Keynote Speaker
Aldo Bruno
Technical Lead MEMS Sensor System Competence Team
How will Generative AI shape the future of MEMS Microphones?
Day 1 / 08:45 - 09:05
In the present era, the utilization of AI in diverse applications is steadily increasing, contributing to strength individuals’ efficiency. Tools like ChatGPT play a pivotal role in enhancing people productivity by engaging users through text or voice inputs. Notably, Infineon’s high-performance silicon microphones enable seamless speech interaction with Natural Language Processing assistants. Prior to being processed by Large Language Models, audio data undergoes Speech-to-Text (STT) conversion, a crucial task to ensure accurate input for AI systems. STT operates by breaking down speech into “phonemes” and utilizing spectral comparison to transcribe the audio. Infineon’s initial trials evaluate the significance of high Signal-to-Noise Ratio (SNR) in applications like laptops interpreting the Error Word Rate. Furthermore, in True Wireless Stereo (TWS) and Smart-VR glasses devices, the fusion of AI with Infineon’s Vibration sensor shows the potential to revolutionize current architectures, delivering clear phone calls even any environmental conditions and outperforming current solutions.
Aldo Bruno is the Technical Lead MEMS Sensor System Competence Team within the application engineering at Infineon Technologies, specializing in consumer sensors. Before Infineon, he held the role of Digital ASIC Designer at Cirrus Logic UK, where he honed his expertise in DSP, digital filters, audio codec systems, voice activity detection, and speech enhancement algorithms. In 2018, while completing his master’s thesis at Infineon Technologies, he concentrated on the development of ANC systems to explore the potential enhancements Infineon MEMS microphones could bring. Throughout his career and personal pursuits, Aldo’s passion for audio and acoustics has been a driving force since he´s also a musician and music producer.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Keynote Speaker
Ken Diest
Research Manager and Tech Lead
MEMS in AR/VR
Day 1 / 11:30 - 11:50
As Augmented Reality (AR) and Virtual Reality (VR) devices continue to mature, the need for lower size, weight, and power (SWaP) components will only increase. One solution to this demand is with Micro-Electromechanical Systems (MEMS). MEMS devices have become ubiquitous within the consumer electronics industry, and their unique balance of SWaP and performance present a unique opportunity to address the challenges associated with AR/VR development.
In this talk, I will introduce the AR/VR technology space and discuss multiple ways in which the sensing and compute demands push beyond previous methods of interacting with digital content. Current MEMS integration within these devices will be highlighted along with the constraints and opportunities for future MEMS integration.
Ken Diest is a Research Manager and Tech Lead at Meta’s Reality Labs, where he leads programs focused on MEMS and micro-actuator technologies. His focus is on developing these technologies from early stage through production to address critical opto-mechanical and display challenges in AR/MR.
A Materials Scientist by training, Ken’s prior work focused on tunable devices and materials with an emphasis on optical systems. He was the editor and co-author of the book Numerical Methods for Metamaterial Design, and has previously held technology development roles at Apple, MIT Lincoln Laboratories, and Northrop Grumman that focused on new displays and nano-photonics.
Company Profile
Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology.
Keynote Speaker
Mo Maghsoudnia
Founder & CEO
Transforming Automotive Interfaces with UltraSense Systems’ Cutting-Edge Monolithic Silicon/PMUT Technology
Day 1 / 13:50 - 14:10
At UltraSense Systems, we’re at the forefront of revolutionizing automotive touch interfaces with our state-of-the-art HMI Controller solutions and innovative In-Plane Sensing approach. Our advanced monolithic silicon/PMUT technology turns ordinary surfaces into highly responsive, solid surface touch interfaces, delivering an unparalleled driving experience. In today’s automotive industry, touch user interfaces are crucial for modernization and product differentiation.
Our groundbreaking multi-mode touch and force fusion sensing capabilities, enhanced by AI and Machine Learning algorithms, enable virtually any surface of any material (metal, glass, fabric,..) within a vehicle to function as an intuitive touch interface. At the core of our offerings is the smart-solid-surface Human Machine Interface (HMI) controller, which provides customizable features such as audio, illumination, haptics, and user feedback, all designed to elevate the driving experience. By replacing mechanical interfaces with intuitive Smart-Solid Surfaces using our PMUT technology platform, UltraSense enhances both automotive interior and exterior modernization, providing a cost-effective advanced tactile sensing/HMI solution for automotive OEMs.
Mo Maghsoudnia is the visionary Founder and dedicated CEO at the helm of UltraSense Systems, a pioneering company in the technology and manufacturing sector. With a track record of transformative leadership and innovation, Mo has been instrumental in shaping the industry landscape.
Before founding UltraSense, Mo Maghsoudnia made significant contributions as the Vice President of Technology & Manufacturing at InvenSense. In this influential role, he oversaw global operations and spearheaded the development of cutting-edge Process Technology. Under his guidance, InvenSense achieved remarkable success, culminating in its acquisition by TDK for a staggering $1.4 billion in 2017.
Prior to his tenure at InvenSense, Mo Maghsoudnia served as the Vice President of Manufacturing at NetLogic MicroSystems. Here, he demonstrated his exceptional ability to steer manufacturing operations, elevating the company from a single product line to a diversified product portfolio powerhouse. His adept leadership, combined with a diverse product range, paved the way for Broadcom’s acquisition of NetLogic MicroSystems for a
remarkable $4 billion in 2012.
Mo’s expertise is firmly rooted in his academic pursuits, holding a Master of Science in Electrical Engineering from Santa Clara University. His passion for innovation is further underscored by his impressive intellectual property portfolio, boasting 12 patents, and an extensive list of research papers that he has authored.
Mo Maghsoudnia’s unwavering commitment to technological advancement and his exceptional leadership have left an indelible mark on the tech and manufacturing sectors, solidifying his status as a true industry luminary.
Company Profile
UltraSense Systems transforms driver touch interfaces in automotive with its In-Plane Sensing solutions, which enable multi-mode sensing, processing, and AI / Machine Learning algorithms to turn almost any surface into the ultimate touch experience. UltraSense In-Plane Sensing includes a SmartSurface Human Machine Interface (HMI) controller for programmable audio, illumination, haptics, and user feedback. When integrated into steering wheels, infotainment systems, and other in-vehicle interfaces, UltraSense offers a more intuitive and modern experience for drivers; a more integrated, easier to manufacture and thinner solution for tier-suppliers; and greater design options plus recyclability and sustainability benefits for automakers.
UltraSense TouchPoint HMI Controllers fully integrate multi-mode touch sensing, lighting control, and algorithm processing in a single chip – powering a new generation of Human-Machine Interfaces.
*UltraSense TouchPoint C-CapForce HMI Controller. Capacitive + Force integrated System on a Chip (SoC) controller including Analog Front End (AFE).
*UltraSense TouchPoint Z – UltraForce HMI Controller. Ultrasound + Force integrated SoC controller including AFE.
*UltraSense TouchPoint Q – TapForce HMI Controller. Piezoelectric Force sensing integrated SoC controller including AFE.
*UltraSense TouchPoint Edge – HMI SoC for cluster of buttons & slider capabilities. Integrated sensing and feedback control, MCU, AFE and Neural Touch Engine coupled with LIN communication.
