：超大规模集成电路设计方法学研究，高层次综合技术研究，嵌入式系统设计技术研究和可重构计算技术研究。发表学术论文近300 篇，出版专著 10 册，曾获国家技术发明二等奖、国家科技进步二等奖及多项省部级科学技术奖等。
Wei Shaojun, Doctor in Applied Science, Professor of Tsinghua University, IEEE fellow, CIE Fellow, AAIA Fellow, academician of the International Eurasian Academy of Sciences, Foreign Academician of the Russian Academy of Engineering, Member of the National Integrated Circuit Industry Development Advisory Committee, Vice Chairman of China Semiconductor Industry Association and Chairman of World Semiconductor Council China JSTC, has long been committed to the research on VLSI design methodology, reconfigurable computing architecture and Communication ASIC technology. His main research fields are: Research on IC design methodology and high-level synthesis technology, embedded system design technology and reconfigurable computing technology. He has published nearly 300 academic papers and 10 monographs, has won the second prize of national technological invention, the second prize of national scientific and technological progress and a number of provincial and ministerial science and technology awards.
The campus of Tsinghua University is situated in northwest Beijing on the site of the former imperial gardens of the Qing Dynasty, and surrounded by a number of historical sites.
Tsinghua University was established in 1911, originally under the name “Tsinghua Xuetang”. The school was renamed “Tsinghua School” in 1912. The university section was founded in 1925. The name “National Tsinghua University” was adopted in 1928.
The faculty greatly valued the interaction between Chinese and Western cultures, the sciences and humanities, the ancient and modern. Tsinghua scholars Wang Guowei, Liang Qichao, Chen Yinque and Zhao Yuanren, renowned as the “Four Tutors” in the Institute of Chinese Classics, advocated this belief and had a profound impact on Tsinghua’s later development.
Tsinghua University was forced to move to Kunming and join with Peking University and Nankai University to form the Southwest Associated University due to the Resistance War against the Japanese Invasion in 1937. In 1946 The University was moved back to its original location in Beijing after the war.
After the founding of the People’s Republic of China, the University was molded into a polytechnic institute focusing on engineering in the nationwide restructuring of universities and colleges undertaken in 1952. In November 1952, Mr. Jiang Nanxiang became the President of the University. He made significant contributions in leading Tsinghua to become the national center for training engineers and scientists with both professional proficiency and personal integrity.
Since China opened up to the world in 1978, Tsinghua University has developed at a breathtaking pace into a comprehensive research university. At present, the university has 20 schools and 59 departments with faculties in science, engineering, humanities, law, medicine, history, philosophy, economics, management, education and art.
With the motto of “Self-Discipline and Social Commitment” and the spirit of “Actions Speak Louder than Words”, Tsinghua University is dedicated to the well-being of Chinese society and to world development. As one of China’s most prestigious and influential universities, Tsinghua is committed to cultivating global citizens who will thrive in today’s world and become tomorrow’s leaders. Through the pursuit of education and research at the highest level of excellence, Tsinghua is developing innovative solutions that will help solve pressing problems in China and the world.
Speaker
Gerald Yin, Ph.D.
Chairman and CEO
Welcome and Product speech
Day 1 / 09:10 - 09:25
Dr. Gerald Yin has served as AMEC’s chairman and CEO since the company was founded in 2004. He is the chief founder of AMEC and one of major leaders for worldwide plasma etch technology, product development and commercialization.
He worked in Silicon Valley for 20 years with Intel Central TD as a senior process engineer, Lam Research as Etch R&D department manager, and then worked for Applied Materials at different executive positions including CTO and later General Manager of Etch Product Business Group, and Corporate Vice President. He participated in and led a number of the most successful CCP and ICP plasma etcher development which help Lam Research and Applied Materials gaining etch market leader position. He is the major inventor of 90+ US patents and 200 other country patents.
Gerald have pursued chemical reactor development for more than 60 years with nearly 40 years’ experience in plasma etch ,thin film technology and equipment development. Dr. Yin graduated from Beijing Fourth High School and received BS from University of Science and Technology China in year 1967, after 10 years working for Petrochemical industry and Chinese Academy of Sciences, he pursued graduate study in Physical Chemistry at Beijing University .He went to US in 1980 and received Ph.D. in Physical Chemistry from University of California (UCLA).
Draying was awarded the Outstanding Contribution Award for National Science and Technology Major Projects in 2010, received Magnolia Award of Shanghai in 2012. He was listed one of “Top Ten Pudong Economic Figures” in 2013, listed as one of “ 11 Figures of the Year in Shanghai“ in 2018. Together with Intel Chairman and other distinguished semi executives, Dr. Yin was named one of Top 10 “All Stars of International Semiconductor Industry” in 2018 by VLSI Research.
In 2020, Dr. Yin was named “ 50 Best CEOs in China “by Forbes. He was named as the sole major winner of 2021 Ernest Young Entrepreneur in China. He ranked 1st among the top ten “Best leaders of China Public Companies” by Security News in 2022 .He was named “ 50 Best CEOs in China” again by Forbes in 2025 and featured on the front cover of the Forbes Magazine in 2025 July.
尹志尧博士是中微公司首席创始人，21 年来一直担任董事长兼首席执行官。他参与尹志尧博士是中微公司首席创始人，21 年来一直担任董事长兼首席执行官。他参与并领导了国际集成电路设备业界一半以上成功的等离子体刻蚀设备开发，是几代等离子体刻蚀技术及设备的主要发明人和工业化应用的推动者之一。
尹博士曾在美国硅谷先后担任英特尔公司中心研发部资深工程师（Intel）、半导体设备的龙头公司—泛林公司（Lam Research）刻蚀机研发部主管和应用材料公司（Applied Materials）等离子体刻蚀事业群总经理及总公司副总裁。帮助上述企业成为国际等离子体刻蚀设备领先的公司。他也是 90多项 项美国专利和 200多项其他国家专利的主要发明人。
尹志尧博士从事物理化学反应器技术 62年。1967 年获中国科技大学化学物理学士学位，曾在石化部兰州炼油厂及中科院兰州化物所工作。1978年进入北京大学化学系就读研究生，1980 年赴美留学，于 1984 年获得了美国加州大学洛杉矶分校（UCLA）物理化学博士学位。
尹志尧博士在 2010 年获得国家科技重大专项突出贡献奖，2012 年获得
上海市“白玉兰纪念奖”，2013 年获得首届“浦东经济人物十强”，2018 年获得
“感动上海年度人物”11 人之一。2018 年获评国际半导体产业十大领军明星（All
Stars）。2020 年和荣登福布斯 50 名中国最佳 CEO 之一。2021年获得安永中国唯一的企业家大奖。2022 年在证券时报中国上市公司价值评选中，获得“中国上市公司年度领军人物奖”，并名列第一。2023 年获得上海市政府评定的“上海市科技进步奖”一等奖。2025年第二次荣登福布斯中国最佳50名CEO之一, 并成为福布斯中国杂志封面人物。
Advanced Micro-Fabrication Equipment Inc. China (AMEC) is one of the most technologically advanced flagship enterprises in China’s integrated circuit (IC) equipment industry. It was among the first batch of companies listed on the STAR Market (Science and Technology Innovation Board) with the stock code: 688012.
