Keynote Speaker
Naveed Sherwani, Ph.D.
Chief Executive Officer
Day 1 / 10:00 - 10:30
Dr. Naveed Sherwani is a world-renowned semiconductor expert, entrepreneur, and leader in chip design. He holds a PhD in computer engineering from the University of Nebraska-Lincoln, and his career spans academia, industry leadership, and entrepreneurship. Early in his career, he served as a professor at Western Michigan University before joining Intel in 1994, where he focused on design automation for complex chips.
Dr. Sherwani has founded or co-founded numerous influential semiconductor companies, including Open-Silicon, Brite Semiconductor, PeerNova, and Rapid Silicon. His ventures have been instrumental in advancing semiconductor technology, raising over $1 billion in funding across these projects. A key figure in the RISC-V movement, he has led the growth of companies like SiFive and SemiFive, contributing to the global rise of RISC-V technology.
In addition to his leadership roles in the private sector, Dr. Sherwani is the Chairman of the National Semiconductor Hub of the Kingdom, where he works on fostering innovation and semiconductor advancements at a national level. He continues to influence the global semiconductor landscape through his contributions to the RISC-V ecosystem and domain-specific FPGA innovations at Rapid Silicon.
Dr. Sherwani has authored multiple textbooks, including the widely-used “Algorithms for VLSI Physical Design Automation,” and has published over 125 technical papers. His leadership in both academia and the industry has earned him numerous accolades, including the Sitara-e-Quaid-e-Azam awarded by the President of Pakistan in 2019.
Keynote Speaker
Oreste Donzella
Strategic Advisor, Board Member, Former C-Suite Executive
Day 1 / 10:30 - 11:00
A Semiconductor industry veteran with over three decades of experience in semiconductor manufacturing and capital equipment companies, holding various engineering and leadership positions at Texas Instruments, Micron Technology and KLA Corporation. Frequent keynote speaker at industry events and featured in several technical publications, awarded with VLSI Semiconductor All Star in 2020. Oreste is currently Senior Advisor at KLA, imec, KronosAI, AlixPartners, and ISIG and he serves the board of Aion Silicon and Synergie CAD group as independent director. Oreste earned his master’s degree in electrical engineering from the University La Sapienza in Rome, Italy
Speaker
Abdullah Alshehri, Ph.D.
Business Development Unit Manager
Day 2 / 10:55 - 11:10
First MEMS Fab in Saudi Arabia
Dr. Abdullah earned his undergraduate degree from the University of Brighton and pursued both his Master’s and PhD at King Abdullah University of Science and Technology (KAUST), specializing in circuit design and developing low-power, high-performance ASICs for MEMS sensors. He is currently an Assistant Professor at Umm Al Qura University and serves on the KAUST Saudi Alumni Executive Committee. Dr. Abdullah has authored and co-authored more than 10 research papers, co-founded TRYSL Tech and DeepCARES, and leads the Business Development Unit at the Saudi Electronics Material Company, with professional experience collaborating with Aramco, STC, and Cadence.
The Saudi Electronic Materials Company (SEMC) is a pioneering semiconductor company driving innovation across Saudi Arabia, the MENA region, and beyond. With expertise in MEMS and infrared (IR) technologies, we deliver end-to-end solutions covering design, fabrication, packaging, and testing.
Equipped with a state-of-the-art cleanroom and advanced facilities, SEMC works alongside leading global research institutions and equipment providers to shape the next generation of semiconductor technologies that support national priorities and meet international standards.
Guided by Saudi Vision 2030, we are building a sustainable semiconductor ecosystem that fuels innovation, accelerates industrial growth, and strengthens the Kingdom’s role as a competitive force in the global semiconductor industry.
Our Services:At SEMC, we combine advanced expertise and cutting-edge facilities to deliver end-to-end semiconductor services for industries, scientists, and researchers. From concept to finished device, our capabilities cover the full value chain:– Design & SimulationProviding advanced design services through EDA, Multiphysics, and process simulations (TCAD) to accelerate innovation and reduce development risks.– FabricationUtilizing our state-of-the-art cleanroom for semiconductor processing, including lithography, etching (wet & dry), thin film deposition, implantation and furnace operations to produce high-quality IC and MEMS devices.– Packaging & AssemblyOffering complete packaging solutions — from dicing, die bonding, wire bonding, sealing, and wafer bonding, ensuring performance, reliability and scalability.– Testing & CharacterizationDelivering robust validation and performance testing, including wafer- and package-level measurements, noise, and vibration tests, as well as nano-scale analysis using SEM, TEM, FIB, EDX, and MSA.– R&D SolutionsPartnering with industries and researchers to co-develop and customize solutions that address both national and global technological demands.