Speaker
Dr. Roland Helm
Senior Vice President, Head of Integrated Optical Sensing
Illuminating and complementing: Light-Based Sensing
Day 1 / 17:30 - 17:50
Light-based sensing technologies have enabled and improved wide range of use cases. This presentation explores the foundational technologies, working principles and building blocks of light-based sensing and actuating. The focus is on specific use case values coming from consumer applications. Key technologies include specialization for light sensing of semiconductor, package, and system architecture including software. Complementing and competing technologies, such as radar and ultrasonic are also discussed. The presentation concludes with a call for industry collaboration to unleash the value of light- sensing in attractive verticals.
Roland joined ams Osram in January 2024, as Senior VP, Heading the Business Line Integrated Optical Sensors. He has a track record in the semiconductor and sensors industry spanning 20 years where he held various leadership positions. In his previous role, he has grown a MEMS business from technical feasibility to technology and market leadership. Before he was working in a technology start-up and in a business consultancy. He is passionate to capture the value of new technology matching the needs of modern society. Roland lives with his family with three kids in Munich. He enjoys time with his family, endurance sports, skiing and sailing.
Company Profile
A global leader in innovative light and sensor solutions
At ams OSRAM, we pioneer differentiating light and sensor solutions. Looking back on more than 100 years of industry experience, we combine engineering excellence and global manufacturing capabilities with passion for cutting-edge innovation. Our commitment to pushing the boundaries of illumination, visualization, and sensing has earned us the trust of customers worldwide. Together, we create break-through applications that make our world safer, smarter, and more sustainable.
“Sense the power of light” – our success is based on our deep understanding of the potential of light. We harness its full spectrum – visible and invisible – to illuminate our surroundings as well as gather information from them. By adding intelligence to light, we enable our customers to drive transformative applications.
Our distinct portfolio of advanced light and sensor technologies sets us apart in our industry. It includes high-quality semiconductor-based light emitters, sensors, CMOS ICs and software as well as a range of traditional lighting technologies for automotive and special applications.
Our around 20,000 employees worldwide focus on innovation alongside the societal megatrends of digitalization, smart living, energy efficiency, and sustainability. Our light and sensor technologies are setting industry standards in the automotive, industrial, medical and consumer electronics markets. This is reflected in our global portfolio of some 14,000 patents and patent applications. Headquartered in Premstaetten/Graz (Austria) and Munich (Germany), the group achieved EUR 3.6 billion revenues in 2023.
Speaker
Dr. Tristan Rousselle
Founder & CEO
Opening Gas Sensing Possibilities with Silicon Photonics-Based Sensors
Day 2 / 13:50 - 14:10
Odorant VOCs (smells) is an infinite, nevertheless misunderstood and underestimated, source of valuable information which can offer very diverse business opportunities on different markets. In collaboration with the CEA-Grenoble, Aryballe has developed a selective VOC sensor capable of real-time detection and identification. This breakthrough technology enables the generation of large datasets, which can be analyzed using either simple algorithms or more sophisticated machine learning models.
More precisely, the 64 channels Mach Zender Interferometer (MZI) functionalized with proprietary peptide biosensors can detect a broad range of odors and chemical families. Moreover, this very innovative sensor has the property to generate live data within a large range of concentration.
In addition to addressing diverse industrial and environmental applications, Aryballe has successfully deployed its products in the Food and Cosmetics markets. More recently, breakthrough results have been obtained in the medical diagnostic domain with a focus on bacterial infection detection.
Tristan Rousselle holds a Ph.D. in Cell Biology from the University Grenoble Alpes. He completed part of his postgraduate studies at Sussex University (Brighton, UK) and the La Jolla Institute for Allergy and Immunology (San Diego, CA). In 2000, he co-founded a company called Protein’eXpert, now known as PX’Therapeutics. This biotechnology company specializes in the engineering, pre-clinical, and clinical development of therapeutic proteins. By 2011, PX’Therapeutics had more than 60 employees in Grenoble and Lyon and generated nearly 50% of its turnover outside Europe.
In July 2013, a few months after the acquisition of PX Therapeutics by the “Laboratoire Aguettant,” Tristan decided to launch a new venture with a leading innovative project in the field of Biosensors
named “Aryballe”. He founded the company in March 2014. Since then, Tristan has successively held the positions of CEO, Deputy CEO & CTO (2018-2022), and President & CEO since November 2022. Over the last 10 years, Aryballe SA
has raised over $25M, open offices in New York and Seoul and has progressively become the leader in the growing industrial domain of Digital Olfaction.
Aryballe’s products are based on a smart combination of Silicon photonics sensors co-developed with the CEA, as well as fluidics, imaging, data science, and user-friendly software.
Company Profile
Aryballe combines biochemistry, advanced optics and machine learning to mimic the human sense of smell. Odors captured by the silicon photonics-based core sensor in our NeOse Advance are analyzed by the cloud-based Aryballe Suite to provide objective, fast analysis. This enables customers to leverage odor data for improved decision making for R&D, quality control, and manufacturing.
Speaker
Dr. Ando Feyh
MEMS Strategy Management, New Business and M&A
Advances in MEMS Sensors & Technologies
Day 1 / 12:20 - 12:40
• MEMS based sensors are a key-enabler in a wide range of applications: from automotive, over consumer to the life science domain. MEMS is expected to even further proliferate in everyday life, due to their continued miniaturization, steady increase in performance and the accessibility of new sensing functionalities.
• This is possible due to a constant high level of innovation in e.g., processing and packaging technologies, as well as due to novel system-level concepts. This shows the need for an overarching approach, integrating all development domains.
• In his presentation, Dr. Ando Feyh (MEMS Strategy Management, New Business and M&A), will cover a brief review and compare this to the progress achieved by recent advancements in the field of MEMS based sensors. Several examples from above outlined domains will be discussed for illustration.
Ando Feyh received his PhD degree in Electrical Engineering at RWTH Aachen University after a Physics Diploma degree at Stuttgart University.
He started his career at Bosch in 2002 within Corporate Research and Advance Engineering. Concentrating in the field of microsystems, he worked on integration and miniaturization of MEMS sensors, in development and in project management positions.
Between 2010 and 2014 he was an expat in the Silicon Valley in Palo Alto, leading different MEMS projects and an engineering group for MEMS pre-development.
2014 he joined the Bosch internal IoT startup “Bosch Connected Devices and Solutions”, first responsible for Advance Engineering and System Architecture, later as Head of Engineering. Mid 2018 he was nominated Head of Technical Responsibility / CTO, responsible for engineering, project management and product management of IoT devices.
Since mid 2021 he is focusing on MEMS Strategy Management, New Business and M&A projects within the Mobility Electronics Sensors Business unit.
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Speaker
Ruby Yan
Business Unit Director
Advance CMOS technology to unleash the full power of MEMS sensor
Day 1 / 15:55 - 16:15
This talk focuses on the cutting-edge developments in CMOS technology that are revolutionizing the capabilities of MEMS sensors. By exploring the synergies between CMOS technology and MEMS sensors, this talk sheds light on the transformative potential of neuromorphic and sensor fusion in pushing the boundaries of sensor technology. Through the implementation of edge AI methodologies, we will also show you the improvement in the following aspects:
- AI in sensor: neuromorphic and sensor fusion have been proven as an effective approach to improve the sensor performance while achieving the low power consumption requirement for wearable products. We will showcase our latest result with AI integrated sensors.