Focused on the forefront of global technology, AMEC specializes in the research, development, manufacturing, and sales of critical semiconductor equipment such as plasma etching equipment, deep silicon etching equipment, and MOCVD systems used in the production of integrated circuits, LED chips, and other microdevices.
The company’s plasma etching equipment is widely used in advanced international manufacturing lines for 14nm, 7nm, and 5nm nodes, and it has also made significant progress in nodes below 5nm. AMEC’s MOCVD equipment has achieved a dominant position in both domestic and international markets for blue-light LED production.
In July 2019, AMEC was listed as one of the first 25 high-tech companies on the STAR Market and became the first company on the board to reach a market capitalization of over RMB 100 billion.
As of the end of June 2022, the company had filed 2,089 patent applications, with 1,189 patents granted.
In 2017, AMEC was the only Chinese company mentioned in a major report submitted by the U.S. President’s Council of Advisors on Science and Technology titled “Ensuring Long-Term U.S. Leadership in Semiconductors.”
In the Global Customer Satisfaction Survey for semiconductor equipment conducted by renowned U.S. consulting firm VLSI Research, AMEC ranked third globally in overall satisfaction in both 2018 and 2019. Specifically, it ranked second in plasma etching and first in chemical film equipment, making it the only Chinese chip equipment company to be included in the rankings — highlighting AMEC’s globally competitive and widely recognized products.
中微半导体设备（上海）股份有限公司是国内技术最领先的集成电路设备旗舰企业之一，是科创板首批上市企业（股票代码：688012）。面向世界科技前沿，中微公司聚焦用于集成电路、LED芯片等微观器件领域的等离子体刻蚀设备、深硅刻蚀设备和MOCVD设备等关键设备的研发、生产和销售。公司等离子体刻蚀设备已广泛应用于国际先进的14纳米、7纳米和5纳米生产线。在5纳米以下也取得了很好的进展。公司MOCVD设备在蓝光LED领域已占据国内外市场的主导地位。中微于2019年7月和25家高科技公司在科创板第一批上市，是科创板第一个达到千亿市值的公司。截至2022年6月底，公司申请了2089 项专利，已取得授权1189项。美国科技专家委员会2017年提交美国总统《确保美国在半导体产业的长期领导地位》的长篇报告，报告中唯一提到的中国公司就是中微公司。在美国知名咨询机构VLSI Research举办的全球半导体设备公司“客户满意度”调查和评比中，中微公司2018年及2019年综合评分均为全球第三，等离子体刻蚀名列第二，化学薄膜设备名列第一，也是唯一上榜的国内芯片设备企业，展现公司产品全球领先的竞争力和市场认可度。
Keynote Speaker
Jingran Cheng
Software Development Manager
Humanoid Robot and the Application of Semiconductor in It
Day 2 / 09:05 - 09:25
人形机器人及其半导体应用
This presentation introduces the company Humanoid Robot Shanghai and its achievements in robot hardware, software, and AI algorithm then goes into the details of some of the hardware devices of humanoid robots, such as motor drivers, lidars, bionic hands, and control computers, elucidating the uses of electronic components in them and the demands that humanoid robots put on pertaining semiconductor domains.
Panel Discussion 圆桌讨论
Day 2 / 13:25 - 14:10
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
Jingran Cheng, software development manager of Humanoid Robot Shanghai, qualified as a master in condensed mater physics from Beijing University of Aeronautics and Astronautics, worked in FlashGet and Missfresh in the past, and cofounded Kanbox which specialized in consumer cloud storage. Currently I am responsible for the adaptation of motor drivers, sensors, effectors, and control computers to robots and for the implementation of application programming interfaces together with remote communication mechanisms for robots.
Humanoid Robot Shanghai is founded in 2023 to propel humanoid robot original hardware design, free software development, AI algorithm research, and its application in civil and industrial areas. The company was indorsed “Joint Humanoid Robot Innovation Center by the State and Local Authorities” in 2024. The major parts of our structural design and software framework can be found open sourced via www.openloong.net. Furthermore, we have built in Shanghai the first “Heterogeneous Humanoid Robot Training Arena” which focuses on data collection, model training and inferencing. Meanwhile, many affiliate training arenas are under construction nation-wide. Our robots are being assessed in various scenarios ranging from bank customer guidance, power plant patrolling and inspecting, automotive assembly work, civil service, and etcetera, in which city waste processing took the lead and came to fruition bringing about an order of one thousand robots.
The company’s product portfolio includes:
AzureLoong Pro – humanoid robot, as tall as 1.85 meters, 31 degrees of freedom, targeting patrolling and inspection, carrying and manipulation, data collection;
AzureLoong Lite – humanoid robot, as tall as 1.45 meters, 24 degrees of freedom, targeting customer guidance, human interaction;
NanoLoong – miniature bipedal robot, targeting education segment;
WheelLoong – wheeled bimanual robot, targeting civil service.
Dexterous Hand – 6 degrees of freedom robotic hand, RS485 communication;
Dexterous Hand Pro – 19 degrees of freedom robotic hand, EtherCAT communication.
Meanwhile, we offer:
Adaptation of our motion control software framework to third party robots;
Remote control and cloud data collection integral solution for robots;
API authoring for robots to interface which to our robot management and controlling cloud platform that is privately deployable.
Keynote Speaker
Haoran Jiang
Vice Dean of Research Institute
Discussion on Chip Applications in the Era of Smart Electric Vehicles
Day 1 / 10:05 - 10:25
智能电动汽车时代芯片应用探讨
Jiang Haoran: Deputy Director of the iCAR Automotive Research Institute at Chery Group. He has over 10 years of experience specializing in the development of automotive intelligence. He has worked in leading companies in the industry such as SAIC-GM, the Xiaomi ecological chain, and Chery. He possesses deep insights into the development of the industry.
蒋浩然：奇瑞集团iCAR汽车研究院副院长，10多年专注于汽车智能化开发，先后在上汽通用、小米生态链、奇瑞等行业一流企业从事相关工作，对行业发展具备深刻的洞察力
iCAR, a trendy automotive brand under the Chery Group, focuses on young people and those with a youthful mindset. Embracing the brand value of “BORN TO PLAY” and the mission of “designed for the young, built by the young, to create outstanding vehicles,” iCAR continuously delivers products rich in emotional value, co-creating inspiring lifestyles with the younger generation.
iCAR: 奇瑞集团旗下聚焦于年轻的人和年轻心态的人潮酷汽车品牌，秉承“BORN TO PLAY”的品牌价值观和“以年轻的人、为年轻的人、造出色的车”的品牌使命，不断为用户提供最具情绪价值的产品，和年轻人一起创造让人心动的生活方式
Speaker
Tobias Keller
Vice President, Head of global Product Mgt., Portfolio & Marketing
Power Semiconductors – The silent Heroes of the future power grid
Day 1 / 16:30 - 16:50
功率半导体 —— 未来电网的 “隐形英雄”
Power semiconductors are the unsung enablers of the energy transition. As the backbone of efficient energy conversion and control, they ensure stability, scalability, and sustainability in tomorrow’s power grids. From integrating renewables to managing smart loads and enabling bidirectional energy flow, these components silently drive innovation and resilience in modern energy systems—making them indispensable to a carbon-neutral future.