Speaker
Eric Aguilar
CEO
Day 2 / 10:15 - 10:30
MEMS and Sensors for the Next-Gen Edge
An award-winning entrepreneur, Eric Aguilar is a visionary leader in the field of advanced sensor systems for complex systems, such as robotics and autonomous platforms.
Throughout his distinguished two-decade career, Eric’s passion for sensor design and innovation has made him a key player in the industry. His expertise includes leading teams at renowned companies such as Tesla, where he managed a crew of 300 engineers on the firmware for Model 3, and at X, where he spearheaded the development of Google Project Wing, an autonomous drone delivery service.
Eric’s expertise in sensor integration includes leadership positions at autonomous vehicle and robotics companies. His role in steering product development for a sensor company later acquired by Google — as well as for his pioneering work building sensors for drones at US Navy Research Labs — further showcases his depth of experience.
Eric earned a BS in Electrical Engineering from California State Polytechnic University and has pursued advanced studies in Electrical and Electronics Engineering at the University of Southern California. His work continues to shape the future of MEMS and sensor technology, making him a sought-after thought leader and speaker in the field.
Omnitron Sensors is rewriting the script on building high-performance low-cost sensors for the world of tomorrow. Leveraging its executive team’s extensive experience designing, fabricating, and using MEMS sensors, Omnitron has developed a “new topology for MEMS” that addresses some of the most pressing pain points in MEMS manufacturing.
Featuring the clever arrangement of silicon process steps and a new packaging method, Omnitron’s topology significantly improves performance to produce robust, rugged, reliable, repeatable, and low-cost MEMS sensors in high volumes by leveraging commercial MEMS foundries.
The company’s first proof point of its new topology for MEMS is a large, robust, low-cost, MEMS scanning mirror for long-range LiDAR.
Speaker
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Day 2 / 12:30 - 12:45
Dr. Mohssen Moridi is an expert in microtechnology with over 20 years of experience in the development of MEMS devices. He holds a Master’s and Ph.D. in Microtechnology from École Polytechnique Fédérale de Lausanne (EPFL), Switzerland. After completing his doctoral studies, he held various research positions in Switzerland, contributing to advancements in microsystems technology. In 2016, he moved to Austria to lead the Microsystem Division at CTR AG, where he established a MEMS department and managed the development of a new cleanroom dedicated to industrial R&D. Since 2019, he has been part of Silicon Austria Labs (SAL) and currently serves as Senior Executive Director and Head of the Microsystems Research Division. In this role, he leads a team of over 60 researchers, driving innovation in thin-film technologies, integrated photonics, and magnetic and piezoelectric microsystems. With extensive experience at the intersection of research and industry, Dr. Moridi plays a key role in shaping cutting-edge microsystem technologies, bridging fundamental research with industrial applications.
Silicon Austria Labs (SAL) has been founded to be a top European research center for electronic-based systems. In the network of science and economy, we carry out research at a global level and create the basis of groundbreaking products and processes.
Speaker
Habib Hichri, Ph.D.
EVP, Senior Fellow, Global Applications and Business Development
Keynote: Material Science for High-Performance Packaging
Day 2 / 09:10 - 09:40
Education:
- PhD in Chemical Engineering
- MBA
Experience:
- Executive Vice President, Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation
- Vice President, Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation
- Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation.