- Privacy for always-on sensor: with the increasing need of 24/7 health monitoring, RF radar has been proposed by industry partners to replace optical and acoustic sensors. During this talk, we will give a performance and cost comparation from the foundry’s point of view.
- Challenge in biosensor: with the increasing computing functions integrated into biosensor, many devices are moving from legacy node to advanced CMOS technology. Major challenges to combine advanced CMOS with microfluidics emerged. In this talk, we will proposal a call for action to resolve this issue.
- Internet of Medical Things: with the rise in digital therapeutics and at-home diagnostics, we see the need to improve foundry quality control to address such mid-risk medical devices with function safety and root-of-trust approach.
Ruby Yan is a seasoned Business Line Director at GlobalFoundries, where she oversees the HMI (Human-Machine-Interface) and healthcare business line. With more than 12 years of experience in the company, she has held various roles and responsibilities including technology development and product management. She is also a Master Inventor in GlobalFoundries, boasting an impressive track record with more than 20 patents granted and over 70 peer-reviewed papers published. Ruby is passionate about promoting diversity and inclusion and advocating for female leadership in the tech industry. As a company representative to the German Diversity Charter Association (Charta der Vielfalt), she works to support and inspire underrepresented groups in STEM fields.
Company Profile
GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.
Speaker
Dr. Erwin Hijzen
Program Director
A Large Area, Panel-based sensor platform
Day 2 / 15:15 - 15:35
Most sensor technologies are based on Silicon, wafer-based technology. This offers advantages in miniaturization and integration of advanced electronics. There is, however, a large application space in which there is a big advantage of having large sensor surfaces. Examples of these can be found in Non-Destructive Testing (e.g. pipeline or aircraft inspection) or medical imaging (e.g. wearable patches for continuous patient monitoring).
These applications require large area, low-cost, in some cases even flexible, sensor surfaces. To serve these needs IMEC is developing a large area sensor platform that is based on Flat-Panel Display compatible technology. In this presentation we will explain the benefits of this technology platform, and zoom in on our lead application for driving this technology: ultrasound medical imaging.
Erwin Hijzen received his PhD in Applied Physics from the Delft University of Technology. After that he has worked for Philips and NXP in the area of semiconductor technology, holding different R&D positions. He is currently working for IMEC, as director for the MEMS ultrasound program.
Company Profile
Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2021, imec’s revenue (P&L) totaled 732 million euro.
Further information on imec can be found at www.imec-int.com.
Speaker
Doug Sparks
Vice President Business Development
New Foundry MEMS Ecosystem Accelerator
Day 1 / 16:45 - 17:05
InchFab offers a new approach to MEMS foundries. It gives the MEMS industry a low cost and fast cycle time microfab service solution designed for today’s microfabricated technologies, addressing the needs of the bio, medical, IoT, aerospace and industrial sensing markets. At InchFab, we enable rapid, cost- efficient development and rapid, low risk scaling to production for today’s emerging technologies. InchFab’s low capex approach to foundry expansion will be discussed as will the ability of InchFab to assist regions wanting to quickly develop their semiconductor infrastructure.
Doug Sparks is the InchFab VP of business development. He is also the president of M2N Technology, the former CTO of Hanking Electronics and founder and president of NanoGetters. Doug has been in the MEMS indistry for over 3 decades in a variety of roles from startups to management, process, design and packaging.,
Company Profile
The founders of InchFab developed the core fabrication technology that now drives InchFab – a ultra-low-cost scalable “micro-sized” fab platform. Today InchFab uses this platform to provide highly flexible and cost-effective foundry services to its customers and partners. In 2025 InchFab announced that the complete microfab equipment set and facility is being offered. This turnkey wafer fab is a low capex alternative to anything available. It’s ideal for startups, universities and low to medium volume corporations.
Wafer foundry services and tunrkey minifabs
Speaker
Dr. Jacob Hsu
CTO of Smart Sensing & Systems Technology Center
Vibration sensors with AI for in industry applications
Day 2 / 11:05 - 11:25
With the capability of predictability on equipment health by sensors which may benefits to customers’ manufacturing line with saving cost, capacity maximization, and reducing risk of manufacturing stop. Vibration sensors are widely adopted in different equipment such as lathe, milling machine, ball-screw, and motor to gather their vibration data. By the help of supervised AI machine learning model, we are able to analyze these vibration data and then to classify them to predetermined causes. The noise of vibration sensor is strongly affecting the resolution of sensor and the classification resolution of machine learning model.
In the past decade, we have launched few qualified vibration sensors with both low-noise and wide bandwidth to Taiwan market for applications in industry. Almost each Industrial vibration sensing AI solution is with different features which forces the collaboration between sensor supplier, system integration provider, and user becoming must so as to short the development lead time.
Yu-Wen Hsu received the Ph.D. degrees in electrical engineering from National Taiwan University, Taipei, ROC. He is currently the Chief Technology Officer responsible for developing MEMS devices and applications with smart sensing system center, industrial technology research institute, Taiwan.
He received gold medal for national innovation and creative award in 2014 and hold 31 patents in MEMS and sensors. His current research interests are in the novel navigation-grade IMU for INS, high speed MEMS voltage/current sensors for UPS/power module, multi-gases sensor with self-healing for e-nose.
Company Profile
ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.
Speaker
Yalcin Bulut
COO
Disruptive MEMS Power Technology – The Ideal Switch for Power applications
Day 2 / 09:20 - 09:40
Electromechanical Relays have been around since the 1800s, and the architecture we still see today is not drastically different than what was introduced 200 years ago. These relays tend to be very large, slow, and unreliable. The invention of transistor in semiconductor era helped to address some of those issues but they also come with big losses and inefficiencies that create significant waste heat and thermal challenges. Menlo Micro’s Ideal Switch is a revolutionary and disruptive technology that combines the benefits of electromechanical relays and solid-state switches,
offering unparallel performance, reliability, and efficiency. Developed through years of R&D which started by GE Research Lab, the Ideal Switch features a unique metal to metal contact design actuated by an electrostatic voltage on the gate electrode which forces it to close. And when we release that voltage, it opens the relay so that you have a full air gap or a zero-leakage
path for when the switch is open. In the end, it’s all about making things smaller, more powerful, and cramming more capability. Menlo Micro’s unique Ideal Switch technology provides significant energy savings, longer battery life, and lower total cost
of ownership.
Yalcin has over twenty-five years of semiconductor experience, as the Chief Operating Officer, he manages sales, marketing, quality assurance and product areas at Menlo Microsystems.
Yalcin joins Menlo Micro after serving the role of Vice President of Sales and Marketing at United Silicon Carbide (UnitedSiC, now Qorvo). Prior to that his leadership experience included Vishay, Inc. where he was the Vice President of Power Product Lines, along with Alpha and Omega Semiconductor where he guided the company’s strategic direction as Vice President of Discrete Product Lines.
Yalcin holds a Bachelor of Material Science Engineering (Solid State Physics emphasis), and subsequently earned his Master of Business at Iowa State University.
Company Profile
Menlo Microsystems is on a mission to create a more energy efficient and sustainable world with an entirely new category of electronic switches. The Ideal Switch® eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds. Menlo Microsystems is bringing more than 99 percent reductions in size, weight, power and cost to dozens of industries such as medical, aerospace and defense, telecommunications, consumer electronics, industrial IoT (Internet of Things) and test and measurement.