Tobias Keller graduated from University of applied science Aargau with a degree in power electronics, thermodynamics and el. machines. He joined ABB’s Excitation and Synchronizing business. He was the Vice President global Products and Marketing. Afterwards he held the Vice President position for Vehicle Integration Engineering in ABB’s traction business. Since 2019, he is the Vice President global Product Management, Portfolio & Marketing in Hitachi Energy Semiconductor. Tobias Keller is a senior member of IEEE.
We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.
Speaker
Gary Huang
Corporate VP, Asia
Innovations in Power Electronics for xEV and Data Center Applications: The Evolving Roles of Silicon, SiC, and GaN
Day 1 / 17:50 - 18:10
xEV 与数据中心应用中的电力电子创新：硅、碳化硅与氮化镓的角色演进
The global push for electrification and digitalization is accelerating innovation in power electronics, especially in two critical sectors: electric and hybrid electric vehicles (xEVs) and data centers. This presentation explores the latest technological trends and market dynamics shaping the future of power devices in these applications, with a special focus on the evolving roles of Silicon, Silicon Carbide (SiC), and Gallium Nitride (GaN) semiconductor technologies.
In the xEV domain, sustainability goals and electrification trends are driving long-term growth, with the market expected to reach 64.3 million vehicles by 2030. The corresponding power device market is projected to reach nearly $14.9 billion, fueled by the trend toward full vehicle electrification and the increased adoption of Wide Bandgap (WBG) technologies and high-voltage architectures such as 800V and the emerging 1,000V systems. These platforms are being accelerated by advances in SiC technology, reduced substrate costs, and expanded high-power charging infrastructure. SiC’s superior efficiency, thermal performance, and compactness are key enablers of higher power density, longer driving range, and smaller system footprints—particularly in traction inverters for BEVs. Chinese OEMs are leading this shift through the aggressive integration of SiC. PHEVs, currently still almost exclusively based on IGBTs, are also beginning to adopt SiC in their main inverters as battery capacities increase. Silicon devices remain the technology of choice primarily for hybrid electric vehicles and low-power electric vehicles. GaN remains a promising contender in xEVs, with potential deployment in onboard chargers and DC-DC converters—and, in the longer term, in main inverters—though its adoption is hindered by cost, supply chain, and technology challenges.In data centers, the surge in AI workloads has triggered an urgent need for higher-efficiency power conversion. Power Supply Units (PSUs) are central to this transformation, with the market expected to grow at a 15.5% CAGR, reaching $14.1 billion by 2030. The introduction of the 80 PLUS Ruby certification sets a new efficiency benchmark, demanding up to 96.5% efficiency at 50% load. To meet such stringent targets and rising power densities—now exceeding 100 W/in³—PSU designers are rapidly adopting WBG semiconductors. SiC and GaN together are expected to account for 24% of PSU power device shipments by 2030.
Hybrid designs combining Si, SiC, and GaN in optimized topologies are emerging as the new standard. Infineon’s new 400V SiC class targets three-level PSU topologies to further push efficiency boundaries. These innovations are key to addressing the dual challenges of energy efficiency and power scalability in future AI-driven data centers.
Yole Group is a leading international market research and strategy consulting firm, delivering in-depth analyses across market trends, technology developments, teardowns, and reverse costing. Leveraging deep semiconductor expertise, its team of analysts also provides custom consulting services, offering strategic, technical, and market insights tailored to address specific business challenges and opportunities.
Speaker
Hidenori Abe
CTO for semiconductor materials, Executive director, Electronics Business Headquarters, Resonac Corporation
Advanced Packaging Materials Innovation through Co-creative Activities
Day 2 / 15:45 - 16:05
协同创新赋能先进封装材料：技术突破与应用探索
In the semiconductor field that supports the evolution of generative AI, innovative packaging technology is attracting increasing attention.
Resonac, a co-creation chemical company, has established a Packaging Solution Center to provide one-stop solutions for its customers,
and has launched the evaluation platform “JOINT2” together with materials, substrate, and equipment manufacturers to accelerate the development of cutting-edge packaging technologies.
In this presentation, we will discuss trends in advanced packaging materials and the latest technologies related to panel interposers. We will also highlight the value and material innovations generated through co-creation activities.
Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
Speaker
Johnny Guo
Director, Solutions
Renesas Automotive X-in-1 System Solution and Technology Driven by GaN
Day 1 / 16:50 - 17:10
瑞萨电子汽车多合一（X-in-1）系统解决方案：以氮化镓（GaN）技术为驱动
The “X-in-1” approach in Electric Vehicles (EVs) refers to the integration of multiple essential components of the vehicle into a single, unified system or module. Renesas has created a reference design with all Renesas portfolios to show the system value of electronics integration. Diverse portfolios include MCU, PMIC, HV GaN, LV MOSFET, GDU, DC/DC converters, which can enable the entire system from a solution perspective, ensuring high efficiency and reliability. HV GaN adoption and new technology trend with bi-directional GaN is also under implementation in the system solution to show the benefit from system solution view.
Johnny is currently the Director of Solutions at Renesas Electronics, where he is contributing the focused effort that the Company is dedicating to business growth with system solution building across Industrial, Automotive and IoT market segments, with expanded portfolios of Embedded Processor, High Performance Computing, Power, Analog and Connectivity, able to lead a dedicated team focus on activities of global and regional market analysis, technology revolution trend understanding and system solution roadmap creation based on market and customer demand from each end-equipment level, as well as to formulate global and regional go-to-market strategy.
Renesas Electronics empowers a safer, smarter and more sustainable future where technology helps make our lives easier.
A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
Speaker
Elpin Goh
Sr. Director, Technical Marketing and Business Development, Specialty Technologies
Preparing for GaN Device Manufacturing at 300mm
Day 1 / 17:40 - 17:50
GaN is one of the most important third generation semiconductor materials. Its wide bandgap makes it an excellent candidate for high power electronics – GaN high electron mobility transistors (HEMTs) have already become well established in Specialty Technology applications such as consumer fast charging and are gaining traction in automotive.
Today, the most advanced GaN device manufacturing is performed on 200mm wafers. But the recent advances in 300mm GaN on Silicon MOCVD is ushering the next phase of GaN adoption at the larger wafer size. Of increasing interest, is the fabrication of low voltage GaN power electronics targeted at data center power management applications, as the rapidly emerging world of generative AI accelerates datacenter investment.
Lam has been a leader in Specialty Technologies, in the development of enabling process capabilities for 200mm GaN on Si fabrication, for almost a decade. In this presentation, we will review the current status of these capabilities and discuss the challenges and opportunities for transitioning GaN from 200mm to 300mm production.
Elpin Goh is Senior Director of Specialty Technologies Technical Marketing and Business Development at Lam Research. She is responsible for technical marketing, business strategy development and planning in Specialty Technologies in APAC region. She works with various Lam product owners to define product strategy and drive innovative product solutions in Specialty Technologies.
Prior to this, Elpin focused on the sales account management in Lam SEA. Elpin’s experience includes process integration, product management, sales and business development in the foundry and semiconductor equipment industry. She started her career as a process integration engineer at GlobalFoundries where she held various positions in process integration, customer engineering, product management and business development.
Elpin received a Master’s degree in Electrical Engineering from National University of Singapore, Singapore. She also holds a Bachelor’s degree from University of Manchester Institute of Science and Technology, UK.