Habib Hichri is an Executive Vice President, Senior Fellow Global Applications and Business Development at Ajinomoto Fine-Techno Corporation USA. Prior to joining AFT USA, Habib was Director of Applications Engineering at SUSS MicroTec Photonics Systems USA where he provided patterning solutions for advanced semiconductors packaging customers. Before joining SUSS MicroTec, Habib spent about 12 years with IBM Semiconductors Research and Development Center (IBM SRDC) in East Fishkill, NY where he worked as lead process integration engineer for microprocessor (IBM), games and communications chips. He later was promoted to management positions within IBM on process development in the front end of line area for microprocessor fabrication. Habib holds over 40 U.S. patents and authored over 75 publications and presentations and a book chapter in “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies” (Wiley – IEEE) first Edition. Habib received Master and PhD degrees in Chemical Engineering from the Claude Bernard University at Lyon, France, and an MBA degree from the State University of New York at Buffalo. Habib is the chair of the Orange County California IEEE/Electronic Packaging Society (EPS) Chapter. He is also a member of the technical committees of Electronic Components and Technology Conference (ECTC), International Microelectronics Assembly and Packaging Society (IMAPS). He was the general chair of IMPAS 2020. Habib is IMAPS Society Fellow. He is currently member of the IMAPS executive council. Habib is Board member of International Electronics Manufacturing Initiative (iNEMI) since April 2024 and International Semiconductor Executive Group (ISEG) since April 2025.
Ajinomoto Fine-Techno Co., Inc. (AFT) is a subsidiary of the Ajinomoto Group responsible for the fine chemicals division. AFT (est. 1942) continues to deliver materials that can suit a wide range of customer needs in our four main strengths: molecular design, formulation, process development, and solutions. Our customers have commended us for our electronic materials. We have grown to play a major part in their value chains for electronics, automotive, and a variety of other products. We continue to refine our ability in materials science through research and development to continue creating value with our customers. We strive to provide the highest quality products, services, and information for our customers. Beyond our Ajinomoto Build-up film®, we’ve expanded our material portfolio to include molding, photo dielectric, magnetic, and optoelectronics. To maintain our leadership in our specified industry, we are devoted to providing state-of-the-art material, technology know-how, and customer service.
- Insulation film: Ajinomoto Build-up Film (ABF)
- Magnetic materials (Film and Liquid Format)
- Semiconductor encapsulants (AEF )
- Adhesives & Encapsulants (PLANSET)
- Functional adhesive / encapsulation film “AFTINNOVA EF series”
- Latent curing agent “AJICURE”
- Pigment dispersants, coupling agents
- Flame retardants, polymer co-stabilizer
- Activated carbon
Please visit the website: Product information – Ajinomoto Fine-Techno Co.,Inc. (aft-website.com)
Speaker
Steve Stoffels, Ph.D.
CEO
Day 1 / 15:30 - 15:45
Steve Stoffels is an entrepreneur and technology leader with over 20 years of experience in deep-tech, medtech and integrated photonics. He is CEO and co-founder of Aluvia Photonics, the world’s first company dedicated to aluminum oxide photonic integrated circuits, advancing applications in telecommunications, quantum computing, AR/VR, healthcare, and AI data centers. Previously, he founded and served as CTO of Pulsify Medical, developing wearable ultrasound for continuous organ monitoring. Steve holds a Ph.D. in Electrical Engineering, an M.Sc. in Applied Physics (Magna Cum Laude), and was a visiting scholar at Stanford University. He is inventor on 10+ patents, author of 150+ papers, contributor to the European roadmap for power semiconductors, and a frequent invited speaker.
Aluvia Photonics is a pioneering photonic integrated circuit (PIC) platform provider, built on its proprietary aluminum oxide (Al₂O₃) technology. As the first company worldwide dedicated to Al₂O₃ PICs, Aluvia offers unmatched advantages including ultra-low propagation losses, broad spectral transparency from UV to mid-infrared, high power handling, and on-chip optical amplification. Delivering amplification performance comparable to high-end fiber amplifiers, the Aluvia platform unlocks breakthroughs in quantum computing, advanced telecommunications, and LiDAR, while its wide transparency window also supports AR/VR and precision sensing applications.
Through partnerships with leading foundries, Aluvia ensures scalable, volume manufacturing and provides access to multi-project wafers, dedicated runs, and tailored processes that serve both emerging startups and established global leaders. With its unique material benefits and scalable platform model, Aluvia Photonics is accelerating the adoption of next-generation, high-performance PICs and strengthening Europe’s position at the forefront of integrated photonics.