Menlo Micro is responsible for bringing to market the greatest electronic component innovation since the transistor with its Ideal Switch® technology.
Speaker
Ramon Borrell
CTO
Transforming Industrial Manufacturing: Harnessing the Potential of Ultra High Viscosity Jetting for Functional Printing
Day 1 / 17:10 - 17:25
The potential to transform industrial manufacturing lies in jetting ultra high viscosity fluids, merging the scalability, flexibility, and digital printing capabilities of NovoJet inkjet technology with the superior properties of functional materials. The ability to jet ultra high viscosity fluids via drop-on-demand inkjet, surpassing previous standards, was first announced by Borrell et al. in 2021. Initially, only small printheads with limited commercial capabilities had been developed and tested, with a tentative specification for a commercial printhead anticipated. Over the past three years, substantial progress has been made in optimizing the underlying actuator technology, enabling jetting of fluids with viscosities up to 250 mPa·s for Newtonian fluids. NovoJet technology is poised to revolutionize applications in fuel cells, printed electronics, MEMS, semiconductors, and more.
Ramon Borrell is a highly experienced professional in the field of Inkjet and industrial printing systems, with 30 years of experience in the industry. He has held technical leadership and executive positions for 20 years, including 14 years at HP where he led the development of large format printers and 14 years as CTO and R&D Director at Xaar, a leading company in inkjet printheads. In 2021, Ramon joined Quantica as CTO, bringing his extensive technical expertise and leadership experience to the company.
Company Profile
Quantica is an advanced additive manufacturing company headquartered in Berlin and Barcelona. Their groundbreaking inkjet-based technology, NovoJet™, transforms production by enabling the digital deposition of high-viscosity and high particle-loaded materials. With their advanced systems, users can print and combine new materials seamlessly in a single process for 2D and 3D application development. From car coatings to printed electronics to hearing aids, Quantica’s technology offers a solution.
NovoJet™ JetPack: Empowers researchers and material developers to optimize and validate new materials for NovoJet™ printheads. Future pattern printing and production integration offerings.
NovoJet™ OPEN: An inkjet-based benchtop printer with the unique capability to combine high viscosity materials.
Material validation and optimization training and service offerings available.
Speaker
Marco Pratillo
Sales Manager Semi & MEMS Test Equipment BU
Ensuring Performance and Accuracy: Production Testing Strategies for Next-Generation Environmental Sensors
Day 1 / 16:20 - 16:40
This presentation delves into the critical world of production testing for MEMS environmental sensors. As these devices play a pivotal role in the environmental monitoring in many situations (from industry, to homes, to hospitals), ensuring their correct performance is of vital importance. Manufacturers face several challenges in guaranteeing the accuracy and reliability of their sensors, whose production testing can be a complex and time-consuming process. As these devices are sensitive to multiple environmental factors and respond to various stimuli (pressure, temperature, humidity, gas, …), the key thing about their testing resides in the need to develop testing setups able to capture all the electrical and mechanical aspects of the sensor, simulating and controlling a multiplicity of environmental factors. The sensor-type specificities represent a second challenge: each sensor type might require unique testing procedures and hardware setup, and this customization can be time-consuming and costly. Finally, while many applications are requiring more accurate and sensitive devices (that means, very accurate test equipment too), achieving high-volume production requires test cost efficiency. We will showcase how the latest advancements in test equipment are revolutionizing the approach for MEMS environmental sensors, solving all these challenges.
Marco Pratillo received his M.S. degree in Electrical Engineering from the Polytechnic of Turin (Italy) in 2012. He promptly joins SPEA as part of the Product and Test Engineering Group in Electronic Industries and Custom Semiconductor Test Equipment. Starting from 2017, he relocated to Suzhou (China) as Test Engineering Manager Mems and Power Semiconductor, where he contributed to the exponential growth of the Semiconductor Division, Power and MEMs. He spent five years working closely with the Sales team aiming to affirm and expand the presence of SPEA’s products. In 2022, Marco returned to Italy in the role of Technical Sales Manager, specifically dedicated to the biggest Semiconductor manufacturing leaders in Asia.
Company Profile
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
- SPEA product portfolio includes test equipment for:
- Automotive, linear, analog mixed signal & SoC devices requiring the most advanced and powerful instrumentation. SPEA’s DOT platform addresses today’s and future roadmap needs.
- MEMS & Sensors. SPEA has been chosen by the biggest players in this market to develop the best solutions for inertial, high-g, proximity, time-of-flight, light, pressure, environmental, magnetic, acoustic sensors. SPEA equipment combines physical stimulus with a complete electrical test, fast pick&place handling, reliable contacting, tri-temp.
- Power & Discretes. DOT800 T perforfms static and dynamic measurements with extended current/voltage ranges, on the whole range of power applications: wafers, discretes (Si, SiC, GaN based), IPMs, KGDs, DBCs, IGBT modules.
- Identification. CT1000 and CT3000 are low-cost test systems dedicated to micro-controllers, RFID, UHF, combi devices. They perform complete, highly accurate measurements, offering high throughput, with high multi-site test capability at wafer test, and a fast data transfer for memory test.
Speaker
Dr. Annalisa De Pastina
Senior Scientist in Piezoelectric Microsystem Technologies
Piezoelectric MEMS Acoustic Transducers at Silicon Austria Labs: technology platforms and emerging applications
Day 2 / 09:45 - 09:55
As a top European research center for Electronic Based Systems, Silicon Austria Labs´mission is to accelerate technological growth from idea to innovation within the major market tendencies on the global arena. The Microsystems Research Division develops cutting–edge MEMS technologies, from design and proof–of–concept to product prototypes, connecting key industrial and scientific players along the value chain. In her presentation, Dr Annalisa De Pastina, Senior Scientist in PiezoMEMS Microsystem Technologies, will describe the latest technology platforms for acoustic piezoMEMS development. The talk will focus on MEMS microphones and Piezoelectric Micromachined Ultrasonic Transducers, and will discuss emerging technologies and challenges related to design, fabrication and material development.
Dr. Annalisa De Pastina is an expert in M/NEMS and piezoelectric transduction. She has 10 years of experience in the field of nanomechanical sensors and actuators, specializing in microtechnology and piezoelectric thin films. In 2014, she graduated in Biomedical Engineering from Sapienza University of Rome, Italy, and in 2018 she obtained her PhD in Microengineering from EPFL, Switzerland. Dr. De Pastina is currently a senior scientist in piezoMEMS at Silicon Austria Labs, where she leads pivotal industrial collaborations and international projects focused on the development of novel piezoelectric MEMS sensors and actuators, such as MEMS microspeakers, microphones and ultrasonic transducers.
Company Profile
Silicon Austria Labs (SAL) has been founded to be a top European research center for electronic-based systems. In the network of science and economy, we carry out research at a global level and create the basis of groundbreaking products and processes.
Speaker
Tarik Souibes
Product Marketing Director
It is not only about AI in MEMS and sensors
Day 1 / 09:35 - 09:55
Sensors have become ubiquitous, blurring the line between being online and offline. AI plays a key role in sensors, enabling real-time context understanding and the ability to make decisions aimed at optimizing and reducing the power consumption of the final device. Sensors are no longer merely for data collection; thanks to AI, they can interact with their environment and significantly contribute to innovation and sustainability.