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Speaker
Irene Deng
SVP
Small Components, Big Impact: From Power to Signal Integrity for AI Servers by Nexperia
Day 2 / 11:15 - 11:35
小元件撬动大价值 ——AI 服务器的功率与信号完整性技术解析
AI servers demand unprecedented levels of power efficiency, thermal resilience, and high-speed signal integrity – challenges that hinge on the performance of small but mission-critical components. In this presentation, I will show cases of Nexperia’s current portfolio and coming sampling Power Management ICs, Signal Interfacing iCs, advanced packaging technologies to ultra-low-loss power discrete and high-speed ESD protections that enables next-generation AI hardware. We explore Power Delivery, Signal Integrity, and System reliability. We’ll demonstrate component choices can reduce system bottlenecks, improve energy efficiency, and extend the lifespan of AI server platforms. Nexperia is the one-stop-shop for discrete & standard logic components and analog ICs.
Panel Discussion 圆桌讨论
Day 2 / 13:25 - 14:10
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
Irene Deng serves as General Manager for IC Solutions division at Nexperia, placing her among the company’s executive leadership as SVP. She is the central figure driving Nexperia’s expansion to analog and power ICs. Anchored globally in China, Europe, US, and rest of Asia areas, she’s guiding broader strategy to diversify Nexperia’s offerings beyond its traditional discrete devices toward high-value integrated circuits and high-power products. Since 2023, IC Solutions division has been releasing over triple digit new products annually in various product categories of Power IC, Isolation, Interfacing, Voltage Translators, Signal Path, and Standard Logic.
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
Speaker
Henryk Dabrowski
SVP of Global Sales
Driving the Future with GaN: From Myth to Reality
Day 1 / 17:15 - 17:35
以氮化镓驱动未来：从愿景到现实
Exploring GaN and separating fact from fiction, this presentation reveals its true role in the automotive sector and shows how forward-thinking innovators can apply it effectively to gain a competitive advantage.
Henryk Dabrowski has over 30 years’ experience in technology design, commerce and sales leadership. Most recently, he built and led sales and applications teams for Vicor in EMEA. A Chartered Engineer (CEng) with the Institute of Engineering and Technology (IET), Henryk Dabrowski previously held commercial roles at Texas Instruments and Infineon, and also has experience within the distribution sales channel.
A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.
Operating at a market worth exceeding $30 billion, CGD completed several funding rounds to develop and deliver to the market a wide range of products for consumer and industrial applications.
In autumn 2021, the company was named Tech Scaleup of the Year by Business Weekly in the category of green electronics and was awarded the UK Business Angels Association (UKBAA) deep tech Investment of the Year.
Speaker
Jun Shi, Ph.D.
Power Module Division Deputy General Manager
Technological development and application, challenges and future trends of SiC power devices
Day 1 / 15:05 - 15:25
碳化硅（SiC）功率器件的技术发展、应用场景、挑战与未来趋势
This article introduces the current development status and applications of SiC devices, especially in popular fields, the various problems faced by SiC devices, especially the reliability issue of SiC devices. Finally, the author provides the future and prospects of SiC devices, as well as the progress made by Yangjie Technology in SiC devices.
From 1995 to 2005, studied at Zhejiang University and obtained bachelor’s and doctoral degrees. In 2005, was an academic visitor at the University of Sheffield in the United Kingdom; Subsequently, I was employed as a senior engineer at Siemens (China) Research Institute for the next 5 years, focusing on power electronics technology and its applications in the new energy industry. I have experienced several major power electronics related projects and achieved world leading technology. 3 years of entrepreneurial experience, focusing on the design and development of photovoltaic inverter products. Led a team to develop the 500KW photovoltaic inverter with the highest power density at that time. In 2012, selected as a “double innovation” entrepreneurial talent in Jiangsu Province; I started working at Infineon Technologies for 8 years in 2013 and worked at State Grid subsidiary company Nari Semiconductor for 4 years, focusing on the development and application of power devices (IGBT, SiC) products themselves. I have developed more than 30 IGBT and SiC power devices, which have been widely used in wind power, photovoltaics, energy storage, charging piles, electric vehicles, industrial power supply and other fields. I was selected for the “Purple Mountain Talent Plan High level Innovation and Entrepreneurship Talent Project” in 2023; The current Vice General Manager of Yangjie Technology’s Power Device Division is responsible for the product development, application, and market promotion of power devices such as IGBT and SiC. I have obtained over 10 invention patents.
Yangzhou Yangjie Electronic Technology Co., Ltd. is one of China’s leading vertically integrated (IDM) semiconductor enterprises, covering the entire industrial chain from the design and manufacturing of discrete semiconductor chips to device packaging and testing, as well as end-user sales and services. The company offers a comprehensive product portfolio, including discrete device chips, MOSFETs, IGBTs and power modules, SiC devices, rectifiers, protection devices, and small signal products, providing customers with one-stop product solutions.
Yangjie Electronic’s products are widely used in various key fields, including automotive electronics, clean energy, industrial control, 5G communications, security, artificial intelligence (AI), and consumer electronics. Through continuous efforts in technological innovation and market service, the company is committed to meeting the diverse needs of customers worldwide.
The company was listed on the Shenzhen Stock Exchange on January 23, 2014, under the stock code 300373.
扬州扬杰电子科技股份有限公司是国内少数集半导体分立器件芯片设计制造、器件封装测试、终端销售与服务等产业链垂直一体化（IDM）的杰出厂商。产品线含盖分立器件芯片、MOSFET、IGBT&功率模块、SiC、整流器件、保护器件、小信号等，为客户提供一揽子产品解决方案。
公司产品广泛应用于汽车电子、清洁能源、工控、5G通讯、安防、AI、消费电子等诸多领域。
公司于2014年1月23日在深交所上市，证券代码300373，相信在您的关怀支持下，我们一定能够成为世界信赖的功率半导体伙伴。
Speaker
Gang Jung
Vice President
Breaking the Mold and Driving Innovation – Challenges and Advances in Automotive Power Packaging Technology
Day 2 / 15:05 - 15:25
突破常规，驱动创新 – 汽车功率封装技术的挑战与进展
This report focuses on the automotive power semiconductor market, providing a comprehensive analysis of its core applications and key technological challenges. By examining the market landscape and the critical role of power semiconductors in electric vehicles (EVs) and intelligent systems, the report identifies major technical bottlenecks and industry barriers. It also highlights JCET’s strategic layout in power semiconductor packaging and testing, including cutting-edge solutions where AI integration significantly enhances efficiency across the entire packaging and testing process. Additionally, the report showcases the advanced capabilities of JCET’s new automotive electronics factory and emphasizes its comprehensive one-stop service—covering design, packaging, and testing—to meet diverse customer needs.
Korean veteran Automotive Electronic Expert, Currently serving as GM of JCET Automotive BU. With over 23years of profound expertise at the world’s top semiconductor packaging & testing companies and leading global Tier1 suppliers, he processes extensive experience in R&D, supply chain optimization，quality management and OEM customer service. Mr. Jung Gang has consistently pursued the mission of being the “Global Automotive Industry’s Best Partner.” Through technological innovation and lean management, he continues to drive globalization in the smart mobility sector.