Aluvia Photonics provides a cutting-edge integrated photonics platform based on our proprietary aluminum oxide (Al₂O₃) technology. Our platform delivers unique advantages including ultra-low propagation losses, broad transparency from the UV to mid-infrared, high power handling, and on-chip optical amplification. These capabilities enable applications ranging from quantum computing and advanced telecommunications to LiDAR, AR/VR, and precision sensing.
To support diverse customer needs, Aluvia offers multiple engagement models. Customers can access our technology through multi-project wafer (MPW) runs, which provide cost-efficient prototyping and early testing. For advanced development, dedicated wafer runs and tailored process modules enable optimization for specific performance requirements and scaling to volume production.
Aluvia also collaborates closely with partners and end-users to accelerate innovation, providing tested dies, design support, and integration guidance. By combining unmatched material benefits with scalable, CMOS-fabrication compatible manufacturing, Aluvia delivers the foundation for next-generation photonic integrated circuits across multiple industries.
Speaker
Oleh Krutko, Ph.D.
Senior Vice President of Design and Systems R&D
Day 2 / 12:50 - 13:05
Oleh Krutko is a Senior Vice President of Design and Systems R&D at imec. In this role, he leads global research and engineering organization responsible for developing systems and circuits IP and solutions as well as managing ASIC volume production operations. Previously he was a General Manager of IC-Link by imec, imec division that offers ASIC solution development and manufacturing services.
Prior to joining imec, Oleh Krutko was a Senior Director of Engineering at AMD, managing Analog and Digital RF organization responsible for developing SOCs and ASICs for wireless infrastructure, defense, aerospace, test, and measurement applications. Previously, he was a Director of Engineering at Qorvo Texas, where he was responsible for RF, millimeter wave, broadband and power product development organization, and RF Design Specialist at Nokia North America R&D, where he was working on high efficiency power amplifiers and transmitters for wireless infrastructure.
Oleh Krutko has PhD in Electrical Engineering from the University of Cincinnati, Ohio, USA. He co-authored 40 journal and conference papers and has 7 patents. Oleh Krutko is a senior member of IEEE and Technical Program Committee member of IEEE RFIC conference.
Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2021, imec’s revenue (P&L) totaled 732 million euro.
Further information on imec can be found at www.imec-int.com.
Speaker
Anton Hofmeister
Group Vice President, General Manager, Central R&D, Analog, Power & Discrete, MEMS & Sensors Group
Day 2 / 10:35 - 10:50
MEMS Driving Smart Systems from Europe to MENA
Anton Hofmeister is Group Vice President and General Manager of R&D in ST’s Analog, Power & Discrete, MEMS & Sensors Group. He is also Managing Director of ST’s German subsidiary since 2016.
Hofmeister joined Thomson Semiconductors (a predecessor company to STMicroelectronics) as a marketing engineer in 1986. He subsequently held management positions in product marketing, key account management and corporate strategic marketing. In 1997, Hofmeister was appointed Director of a System R&D team in San Diego, USA, and became subsequently Director of the Print Head Business Unit. In 2005, he was appointed General Manager of the Microfluidics Division and has broadened his responsibility with the MEMS Microactuator Division in 2015, managing the MEMS business for a variety of applications in Consumer Electronics, Automotive, Industrial, and Medical markets.
Hofmeister has served as a board member of the Singapore-based Molecular Diagnostics company Veredus Laboratories. He is currently a member of the Governing Council of the MEMS&Sensor Industry Group (MSIG) at SEMI and a board member of the European Association on Smart Systems Integration (EPoSS).
Anton Hofmeister was born in Munich and graduated with a Master’s degree in Engineering from the University of Munich.
Anton Hofmeister is Group Vice President and General Manager of R&D in ST’s Analog, Power & Discrete, MEMS & Sensors Group. He is also Managing Director of ST’s German subsidiary since 2016.
Hofmeister joined Thomson Semiconductors (a predecessor company to STMicroelectronics) as a marketing engineer in 1986. He subsequently held management positions in product marketing, key account management and corporate strategic marketing. In 1997, Hofmeister was appointed Director of a System R&D team in San Diego, USA, and became subsequently Director of the Print Head Business Unit. In 2005, he was appointed General Manager of the Microfluidics Division and has broadened his responsibility with the MEMS Microactuator Division in 2015, managing the MEMS business for a variety of applications in Consumer Electronics, Automotive, Industrial, and Medical markets.