Tarik Souibes holds a master’s degree in physics and graduated from an engineering school with a specialization in materials dedicated to microelectronics. He joined ST in 1998 as a technical marketing engineer. With more than 26 years of experience at the company, Tarik has held various roles and responsibilities, dealing with a wide range of products including power, analog, and sensors.
Today, Tarik is responsible for product marketing for sensors within the ST MEMS Sub-Group.
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Speaker
Eric Aguilar
CEO
MEMS Breaks Through the AI Bottleneck
Day 1 / 10:00 - 10:20
AI serves as the computational brain for advanced electronic applications, requiring high-quality sensory data to interact effectively with the environment. Emulating sophisticated sensory systems at a micromachined scale, MEMS technologies bridge this gap to enhance AI’s potential. Current advancements in MEMS — particularly in areas such as 3D LiDAR sensors, tactile sensors for robotics, and high dynamic range microphones —are pivotal in overcoming common AI bottlenecks. Additionally, MEMS integration can streamline neural networks, facilitating more efficient AI workflows. This talk will explore how MEMS technologies address crucial performance, reliability, stability and cost issues, thereby opening new market opportunities and significantly impacting future industry trajectories. We will also discuss how MEMS mitigates the power and thermal challenges posed by increasingly powerful and energy-intensive GPUs.
An award-winning entrepreneur, Eric is a visionary leader in the field of advanced sensor systems for complex systems such robotics and autonomous platforms.
Throughout his distinguished two-decade career, Eric’s passion for sensor design and innovation has made him a key player in the industry. His expertise includes leading teams at renowned companies such as Tesla, where he managed a crew of 300 engineers on the firmware for Model 3, and at X, where he spearheaded the development of Google Project Wing, an autonomous drone delivery service.
Eric’s expertise in sensor integration includes a leadership position at various renowned robotics companies. His role in steering product development for a sensor company later acquired by Google — as well as his pioneering work building sensors for drones at US Navy Research Labs — further showcase his depth of experience.Eric earned a BS in Electrical Engineering from California State Polytechnic University and completed the Stanford Entrepreneurship program. His work continues to shape the future of MEMS and sensors technology, making him a sought-after thought leader and speaker in the field.
Company Profile
Omnitron Sensors is rewriting the script on building high-performance low-cost sensors for the world of tomorrow. Leveraging its executive team’s extensive experience designing, fabricating, and using MEMS sensors, Omnitron has developed a “new topology for MEMS” that addresses some of the most pressing pain points in MEMS manufacturing.
Featuring the clever arrangement of silicon process steps and a new packaging method, Omnitron’s topology significantly improves performance to produce robust, rugged, reliable, repeatable, and low-cost MEMS sensors in high volumes by leveraging commercial MEMS foundries.
The company’s first proof point of its new topology for MEMS is a large, robust, low-cost, MEMS scanning mirror for long-range LiDAR.
Speaker
Volker Herbig
VP BU Microsystems
Industrialization challenges for advanced packaging in foundry environment
Day 1 / 14:15 - 14:35
(Virtual Presentation)
MEMS process sequences and capabilities are frequently reused for advanced packaging and 3D integration applications. Bringing these to market presents multiple technology and business model challenges. This presentation will discuss progress and future trends.
Volker Herbig, VP BU Microsystems at X-FAB, oversees all MEMS activities within the X-FAB Group. Before assuming his current role, Volker worked as Director Product Marketing at X-FAB. Previously he held also engineering, marketing and management positions at Siemens, Inkjet Technologies and Carl Zeiss where, among other activities, he developed MEMS inkjet print heads and was responsible for setting up a manufacturing facility for those. Volker Herbig holds a master’s degree in physics from Humboldt University, Berlin, Germany.
Company Profile
X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.
Speaker
Dr. Michael Eritt
Head of Department Engineering
European Chips Act (EUCA) and the FMD Pilot line “Advanced Heterogenous Systems Integrations (AHSI)”
Day 2 / 15:40 - 16:00
The European Chips Act will reinforce the semiconductor ecosystem in the EU, ensure the resilience of supply chains and reduce external dependencies. It is a key step for the EU’s technological sovereignty. The Research Fab Microelectronic Germany (FMD) propose the setup of an Advanced Heterogenous Systems Integration Pilot Line (AHSI-PL), which offered to Europe´s microelectronics community the world´s most comprehensive chiplet integration pilot. The pilot line will encompass an unprecedented range of device technologies, materials, enabled by world class system design, interconnect- and assembly techniques as well as characterization, test, reliability and security assessment. Our mission is to establish and operate a pilot line, which offers to European industry including start-ups, SMEs, verticals, Integrated Device Manufactures’(IMD’s) as well as R&D institutions innovation capabilities through advanced heterogeneous systems, based on Chiplets and novel Advanced Packaging Technologies and will have an open access. The presentation gives a strategic overview about the foundation and participation in the European Chips Act.
Dr. Michael Eritt heading the Engineering Department for the MEMS and CMOS 200 mm cleanroom. He joined Fraunhofer IPMS in 2020 as group leader and was responsible for the technology development of MEMS scanners. Prior joining Fraunhofer he worked 10 years in the lighting and PV industry as product developer of OLED lighting modules and manager back-end with focus on scaling production from lab to fab for organic solar films. Michael Eritt graduated in Microsystem Technology in 2003 and received his PhD in electrical engineering from Technical University of Chemnitz in 2010.
Company Profile
Fraunhofer IPMS is a leading international research and development service provider for electronic and photonic microsystems in the application fields of Smart Industrial Solutions, Bio and Health, Mobility as well as Green and Sustainable Microelectronics. Research focuses on customer-specific miniaturized sensors and actuators, MEMS systems, microdisplays and integrated circuits as well as wireless and wired data communication, neuromorphic and quantum computing. Services range from consulting and design to process development and pilot series production.
The Fraunhofer IPMS is one of 75 institutes of the Fraunhofer-Gesellschaft, the leading organization for applied research in Europe. With nearly 32,000 employees Fraunhofer operates with an annual budget of €3.6 billion, €3.1 billion of which is generated by contract research — Fraunhofer’s core business model.
The range of services includes wafer processing, characterization & testing, assembly and interconnection technology and the organization of external and supplier services. At the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS offers applied research, process and material development on 300 mm wafers for microchip producers, suppliers, device manufacturers and R&D partners. 4000 m² of clean room space is available for processing customer orders as well as laboratory space for over 80 processing and analytical tools.
Speaker
Stefan Martens
Sr Director, MEMS and Sensor BU
Advance Packaging for Automotive MEMS and Sensors
Day 1 / 11:55 - 12:15
Automotive MEMS based Actuator / Sensor and Optical Sensor devices continue to enable new exciting functionalities and applications in the automotive market — in Safety, Entertainment, Passenger Convenience and Advance Driver Assistance Systems (ADAS).
Increasing autonomous levels in the Automotive market requires higher performance for positioning and localization, inertial navigation and object detection / recognition while meeting government recommended or mandated implementation dates. These new functions and applications require more Advance Packaging Technologies, Heterogenous integration and Standard platforms.
The MEMS and Sensor Industry is evolving from a discrete single MEMS/sensor (leadframe + wirebond based packages) towards new packaging and interconnection technologies – such as a new standard Optical Packaging Platform or the use of Cu Pillars to interconnect devices. And increasing complexities require closer collaboration between the different stakeholders in the MEMS Actuator / Sensor and Optical Sensor Ecosystem.