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
Keynote Speaker
KeDa Xu
Founder & CEO
eVTOL marketing trend 低空飞行器未来市场趋势
Day 2 / 09:30 - 09:50
1、低空经济火热带来低空飞行器的新市场机会。
2、应用场景有效落地是低空经济发展的核心，也是低空飞行器的挑战。
3、作为低空飞行器的核心零部件，适航低成本动力将成为低空场景落地的核心因素。
- The booming low-altitude economy has brought about new market opportunities for low-altitude aircraft.
- The effective implementation of application scenarios is the core of the development of the low-altitude economy and also a challenge for low-altitude aircraft.
- As a core component of low-altitude aircraft, airworthy and low-cost power will become a key factor in the implementation of low-altitude scenarios.
Panel Discussion 圆桌讨论
Day 2 / 13:25 - 14:10
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
Mr. Xu Keda holds a master’s degree from Renmin University of China and brings over 20 years of experience from the General Armament Department.
He has deep insights into both the Chinese and global aviation engine markets, which allow him to set a clear strategic direction for the company and to navigate opportunities in today’s complex, fast-changing environment.
许可达，中国人民大学硕士毕业，曾在总装工作20余年，对中国乃至世界航空发动机市场 的现状、趋势有着深刻理解，清晰定位企业发展方向，助力企业在复杂多变的市场环境中把 握发展机遇。
Falcon Aerospace Power Group, founded in 2020, specializes in the research and development, production, sales, and maintenance of power systems for general aviation and low-altitude applications. The company has established an R&D center in Zhuzhou, Hunan, and a heavy-fuel piston engine assembly base in Zhuhai, Guangdong. As of June 2025, Falcon has been recognized as a “Specialized and Innovative Enterprise” in Sichuan Province and as a National High-Tech Enterprise, holding over 40 patents. With leading capabilities in engine technology development, the company has launched three product lines—piston engines, turboprops, and hybrid power systems—providing practical power solutions for various types of low-altitude aircraft.
Speaker
Heming Li
Product Marketing VP
SiC Power Devices: The Core Technology Solution Reshaping the New Energy Landscape
Day 2 / 11:40 - 12:00
SiC 功率器件：重塑新能源格局的核芯技术解决方案
In the current booming new energy market, the rapid advancement and widespread adoption of electric vehicle technology have become an irreversible trend. As consumers’ demands for the performance and user experience of electric vehicles continue to rise, the efficiency, stability, and safety of onboard charging systems have also garnered increased attention. In this presentation, we will share application cases of Fitpower’s silicon carbide solutions in onboard chargers (OBCs) and DC-DC converters, as well as our experience in the promotion and validation of these solutions in the 400V/800V main drive market.
在当前蓬勃发展的新能源市场中，电动汽车技术的快速进步与广泛普及已成为不可逆转的趋势。随着消费者对于电动汽车性能与体验的要求日益提升，车载充电系统的高效性、稳定性以及安全性也相应地受到了更高的关注。本次演讲将为大家分享飞锃碳化硅在车载OBC（车载充电机）和DC（直流转换器）领域的应用案例，以及在400V/800V主驱市场的推广和验证经验分享。
李和明先生，浙江大学电气工程学院工学硕士，现任飞锃半导体产品市场VP。他在功率半导体相关领域拥有超过15年的经验，专注于新能源相关市场，具有丰富的碳化硅功率器件市场与应用经验，曾就职于英飞凌、意法半导体等国际半导体公司。
Alpha Power Solutions (APS) is China’s leading supplier of wide band gap power semiconductor devices. It is one of the pioneering companies in China to engage in the research and development of SiC devices and is the first to successfully use 6-inch SiC technologies , helping China make a breakthrough in this field.
APS adopts the CIDM strategy and has successfully deployed applications in leading domestic companies in the renew energy, photovoltaic energy storage, and EV-charging industries, providing them with Silicon carbide products and solutions for carbon neutrality.
SiC MOSFET, SiC Diode
Speaker
Alan Zhou, Ph.D.
CEO
Opportunities and Challenges for Energy and Power Semiconductors in the AI Era
Day 2 / 14:10 - 14:35
AI 时代对能源和功率半导体的机遇和挑战
Panel Discussion 圆桌讨论
Day 2 / 17:10 - 17:55
Topic: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
投资与风险资本的关键作用 —— 驱动突破性技术，助力中国半导体生态发展
Dr. Alan Zhou has over 30 years of executive experience in multinational and startup companies within the semiconductor industry. Currently serving as the CEO of Shanghai Pixelworks Stock Limited Co. Formerly he was the CEO of BelGaN and Chairman of GaNcool. Before that, he was an Executive Vice President (EVP) of Pixelworks and the President of its China subsidiary, he was responsible for corporate restructuring, financing, acquisitions, and preparations for a STAR Market listing; He also served as the managing partner and Chief Strategy Officer (CTO) at the National IC Fund’s Fujian Anxin Capital, overseeing global investments and acquisitions for the third generation compound semiconductors; a Corporate Vice President at Qualcomm in charge of the smartphone chipset business worth over $3 billion; and a Managing Director at Lucent Technologies, where he led the development and design of China’s first local brand GSM mobile phone reference design and chipset. In 1998, he co-founded MEMSIC, a MEMS sensor company listed in NASDAQ around 2007; and in 1994, served as the General Manager of AT&T Bell Laboratories in Wuxi, managing the technology transfer and construction of China’s first sub-micron very large scale integrated circuit (VLSI) manufacturing Fab for the national 908 Project, which led to the establishment of CSMC went public in HongKong, then acquired by China Resources Group, now known as China Resources Microelectronics listed in the STAR exchange. Dr.Zhou graduated from MIT and earned a Master and Doctor degree in Microelectronics and Computer Science.
Pixelworks’ technology and solutions cover end to end, optimized video delivery that is true to its creator’s intent with a highly authentic viewing experience. Our innovations over two decades has resulted in a strong IP portfolio related to the visual display of digital image data. Our vision is that every screen, no matter how big or small, deserves the highest picture quality. This vision has driven us to develop technology that spans the range from digital projection systems and large flat panel displays to small, low power mobile devices such as smartphones. We also develop innovative methods to apply our core technologies to reduce overall system power and help reduce the bandwidth burden that comes with the display of HD and UHD video.
The relentless advancement of display technology and explosive growth of video consumption driven by digital delivery systems and mobile applications are increasing the necessity and demand for Video Display Processing technology. To meet this growing demand, we deliver our technology as IP cores, semiconductors, software and custom ASIC solutions. This flexible approach allows our customers to deliver the highest video quality in a multitude of applications and form factors while also providing the ability for end product differentiation. Our primary target markets include smartphones, tablets and digital projection systems.
We focus our investments on developing video enhancement solutions for Video Delivery, Mobile Devices and Projectors market segments, with particular attention to increasing performance, video quality, device functionality and saving power. Additionally, we look for ways to leverage our research and development investment into products that address other high-value markets where our innovative proprietary technology provides differentiation for us and our customers. We continually seek to expand our technology portfolio through internal development, co-development with business partners.