Hofmeister has served as a board member of the Singapore-based Molecular Diagnostics company Veredus Laboratories. He is currently a member of the Governing Council of the MEMS&Sensor Industry Group (MSIG) at SEMI and a board member of the European Association on Smart Systems Integration (EPoSS).
Anton Hofmeister was born in Munich and graduated with a Master’s degree in Engineering from the University of Munich.
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Speaker
Mohammed Tmimi, Ph.D.
Independent Strategy Consultant Specializing in Semiconductors, Telecom & Hardware
Day 1 / 13:00 - 13:15
Dr. Mohammed Tmimi is a strategy and market research consultant specializing in semiconductors, with a focus on supporting investment decisions. He earned his Ph.D. while working at STMicroelectronics, where he gained hands-on experience in advanced semiconductor design. He has deep insights into the semiconductor industry from his role as a technology and market analyst at Yole Développement, where he strengthened his expertise in the semiconductor and deep-tech sectors. As a former corporate development/investment specialist at AAC Technologies (listed in HK), he specialized in analyzing inorganic growth opportunities, researching and evaluating technologies and companies in semiconductors sectors.
At Nanochips Consulting
Our expertise spans from high-frequency semiconductor design to deeptech market analysis, offering bespoke services in market research, strategic planning, and due diligence.
We empower investors and companies in the semiconductor and telecom sectors with strategic insights and advanced market intelligence.
Your Partner in Navigating Market Dynamics and Advancing Technological Innovation.
Our services include the following key areas to support your growth and success. If you have additional needs in mind, please reach out to discuss how we can assist.
Market Research and Analysis
Conduct specialized market research to identify trends, niche markets, and opportunities for differentiation, providing in-depth data beyond standard $xB TAM/SAM metrics.
Track technological and market shifts to stay ahead of disruptions.
Develop and refine go-to-market strategies, including positioning, pricing, and channel selection, to accelerate market entry and growth.
Support product/market fit validation, e.g., through customer insights and feedback.
Identify key players in complementary or competitive technologies.
Strategic Planning and Business development support
Develop and refine company strategy and create compelling, data-driven story/pitch decks for value creation scenarios.
Support growth strategy execution, including market entry and expansion.
Identify and recommend strategic partnerships (academia, startups, industry) aligned with technological capabilities and future needs/roadmap.
Advise on M&A and strategic investments to strengthen market position and create synergies.
Assess acquihiring opportunities to acquire key talent, innovative technologies and capabilities.
For Investors
Identify high-potential investment opportunities, including niche and emerging markets, particularly in deep tech, Semiconductor, RF, imaging, and related sectors.
Conduct pre-due diligence and comprehensive evaluations on potential targets, assessing strategic alignment, market potential, and competitive positioning.
Evaluate technology roadmaps of potential targets to ensure alignment with emerging industry trends and investor goals.
Advise on growth, expansion, and integration strategies for portfolio companies to maximize synergies and operational efficiency.
Speaker
Mo Maghsoudnia
Founder & CEO
Day 2 / 11:15 - 11:30
Mo Maghsoudnia is the visionary Founder and dedicated CEO at the helm of UltraSense Systems, a pioneering company in the technology and manufacturing sector. With a track record of transformative leadership and innovation, Mo has been instrumental in shaping the industry landscape.
Before founding UltraSense, Mo Maghsoudnia made significant contributions as the Vice President of Technology & Manufacturing at InvenSense. In this influential role, he oversaw global operations and spearheaded the development of cutting-edge Process Technology. Under his guidance, InvenSense achieved remarkable success, culminating in its acquisition by TDK for a staggering $1.4 billion in 2017.
Prior to his tenure at InvenSense, Mo Maghsoudnia served as the Vice President of Manufacturing at NetLogic MicroSystems. Here, he demonstrated his exceptional ability to steer manufacturing operations, elevating the company from a single product line to a diversified product portfolio powerhouse. His adept leadership, combined with a diverse product range, paved the way for Broadcom’s acquisition of NetLogic MicroSystems for a
remarkable $4 billion in 2012.