Stefan joined Amkor Technology in 2019 and currently serves as a Senior Director for MEMS and Sensor Products. He manages assembly and test services for large volume automotive and consumer MEMS sensors for European customers. Stefan has 18 years of experience in the semiconductor industry and held positions at Infineon and Huawei in Germany, primarily in the field of RF devices and modules prior to joining Amkor. He has been issued 15 patents and holds a MSc in Applied Physics as well as a PhD in Microsystem Engineering from the University of Freiburg, Germany.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Speaker
Jakob Spoetl
Head of Acoustics
MEMS speakers – the ideal earphone tweeters
Day 1 / 09:10 - 09:30
In this presentation, Jakob will provide an overview of the MEMS loudspeaker industry from USound’s perspective, highlighting interesting trends. A focus will be placed on the potential of MEMS speakers as tweeters in 2-way earphones. Jakob will explain the technical advantages MEMS bring to this specific application and how these advantages benefit the market and ultimately enhance the user experience.
Jakob Spötl works as head of acoustics in the R&D department of USound. He is one of the first employees of USound and joined the company in 2015, right after finishing his studies in electrical and audio engineering at the TU Graz in Austria. His main interest was (and still is) the multidisciplinary; combining knowledge from different fields. Therefore, his main expertise lies in understanding and modeling of the interplay between different physical domains (electronics, mechanics, and acoustics). Combining this with real-world applications and the resulting psychoacoustic experience is what he thrives on.
Company Profile
USound GmbH is a fast-growing company that develops advanced audio solutions based on MEMS speaker technology. Headquartered in Austria and with offices in Shenzen, China, USound enables its global customers to bring new revolutionary audio products to the market.
USound is disrupting the audio industry, setting new standards in audio experience. The company achieves this through radical miniaturization, power reduction, and increased production efficiency. USound MEMS speakers are ideal for state-of-the-art TWS earphones, IEMs, audio and AR/VR glasses, OTC hearing aids, and various consumer electronics products. The company’s audio products are safeguarded by over 370 patents.
Leadership:
Ferruccio Bottoni, CEO & Co-Founder
Andrea Rusconi, CTO & Co-Founder
Herbert Gartner, CFO & Chairman
USound provides advanced audio solutions based on MEMS technology. USound’s products include MEMS speakers, audio modules, amplifiers, software, evaluation kits and reference designs. USound MEMS speakers, in particular, are distinguished for their small size, lightweight components, and unparalleled audio performance. They are the ideal solution for a wide variety of applications, from TWS earphones and OTC hearing aids to AR/VR glasses and medical devices.
Speaker
Alastair Attard
Director of Technical Program Management & Business Development
The Sensorization of the Modern Vehicle
Day 1 / 14:40 - 15:00
Vehicles have undergone remarkable changes over the last decades, with semiconductor sensor content increasing dramatically in recent years as more safety and comfort applications are implemented in today’s cars. These sensors need to fulfil their performance requirements whilst concurrently being able to meet stringent automotive reliability criteria – and achieve this in small form factors, adequate cost levels, and with fast time to market. This poses significant challenges to sensor packaging and testing facilities, especially when considering that sensor packages can differ significantly and the package itself is a major contributor to the sensor performance. In this presentation, we will look at how vehicles have evolved to become the collection of sensors they are today, discuss some of the key sensor applications and package structures used for said applications, and give some perspective of packaging trends observed for the next generation of automotive sensors.
Alastair Attard is Director of Business Development at UTAC Group. He has a Bachelor’s degree in Mechanical Engineering and an Executive MBA from the University of Malta, and has over 18 years of experience in the assembly & test of semiconductor devices.
Prior to joining UTAC, Alastair worked at STMicroelectronics firstly as part of the process engineering team for flip chip and SiP, and later in process and package development for MEMS packages. He later joined Besi, where he was manager of the process development group, with focus on advanced die attach and pick & place technologies.
Alastair joined UTAC in 2018, focusing on technical program management and assembly business development in the European region. Today he is responsible for worldwide business development of assembly and test solutions for semiconductor devices at UTAC with particular focus on MEMS, Sensing, and Advanced Packaging.
Company Profile
UTAC is a leading independent provider of assembly and test services for a broad range of semiconductor chips with diversified end-use applications including communication, consumer, computing, automotive, security, industrial and medical. Our customers include fabless companies, integrated device manufacturers and wafer foundries.
UTAC is headquartered in Singapore with more than 12 production facilities. Our global sales network is widely focused on five regions: the United States, Europe, China and Taiwan, Japan and the rest of Asia with sales offices located in each of these regions.
Speaker
Pierre-Marie Visse
Senior Technology & Market Analyst, MEMS & Sensing
Exploring the latest and future MEMS trends
Day 2 / 11:55 - 12:15
The global MEMS market is steadily growing to reach $20+ billion at the end of the decade. MEMS sensors and actuators can be found in variety of systems, from wearable to smart cities. Ongoing mega-trends such as the electrification of cars, autonomous driving, and Industry 4.0 are reshaping the growth of the MEMS & Sensors business, by giving tailwinds to specific devices and applications. Microspeakers, PMUT, MEMS oscillators or cooling systems are the new kids on the block of the MEMS industry.
Pierre-Marie Visse is Senior Technology & Market Analyst, MEMS & Sensing at Yole Group. He is working within the Photonics & Sensing team. Pierre-Marie contributes daily to the technical, marketing, and strategic analysis on various MEMS and sensing technologies.Prior to Yole Group, Pierre-Marie served as an R&D project manager at eLichens, specializing in the detection of environmental gases, for more than 2 years. His primary focus was the development of gas sensors and IoT for gas detection. Previously, Pierre-Marie worked at TDK-Tronics for more than ten years as an inertial MEMS designer for custom sensors, accelerometers, and gyroscopes. He then worked as an R&D project manager for the navigation, industrial, and watchmaking industries. Pierre-Marie graduated from ESIEE-Engineering (France) in 2010, specializing in microsystems.
Company Profile
Yole Group is an international company recognized for its expertise in the analysis of markets, technological developments, and supply chains, as well as the strategy of key players in the semiconductor, photonics, and electronics sectors.
With Yole Intelligence, Yole SystemPlus and Piséo, the group publishes market, technology, performance, reverse engineering and costing analyses and provides consulting services in strategic marketing and technology analysis. The Yole Group Finance division also offers due diligence assistance and supports companies with mergers and acquisitions.
Yole Group benefits from an international sales network. The company now employs more than 180+ people.
More information on www.yolegroup.com.
Company phone:
+33 472 83 01 80
Speaker
Corrado Rocca
R&D Head, Cyber Unit
Smart tires : powerful sensors for modern mobility
Day 2 / 13:25 - 13:45
- Smart tires are becoming relevant actors in modern mobility applications thanks to the technology maturity they have reached.
Their sensing capabilities are exploited while vehicles are circulating, generating broad data sets from the interaction of tires with roads.
Through data processing and sector specific know-how, sophisticated algorithms provide unique insights towards safety, performance, sustainability and servitization.
The paper will highlight the technical and ecosystem challenges that must still be faced to ensure the widest adoption, offering some concrete examples of deployed applications in different business environments.