Speaker
Marcus Elmar Lang
CTO
Plating of Through-Glass-Vias
Day 2 / 15:30 - 15:40
玻璃通孔电镀
The IC substrate industry is the foundation of the semiconductor ecosystem, with its innovation and advancements directly affecting the performance, reliability, and efficiency of electronic products. Glass Through-Via (TGV) technology is one of the most promising advancements in this field, offering high electrical performance, improved thermal management, and significant miniaturization potential. However, achieving these advantages entails numerous technical and manufacturing challenges. Glass, as a substrate material, has excellent electrical insulation, low dielectric constant, and better CTE values compared to organic cores, but its brittleness presents significant challenges. Ensuring the mechanical integrity of glass substrates throughout the stages of via formation, metallization, and subsequent stacking requires innovative methods and precise control of processing parameters.
Mr. Marcus Elmar Lang, co-founder and CTO of Simetric Semiconductor Solutions, has over 30 years of expertise in PCB and IC substrate manufacturing. Holder of 20+ inventions and several technology awards, he played a leading role in enabling mass production of 9/12μm substrates at a top IC substrate company. He has also provided key process support to global equipment manufacturers and, together with a major OEM, successfully advanced Panel Level Packaging (PLP) technology into industrial production.
Simetric Semiconductor Solutions Co., Ltd., founded in June 2020 and headquartered in Shenzhen, is a high-tech enterprise dedicated to advanced IC manufacturing. The company focuses on electrochemical deposition (ECD), etching, and micropore processing equipment, and has independently developed cutting-edge electroplating and etching technologies. With proven capabilities in 5-micron fine line electroplating, TGV precision hole filling, and micro copper pillar processes, Simetric has successfully introduced corresponding mass production equipment. As an independent Chinese enterprise, the company provides comprehensive solutions that integrate both equipment and process technologies, serving customers in domestic and international markets.
The IC substrate industry plays a critical role as the foundation of the semiconductor ecosystem. Its technological innovations directly impact the performance, reliability, and efficiency of electronic products. Within this field, Glass Through-Via (TGV) technology represents one of the most promising advancements, enabling superior electrical performance, enhanced thermal management, and significant miniaturization potential. At the same time, TGV presents unique challenges due to the brittle nature of glass substrates. Ensuring mechanical integrity throughout via formation, metallization, and stacking requires precise process control and innovative engineering approaches—areas where Simetric continues to deliver industry-leading expertise and solutions.
Founded in 2020 and headquartered in Shenzhen, Simetric is a high-tech enterprise specializing in advanced IC substrate manufacturing solutions. The company focuses on electrochemical deposition (ECD), etching, and micropore processing, with proven expertise in 5-micron fine line electroplating, Through-Glass Via (TGV) precision hole filling, and micro copper pillar processes.
Simetric designs and develops mass production equipment alongside proprietary process technologies, enabling customers to achieve high-yield, high-reliability manufacturing. Its integrated solutions cover the full chain from equipment innovation to process optimization, supporting both domestic and international clients in scaling next-generation IC substrates.
With TGV and advanced substrate technologies at the core, Simetric is helping drive miniaturization, improved electrical performance, and thermal efficiency in semiconductor packaging. By combining independent R&D with deep process know-how, the company continues to deliver breakthrough solutions that strengthen the global semiconductor ecosystem.
Speaker
Hong (Rainbow) Yuan
VP of Technology
Tackling the Power Wall-Next Level of Integration Technologies in PCB and Substrates
Day 2 / 14:40 - 15:00
突破功率墙：PCB 与基板集成技术的进阶之路
The presentation explores how advanced integration technologies in PCBs and substrates are key to overcoming critical challenges of the power wall. It highlights the growing energy demands driven by AI and data-centric applications, and the need for efficient power management in high-performance computing. Through innovations like embedded packaging, GaN and SiC modules, and advanced substrates, AT&S demonstrates solutions that enhance thermal performance, reduce electrical losses, and support heterogeneous integration—paving the way for scalable, energy-efficient electronics in automotive, data centers, and beyond.
Rainbow Yuan is a seasoned technology executive with over two decades of experience in the electronics and telecommunications industry. Her leadership roles have spanned various domains including product engineering, front-end engineering, strategic marketing, and business development. Currently she is serving as the Vice President of Technology at AT&S Headquater in Leoben, Austria, she leads global teams in Application Engineering Excellence and Technology Development, driving innovation and aligning technology strategies with business goals.
Technology and digitalisation are having an ever-growing impact on our lives and are increasingly shaping our daily routines at home and at work. The advances achieved in these fields in recent years are truly breathtaking and have created crucial momentum for growth in every sector of the economy.
As a global technology enterprise, AT&S is actively involved in these developments and plays a decisive role in shaping the digital world of tomorrow. The high-end PCBs and IC substrates AT&S supplies influence future industry standards, products and applications in a number of key industries. Our products’ unrivalled quality and constant innovation secures our customers’ long-term competitiveness. AT&S brings its expertise to bear wherever data is processed, transmitted or stored, or complex systems and machinery need to be controlled or supplied with energy. Thanks to our years of experience in microelectronics, we have the engineers and knowledge needed to overcome any technical challenge. We have developed the best products, processes and technologies in the industry – and constantly strive to develop further and make sure we stay one step ahead.
Our printed circuit boards and IC substrates represent the very latest technology and can be found in cars, industrial plants, servers, medical technology products and consumer electronics. Video streaming, apps, social media and other cornerstones of everyday digital life would not be possible without AT&S. Our technologies and products are a driving force behind rapidly advancing miniaturisation in the electronics industry and enable maximum performance in the smallest of spaces. Our products: IC substrates, Substrate-like printed circuit boards and modules, Flexible and rigid-flex printed curcuit boards, Thermally enhanced printed circuit boards, HDI printed circuit boards, Cavity printed circuit boards, ECP printed circuit boards, High-frequency & high-speed printed circuit boards, Multilayer printed circuit boards, Test & reference boards, Double-sided printed circuit boards.
Panel Moderator
Joseph Chou
General Manager
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape of Automotive Chip Industry and Compliance Practices for Reliability Testing
车规级芯片产业的全球格局与可靠性测试合规实践
POMME was established in 2015 and is located in Hsinchu, Taiwan. It is engaged in high-end wafer test integration and design services for the semiconductor industry, focusing on providing you with the most efficient wafer parameter test solutions. Such as IC Design house, foundry, IDM, testing company, assembly and packaging company, etc., to simplify work for engineers in different departments (such as: technology research and development, quality and reliability assurance, failure analysis, manufacturing, etc.). POMME can help turn all the measurement and analysis under numerous test results into a simple job, speeding up product throughput throughout semiconductor production.
POMME is the solution partner of Keysight Technologies, a world-renowned instrument manufacturer. With more than 16 years of long-term cooperation experience, POMME has developed into the only and most reliable partner of customers among semiconductor industry test integration system providers, with the most professional The technical team, adhering to the spirit of quality first and customer satisfaction, grows together with customers and employees.
Since its establishment, it has served the semiconductor industry chain in the Asia-Pacific region, with more than 300 customers. We use experienced teamwork to run your test work quickly and efficiently. We can provide test solutions that meet your unique needs every time.
POMME possesses the leading wide-bandgap semiconductor automotive electronic components and module test solution technology, and has officially become the exclusive distributor of ipTEST LTD. in the UK. It can provide a full range of measurement solutions more efficiently to meet your needs.
main products:
Power semiconductor wafers, chips, components, and power module testing solutions.