Mo’s expertise is firmly rooted in his academic pursuits, holding a Master of Science in Electrical Engineering from Santa Clara University. His passion for innovation is further underscored by his impressive intellectual property portfolio, boasting 12 patents, and an extensive list of research papers that he has authored.
Mo Maghsoudnia’s unwavering commitment to technological advancement and his exceptional leadership have left an indelible mark on the tech and manufacturing sectors, solidifying his status as a true industry luminary.
UltraSense Systems transforms driver touch interfaces in automotive with its In-Plane Sensing solutions, which enable multi-mode sensing, processing, and AI / Machine Learning algorithms to turn almost any surface into the ultimate touch experience. UltraSense In-Plane Sensing includes a SmartSurface Human Machine Interface (HMI) controller for programmable audio, illumination, haptics, and user feedback. When integrated into steering wheels, infotainment systems, and other in-vehicle interfaces, UltraSense offers a more intuitive and modern experience for drivers; a more integrated, easier to manufacture and thinner solution for tier-suppliers; and greater design options plus recyclability and sustainability benefits for automakers.
UltraSense TouchPoint HMI Controllers fully integrate multi-mode touch sensing, lighting control, and algorithm processing in a single chip – powering a new generation of Human-Machine Interfaces.
*UltraSense TouchPoint C-CapForce HMI Controller. Capacitive + Force integrated System on a Chip (SoC) controller including Analog Front End (AFE).
*UltraSense TouchPoint Z – UltraForce HMI Controller. Ultrasound + Force integrated SoC controller including AFE.
*UltraSense TouchPoint Q – TapForce HMI Controller. Piezoelectric Force sensing integrated SoC controller including AFE.
*UltraSense TouchPoint Edge – HMI SoC for cluster of buttons & slider capabilities. Integrated sensing and feedback control, MCU, AFE and Neural Touch Engine coupled with LIN communication.
Speaker
Kieran Harney
CEO
Day 1 / 16:30 - 16:45
sensiBel is a Norwegian optical MEMS sensor company delivering the next generation of MEMS microphones with 80 dBA SNR and 146 dB AOP SPL.
The SB100B series offers true studio-quality performance MEMS microphones in a small and power efficient package.
Speaker
Ole Gerkensmeyer
VP EMEA Sales
Joint Case Study: Powering Electronics with Active and Passive Devices
Day 2 / 09:45 - 10:10
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
Speaker
Chloe Ma
CBO
Day 1 / 14:50 - 15:05
Speaker
Karim Hamzaoui
VP of Global Business Development
Day 1 / 13:20 - 13:35
Preferred Networks (PFN) is a leading Japanese AI technology company known for its vertically integrated development of cutting-edge technologies—from custom AI chips, generative AI foundation models to real-world AI solutions and products. PFN plays a key role in advancing Japan’s AI sovereignty and has earned a strong domestic reputation. PFN’s AI solutions span across diverse industries including manufacturing, materials, energy, pharmaceuticals, healthcare, finance, retail, and entertainment. The company is currently developing a novel AI inference chip, leveraging its highly energy-efficient MN-Core™ logic and a new memory technology, with a release targeted for early 2027.
Preferred Networks (PFN) develops cutting-edge technologies across the AI value chain from semiconductors, supercomputers, generative AI foundation models to AI solutions and products:
MN-Core™ — a series of highly energy-efficient AI chips, which made a debut topping the Green500 list of the world’s most energy-efficient supercomputers three times in 2020/21. PFN is currently developing a new line of MN-Core chips focused on AI inference, set for release in early 2027.
Preferred Computing Platform™ (PFCP™︎) — a cloud-based service that provides users with access to the computing power of MN-Core 2. PFN has also announced a joint venture with Mitsubishi Corporation and IIJ aiming to launch an MN-Core™-based IaaS commercial service in 2026.
PLaMo™ — a series of Large Language Models developed fully from scratch by PFN, delivering top-tier performance in Japanese-language capabilities. These models power a wide range of AI applications in sectors such as finance, healthcare, and the public sector.
Matlantis™ — a cloud-based, high-speed universal atomistic simulator. Powered by a machine learning interatomic potential (MLIP), Matlantis significantly accelerates the simulation workflow in new materials discovery across industries such as semiconductor, automotive, and energy, by bypassing traditional heavy electronic state calculations.
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