During his career, Corrado held several managerial roles in telco, media, IoT, communications and automotive industries, mainly in technical, product and business areas.
He is currently heading in Pirelli Tyre the R&D department developing tyre connectivity solutions, for OE and aftermarket applications. He is leading for Pirelli several international standardization initiatives in the field of future mobility.
Company Profile
Established in Milan in 1872, Pirelli is a major player in the tyre industry and the only global manufacturer focused solely on the Consumer tyre market, which includes tyres for cars, motorcycles and bicycles. With a distinctive positioning in High Value tyres, the Group stands as a global brand known for its cutting-edge technology, high-end production excellence and passion for innovation that draws heavily on its Italian roots.
With 18 production plants in 12 countries, around 31,000 employees, a turnover of about €6.65 billion in 2023, Pirelli has a commercial presence in over 160 countries.
Pirelli’s technological excellence is also nourished by the innovation and competencies derived from sporting competitions, in which it has been active for over 115 years. At present, the company participates in over 350 car and motorcycle sport events and since 2011 it has been the Global Tyre Partner to the Formula One™ World Championship.
Thanks to a strong commitment in research and development, Pirelli has over 2,000 people engaged in R&D located at its Milan headquarters and 12 local technology centers and a portfolio of 6,000 patents.
In 2023, Pirelli’s investment in R&D equaled 5,4% of its revenues from High Value products.
Pirelli has a distinct positioning in high value tyres, characterised by an advanced technology with more than 3,600 patents obtained in order to achieve the highest levels of performance, safety and containment of environmental impact. The company has always been strongly committed to research and development, in which it invested 6% of revenue from high-value products in 2020. Involved in motorsport since 1907, Pirelli has been the exclusive official tyre partner of the Formula 1™ World Championship since 2011 until 2024 and has been the Official Single Supplier of WorldSBK since 2004. Since 2021, Pirelli has also been the exclusive supplier of the FIA World Rally Championship: a championship in which Pirelli has already developed some of its most advanced technologies, which have subsequently been transferred to road products.
Pirelli & C. SpA , Via Bicocca degli Arcimboldi , 3 – 20126 Milano Tel. +39 02 64421 – www.pirelli.com
Speaker
Dr. Andreas Charles Voelker
Business Development, Micro- & Nanotechnologies
CSEM, a MEMS and PICs powerhouse in the Swiss industrial ecosystem
Day 2 / 14:15 - 14:35
CSEM is a non-profit-oriented public-private Swiss technology innovation center renowned for developing advanced micro- and nanotechnologies. From high-performance materials to innovative processes, CSEM pushes the boundaries of microfabrication technologies to develop unique MEMS solutions. During the talk some of our most recent developments will be presented, including wafer scale micro-lens arrays, rubidium vapor cells for atomic clocks, our unique thin film lithium on niobate insulator (TFLN) PIC platform or the aerosol jet printing technology.
- Scientist (PhD in physics) with 20+ years of experience in Photonics\
- Expertise in development of photonic based analytic/diagnostic devices in regulatory environment
- Extensive knowledge in interdisciplinary R&D project management, technology transfer, business development, coaching and consulting specifically at the interface of industry and research
- Start-Up coaching
- Married, two children
EDUCATION
Ph.D. in Nanophotonics, University of Fribourg, Switzerland, 2007
Diploma in Physics, Humboldt Universität Berlin, Germany, 2002
SOME WORK EXPERIENCE
CEO, LS Instruments AG, Fribourg, Switzerland (12 years)
Roche Diagnostics, Germany
Ypsomed, Burgdorf, Switzerland
CSEM, Neuchatel since 2021
Company Profile
CSEM is a non-profit-oriented public-private Swiss technology innovation center renowned for developing advanced technologies with profound societal impact. Our mission is to transfer these innovations to industries, strengthening the economy. We are changing the face of the MEMS field by developing and industrializing processes for emerging materials and devices. With a multidisciplinary team and ISO-9001 standards, we provide a comprehensive one-stop-shop for the entire innovation chain. About CSEM – MEMS for a smarter future
CSEM is a non-profit-oriented public-private Swiss technology innovation center renowned for developing advanced technologies with profound societal impact. Our mission is to transfer these innovations to industries, strengthening the economy. We are changing the face of the MEMS field by developing and industrializing processes for emerging materials and devices. With a multidisciplinary team and ISO-9001 standards, we provide a comprehensive one-stop-shop for the entire innovation chain. From high-performance materials to innovative processes, we push the boundaries of microfabrication technologies. Our unique lithium on niobate insulator (LNOI) platform enables nonlinear photonic integrated circuits (PIC). In addition to our cutting-edge R&D we offer tailored devices including MEMS and LNOI PIC foundry services, and MEMS characterization and reliability testing. CSEM contributes to the development of reliable and advanced MEMS that pave the way for a smarter future.
MEMS and PIC manufacturing capability
With our state-of-the-art cleanroom, we support you from pre-feasibility studies to small and medium series production of MEMS and PICs. Our team of experienced and dedicated people ensures you a long-term relationship. We combine rigorous industrial practices with flexibility and innovative spirit.
Our capability at a glance
• 700 m2 clean room class ISO5
• 150 mm state-of-the-art tools
• Working on Si, SOI, Fused Silica, Glass, SiC, YSZ, TFLN and other specialty substrates
• ISO9001:2015 and ISO 140001:2015 certified
• TFLN/LNOI foundry offering MPW and custom runs
Keynote Speaker
Stefan Rombach
Head of MEMS
MEMS inertial sensors for navigation applications
Day 2 / 08:55 - 09:15
Northrop Grumman LITEF started the development of micro-electromechanical systems (MEMS) gyroscope chips with Deep Reactive Ion Etching (DRIE) in 2003. Based on this technology, a six degree of freedom MEMS IMU was developed for navigation applications. After successful transfer from early MEMS IMU prototypes to series production, NG LITEFs IMU is available since many years with a specified bias error of 4 deg/h and an angular random walk (ARW) of 0.15 deg/sqrt(h) over temperature. Recently an European Technical Standard Order (ETSO) for the MEMS based Attitude Heading Reference System (AHRS) LCR-350B was received, so that NG LITEF is able to supply the first purely MEMS based AHRS worldwide to the avionic helicopter and fixed-wing market. Next generation avionic systems require even higher performing MEMS sensors. Northrop Grumman LITEF is addressing these needs with the next generation MEMS sensors.
Stefan Rombach received the Phd. degree in microsystems engineering from the University of Freiburg, Freiburg, Germany. He was working as a member of the scientific staff at the chair of microelectronics in the field of readout interfaces for MEMS inertial sensors and MEMS micro-mirrors based on low-power system design and Delta-Sigma modulation. Since 2018, he has been with Northrop Grumman LITEF, Freiburg, Germany, where he is working as Head of the MEMS department in the field of inertial sensor systems development.
Company Profile
LITEF is one of the leading companies in the development and manufacturing of navigation and sensor systems. The company’s expertise is based on German technology for mechanical, fibre optic and micromechanical inertial sensors. This enables ITAR-free distribution of LITEF products around the globe.
Founded in 1961 and headquartered in Freiburg im Breisgau (Germany), the company’s product range includes MEMS sensors based inertial measurement units, attitude and heading reference systems, inertial navigation systems and inertial reference systems. In close dialogue with the customer, specific product solutions are developed for measurement and navigation tasks with maximum precision and reliability requirements.