Electrical test probe station (manual/semi-automatic/automatic), all electrical test probe station standard/custom configuration.
Electrical test system upgrade/maintenance/calibration/expansion (HP/Agilent/HP/Keysight/Keithley).
OST (Entrusted Measurement)/WBG/Low Current/Reliability/Burn-In.
Panel Moderator
Salah Nasri
CEO and Co-Founder
I.S.I.G. 15th Year Anniversary Panel Discussion I.S.I.G. 15周年特别企划
Day 1 / 09:25 - 09:55
Topic: Bridging China and the Middle East: Growth Drivers for Chinese Enterprises in the Gulf Region
连接中国与中东：中国企业在海湾地区的增长动力
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Panelist
Marcus Kneifel, Ph.D.
Sr. Vice President, Systems Engineering
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape of Automotive Chip Industry and Compliance Practices for Reliability Testing
车规级芯片产业的全球格局与可靠性测试合规实践
Dr. Marcus Kneifel currently serves as senior vice president of systems engineering, responsible for delivering cutting-edge systems and executing best-in-class engineering practices to expand and support the automotive, industrial, AI and new emerging technologies in adjacent growth markets.Dr. Kneifel is a seasoned leader with deep industry knowledge and a proven track record, bringing valuable expertise into key target markets for the company.Before joining onsemi, Marcus was the Chief Technology Officer and Board Member at Preh Group, and the General Manager of Portfolio Management 800V BEV Power Electronics, Electrified Powertrain Technology at ZF Friedrichshafen. Prior to that, he spent more than 20 years at Robert Bosch, moving through the ranks to ultimately be the General Manager of Engineering Customer Projects, Driver Assistance Systems.He holds a master’s degree in electrical engineering from both the University of Applied Sciences Braunschweig and the University of Bremen, as well as a PhD. in Power Electronics from the University of Bremen.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Panelist
Yung Shun Liu
Senior Chief Engineer
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape of Automotive Chip Industry and Compliance Practices for Reliability Testing
车规级芯片产业的全球格局与可靠性测试合规实践
Panelist
Jun Li
General Manager (FAE Head Quarter), Shanghai
Panel Discussion 圆桌讨论
Day 2 / 13:25 - 14:10
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
JUNLI joined ROHM in 2003, and have been in charge of ROHM China Technical Center for almost 20 years, including applications and promotions of ROHM semiconductors in consumers, automobile and industry.
ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.
Panelist
Wei Wenyuan
C-ASAM Secretary General
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape of Automotive Chip Industry and Compliance Practices for Reliability Testing
车规级芯片产业的全球格局与可靠性测试合规实践
Speaker
Taizhi Zhang, Ph.D.
Senior Engineer
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape of Automotive Chip Industry and Compliance Practices for Reliability Testing
车规级芯片产业的全球格局与可靠性测试合规实践
2016–2020: Led power-hardware development for motor controllers, including power-module selection, chip junction-temperature estimation, discrete-pack development, and gate-driver and power-supply design; served as Senior Hardware Engineer in INOVANCE automotive.
2021–Present: Direct the development of automotive-grade power modules. Act as Technical Lead for Module Development in INOVANCE automotive.
Shenzhen Inovance Technology Co., Ltd. (stock code: SZ.300124) was founded in 2003 and has a market capitalization of about RMB 160Bn. Inovance is the key force in developing industrial automation and drive technologies in China, providing optical-mechatronics-hydraulic-pneumatic integrated solutions covering drive, control, motor, and precision machinery.
Headquartered in Shenzhen, Inovance has more than 20,000 employees and has established multiple production bases in Suzhou, Yueyang, Nanjing, Shanghai, Jinan, Jiaxing, Changchun, and Hungary, as well as having resident offices and service centers in over 30 countries and regions worldwide.
Panelist
Wilson Hong
Chair of ISIG China
Welcome speech by Day 2 moderator
Day 2 / 09:00 - 09:05
Panel Discussion 圆桌讨论
Day 2 / 13:25 - 14:10
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
Closing speech by moderator
Day 2 / 17:55 - 18:05
Formerly Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Panelist
Carsten Mohr
General Manager
Session info not yet published
Carsten is Executive Vice President of the Metal Foils division at SCHLENK and supports CuNex in the same position. He is a mechanical engineer by training and has an extensive track record in the silver paste and copper fabricating industry.
CuNex offers copper sinter pastes and preforms for high-power electronics packaging (die attach, substrate attach, die topside attach). Our copper-based interconnect materials follow a low pressure and rapid sintering approach ensuring improved reliability and performance at a substantial cost advantage over silver sintering.
After 7 years of extensive research, CuNex launched the Cuprum series of sinter pastes and CuForm sinter preforms. The copper pastes and preforms are suitable for Si, SiC and GaN devices as well as high power LEDs.
Specialized engineering solutions also allow for sinter lamination of substrates and die attach supporting embedded chip technologies.
The product development and volume manufacturing are driven by SCHLENK with a history of 150 years in copper and copper alloys.
The Cuprum pastes and CuForm preforms have class leading features:
– Low cost
– Fast drying in air
– Low sintering temperature and pressure
– Rapid sintering process
– High thermal conductivity
– Flexibility on die size and standard metallizations
– No nanoparticles
– Storage at room temperature for up to 6 months
Panelist
Jinwei Liu
Senior Reliability Expert
Panel Discussion 圆桌讨论
Day 1 / 13:30 - 14:15
Topic: Global Landscape of Automotive Chip Industry and Compliance Practices for Reliability Testing
车规级芯片产业的全球格局与可靠性测试合规实践
Geely 汽车集团 资深可靠性专家，高级质量经理。北京泰山质量协会 理事工业设计协会 理事国家重大科技专项《车载移动监测实验室》项目质量总工程师。
Senior Reliability Expert and Senior Quality Manager at Geely Automobile Group.
Director of the Beijing Taishan Quality Association and the Industrial Design Association.
Chief Quality Engineer for the National Major Science and Technology Project “Vehicle-Mounted Mobile Monitoring Laboratory.”
Geely Auto Group is a leading automobile manufacturer based in Hangzhou, China and was founded in 1997 as a subsidiary unit of Zhejiang Geely Holding Group (ZGH). The Group manages several leading brands, including Geely Auto, Lynk & Co, and Zeekr. Geely Auto Group is also the global strategic partner of Malaysian national automaker PROTON.
Panelist
Cynthia Zhang
Founding Partner
Panel Discussion 圆桌讨论
Day 2 / 17:10 - 17:55
Topic: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
投资与风险资本的关键作用 —— 驱动突破性技术，助力中国半导体生态发展
Cynthia Zhang is the founder of FutureX Capital, a boutique all-stage fund focused on global high-tech and AI companies. Some of her notable portfolio includes Bytedance (TikTok), NIO (NYSE: NIO), Meituan (3690.HK), Xiaomi (1810.HK), and Kingsoft Cloud (NASDAQ: KC). She has been consistently recognized as one of the Top 50 Female Investors and Top Technology GP in China.
Prior to founding FutureX, Cynthia was the founder of the Private Equity Division at China Asset Management Company, one of the largest asset management firms in Asia.