LITEF inertial navigation products, like MEMS sensors, MEMS inertial measurement units, MEMS based attitude and heading reference systems, are in use worldwide with applications ranging from civil and military aviation, land and marine applications to industrial solutions.
Keynote SpeakerVirtual Speaker
Pierre Chastanet
Head of Unit of “Microelectronics and Photonics Industry” Unit, DG CNECT
Enhancing Europe’s Leadership in MEMS & Sensors: Seizing Opportunities with the EU Chips Act
Day 2 / 08:30 - 08:50
(Virtual Presentation)
MEMS sensors and actuators bridge the natural and virtual worlds, unlocking the potential of digital technologies across key industries like automotive, manufacturing, and healthcare. This sector is thriving, showing consistent growth, with Europe leading the charge through its advanced companies and world-class research institutions. Strengthening Europe’s presence in this sector is crucial for maintaining its leadership in the digital revolution. The European Commission is dedicated to sustaining this growth and enhancing Europe’s position in the field, recognizing the strategic importance of the MEMS sector. The EU Chips Act is designed to support this by addressing challenges across the entire semiconductor value chain, benefiting the MEMS sector through enhanced collaboration, research, and funding. This legislation aims to create a more resilient and innovative ecosystem for European MEMS manufacturers and developers. In this keynote, we will provide an overview of the EU Chips Act, highlighting the vast opportunities it offers, including access to world-leading research and innovation platforms, as well as various funding opportunities tailored for the MEMS sector.
Pierre Chastanet is Head of the Unit for Microelectronics and Photonics Industry at the European Commission, where he manages the development of European semiconductor policy and the implementation of the European Chips Act.
Mr. Chastanet has been working for over 17 years in the European Commission, supervising different digital policies in the areas of cloud, data flows, software, cybersecurity, privacy, green ICT, and telecom innovation.
Prior to that, Mr. Chastanet gained more than 10 years of ICT experience, mostly in various IT management positions in a large multinational company.
He graduated from Telecom ParisTech, the Free University of Brussels, and the London School of Economics and Political Science. He also earned a Leadership Executive Certificate from Harvard Kennedy School of Government.
Company Profile
The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.
Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.
The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.
Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.
Speaker
Filipe Alves
Staff Researcher
From Concept to Application: INL’s Breakthroughs in MEMS Technology
Day 2 / 16:05 - 16:25
The International Iberian Nanotechnology Laboratory (INL) is a research centre equipped with state-of-the-art microfabrication and characterization facilities. Aiming to be a global leader in nanotechnology innovation, INL focuses on strategic research areas, with MEMS as a crucial enabling technology. In this presentation, Dr. Filipe Alves, a Staff Researcher in the Integrated Micro and Nanotechnology Research Group, will highlight some of the key contributions in MEMS technology. Topics will include high-resolution inertial sensors for space gravimetry, multi-mass devices with 3-axis sensitivity, and an all-silicon, multispot 2D MEMS mirror.
Dr. Filipe Serra Alves is currently a Staff Researcher within the Integrated Micro and Nanotechnologies Research Group at INL – International Iberian Nanotechnology Laboratory, Portugal. His research is focused on the development of new integrated systems that range from the design and fabrication of MEMS devices, to the instrumentation and control electronics, both at the discrete and integrated level.He obtained his PhD in microelectronics in 2017, specializing in pull-in based MEMS inclinometers with integrated mixed-signal electronics, from the University of Minho, Portugal, in collaboration with the Delft University of Technology, The Netherlands. Prior to joining INL as a Research Fellow, he served as an assistant professor in the Industrial Electronics Department at the University of Minho. Recently, he has been working in new sensor concepts, including polyimide-based flexible devices and high-resolution MEMS inertial sensors, with a particular interest in FPGA and ASIC-based high-performance digital systems. As a principal investigator, he has coordinated several research projects targeting new transduction mechanisms and working principles, aiming to push the boundaries of MEMS technology. Dr. Alves has authored numerous high-impact publications and serves as a reviewer for top-tier journals in the field, including IEEE Sensors Journal, Journal of Microelectromechanical Systems, Sensors and Actuators A: Physical or Nature Scientific Reports.
Company Profile
The International Iberian Nanotechnology Laboratory is one of the main international research centres dedicated to nanoscience.
The Laboratory is an intergovernmental organization founded in 2005 upon a joint agreement between Portugal and Spain. Today, it houses a multicultural community of more than 400 researchers from 30 nationalities with various scientific backgrounds. Headquartered in Braga, northern Portugal, INL focuses on strategic research areas that deepen our understanding of fundamental phenomena, serving as the basis for the development of innovative technologies.
Key areas include clean water, clean energy, zero hunger, good health, and overall well-being. INL’s mission is two-fold: to carry out excellent research in nanotechnology, and to engage with society by means of technology transfer and public outreach. This twin approach guides the organisation to navigate the unknown universe of science, and to identify new research areas at the intersection of established knowledge fields. The overarching objective is to advance research anchored in nanotechnology towards new science and novel methodologies, and to devise nanotechnology-based solutions, in the physical and human environments, mediated by cutting-edge research in information and communication technologies.
TBC
Speaker
Bo Cui
Senior Director of Research
SITRI – MEMS Sensor and SiPh R&D Pilot Line Platform
Day 2 / 11:30 - 11:50
Dr. Bo Cui is currently the senior director of research at SITRI (Shanghai Industrial micro-Technology Research Institute). He received his BS from Peking University in 1994, and his PhD from Princeton University in 2003. After PhD, he joined the National Research Council of Canada in 2003, and then Department of Electrical and Computer Engineering, University of Waterloo (Canada). He was a visiting researcher to SITRI in 2022, and joined SITRI in January 2024. His research focuses on the development of cleanroom MEMS/micro-nano-fabrication technologies. He is the author for 125 journal publications and 130 conference publications/presentations.
Company Profile
Shanghai Micro-Technology Industrial Research Institute (SITRI) was established in 2013 by Shanghai Science and Technology Commission, Jiading District Government and Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. It is a R&D and transformation functional platform integrating R&D, engineering, industrialization and cultivation, providing in-depth process technology support and services for innovative enterprises and partners. SITRI was established under the guidance of Shanghai Lianhe Investment Co., Ltd.’s strategic mission of serving the national strategy and being a pioneer in scientific and technological development. It relies on the “three-in-one” innovation architecture model of Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. With the support of the technical strength of Shanghai Institute of Microsystem and the investment and operation model of Shanghai Xinwei Technology Group, it has established close cooperative relations with many domestic and foreign production, learning and research organizations, realized the efficient industrialization of innovative achievements, and accelerated the establishment of the “More than Moore” industrial ecosystem.
· SITRI has the first 8-inch “More than Moore” R&D pilot line in China, providing “More than Moore” core process technologies such as MEMS, silicon photonics, and biochips, and providing efficient R&D, pilot and verification services for semiconductor companies such as design, equipment and materials, realizing seamless connection from R&D to small batch production.
· Up to now, SITRI has applied for 877 patents, 697 invention patents, including 56 PCT (international patent) patents. · SITRI is based in Shanghai, facing the Yangtze River Delta, and radiating across the country, and has initially formed an industrial ecosystem in the field of “More Than Moore”.
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