Cynthia holds a bachelor’s degree in Computer Science from the National University of Singapore, an EMBA from Tsinghua University’s PBC School of Finance, and is an alumna of the Stanford Executive Program at Stanford Graduate School of Business.
FutureX Capital invests in visionary founders building transformative AI technologies across all stages. With $3B+ accumulated investment and deep roots in the US and China tech ecosystems, we’re positioned at the forefront of the next wave of innovation.
Panelist
Leon(Yenan) Wu, Ph.D.
Founding Partner & CEO
Panel Discussion 圆桌讨论
Day 2 / 17:10 - 17:55
Topic: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
投资与风险资本的关键作用 —— 驱动突破性技术，助力中国半导体生态发展
- Master’s degree from Xi’an Jiaotong University
- PhD from the School of Integrated Circuits, Tsinghua University
- With a background in Electronic Engineering, he has served as a member of the investment committee for integrated circuit and related industry funds under well-known large central enterprises such as Yizhuang Holding Co., Ltd., achieving remarkable investment performance
Xi’an Longding Investment Management Co., Ltd. (referred to as “Longding”) was established in 2014. It is a high-end investment management company focused on the needs of national development, with “finance” and “industry” as the core drivers, focusing on hard technology tracks such as semiconductors, new energy, and information technology.
西安龙鼎投资管理有限公司（简称“龙鼎投资”）成立于2014年，是一家以国家发展需求为核心导向，以“金融”+“产业”为核心引擎，专注半导 体、新能源、信息技术等硬科技赛道的精品投资管理公司。
Panelist
Jun Wang
Chairman
Panel Discussion 圆桌讨论
Day 2 / 17:10 - 17:55
Topic: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
投资与风险资本的关键作用 —— 驱动突破性技术，助力中国半导体生态发展
Moderator
Tong Wu, Ph.D.
Leader of China Automotive Solution Team
Moderator:
Day 1 / 10:03 -
I.S.I.G. China Regional President
Closing Speech
Day 1 / 18:10 - 18:20
吴桐，安森美（onsemi）中国区汽车市场负责人，上海交通大学半导体物理专业，数学专业辅修本科毕业，美国田纳西大学电气工程博士学位。吴博士在半导体封装，碳化硅设计应用方面拥有 10 余年的研发和工业经验。 目前在安森美负责中国区汽车技术与市场，覆盖产品设计，制造，市场及应用，了解新能源行业的市场、供应链、开发流程以及解决方案。与国内多家车厂、Tier 1 保持着深度合作以及技术支持。曾就职于美国田纳西州橡树岭橡树岭国家实验室（ORNL），以及车厂研发团队，共在国际会议和期刊上发表了 40 多篇论文，同时获得了多项 半导体方面的美国专利。
Dr. Tong Wu is onsemi SiC Expert & Leader of China Auto Marketing & Technical Team, responsible for developing the SiC market in China, as well as providing technical support for car OEMs and Tier1s, and participating in multiple NPIs. He has more than 10 years of R&D and industrial experience in wide band-gap devices and its applications. Prior to joining onsemi, Dr. Wu conducted his research at Oak Ridge National Laboratory(ORNL) for multiple DOE-funded SiC-related projects.
Dr. Wu received his B.S. degree from Shanghai Jiao Tong University, majoring in semiconductor physics and minoring in mathematics. Dr. Wu received his Ph.D. in Power Electronics from the University of Tennessee, USA. He conducted his doctoral research at the Power Electronics and Electric Machinery Research Center of Oak Ridge National Laboratory(ORNL). Dr. Wu has authored/co-authored more than 40 papers in international conferences and journals and awarded several U.S. patents in SiC area.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Panelist
Jianhui Wang
Partner
Panel Discussion 圆桌讨论
Day 2 / 17:10 - 17:55
Topic: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
投资与风险资本的关键作用 —— 驱动突破性技术，助力中国半导体生态发展
Panel Moderator
Jason Lin
Product Marketing Director
Panel Discussion 圆桌讨论
Day 2 / 13:25 - 14:10
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
Jason (Yu-Hsien) Lin is Director of Product Marketing at Onto Innovation, where he leads strategic initiatives in unpattern inspection technologies for advanced packaging, compound semiconductors, and AR/VR applications. With a strong track record of accelerating product adoption in emerging markets, Jason brings deep insight into aligning semiconductor solutions with diverse application needs.
Previously at KLA, Jason played a pivotal role in shaping product roadmaps and customer strategies, influencing major decisions such as a top IDM player’s adoption of next-generation inspection tools. His experience spans technical leadership, global benchmarking, and product lifecycle management across multiple nodes and geographies.
He is passionate about bridging engineering innovation with market strategy to enable scalable solutions across evolving semiconductor ecosystems.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Panelist
Allan Zhou, Ph.D.
Senior Advisor
I.S.I.G. 15th Year Anniversary Panel Discussion I.S.I.G. 15周年特别企划
Day 1 / 09:25 - 09:55
Topic: Bridging China and the Middle East: Growth Drivers for Chinese Enterprises in the Gulf Region
连接中国与中东：中国企业在海湾地区的增长动力
Allan Zhou holds a Ph.D. in Chemistry and Materials Science from the University of Connecticut, USA.
He has served as CEO of Shanghai GTA Semiconductor Co., Ltd., Professor at Fudan University, Distinguished Professor and Adjunct Dean of the School of Excellence in Engineering at Shanghai Dian Ji University, Senior R&D Scientist at Applied Materials Inc. (USA), as well as Senior R&D Manager, Fab Director of Large-Scale Manufacturing, and Senior Director of the Operations Center at Semiconductor Manufacturing International Corporation (SMIC).
With extensive expertise in the engineering principles and methodologies of large-scale production for semiconductor micro-nano devices, he has dedicated his career to the research, development, and industrialization of intelligent manufacturing equipment and materials for semiconductor micro-nano devices—particularly focusing on the large-scale industrialization of domestic semiconductor equipment and materials in China. He is recognized as one of the key pioneers in the large-scale industrialization of copper interconnect technology for semiconductor integrated circuits in China.
He has been awarded the 1st Level Prize of the Shanghai Science and Technology Progress Award, published over 20 academic papers, and holds 21 international patents.
He has been selected as a National and Shanghai Distinguished Expert (Innovation Category), honored as an Outstanding Entrepreneur of the Year by China Electronics Corporation (CEC), and received the inaugural Shanghai Outstanding Talent Award.
周华（Allan Zhou）拥有美国康涅狄格大学化学与材料科学博士学位。
他曾担任上海积塔半导体有限公司首席执行官、复旦大学教授、上海电机学院特聘教授兼卓越工程学院兼职副院长、应用材料公司（美国）高级研发科学家，以及中芯国际（SMIC）高级研发经理、大规模制造工厂厂长和运营中心资深处长。
他在半导体微纳器件大规模生产的工程原理与方法方面具有广泛专业知识，长期致力于半导体微纳器件智能制造装备与材料的研发及产业化，尤其专注于中国本土半导体设备与材料的大规模产业化。他被公认为中国半导体集成电路铜互连技术大规模产业化的主要开创者之一。
他曾荣获上海市科学技术进步一等奖，发表过20余篇学术论文，并持有21项国际专利。
他还入选国家级和上海市特聘专家（创新类），获评中国电子信息产业集团年度杰出企业家，以及首届“上海杰出人才”称号。
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