2-3 December 2025
Tokyo
22-23 September 2025 - Shanghai
POMME was established in 2015 and is located in Hsinchu, Taiwan. It is engaged in high-end wafer test integration and design services for the semiconductor industry, focusing on providing you with the most efficient wafer parameter test solutions. Such as IC Design house, foundry, IDM, testing company, assembly and packaging company, etc., to simplify work for engineers in different departments (such as: technology research and development, quality and reliability assurance, failure analysis, manufacturing, etc.). POMME can help turn all the measurement and analysis under numerous test results into a simple job, speeding up product throughput throughout semiconductor production.
POMME is the solution partner of Keysight Technologies, a world-renowned instrument manufacturer. With more than 16 years of long-term cooperation experience, POMME has developed into the only and most reliable partner of customers among semiconductor industry test integration system providers, with the most professional The technical team, adhering to the spirit of quality first and customer satisfaction, grows together with customers and employees.
Since its establishment, it has served the semiconductor industry chain in the Asia-Pacific region, with more than 300 customers. We use experienced teamwork to run your test work quickly and efficiently. We can provide test solutions that meet your unique needs every time.
POMME possesses the leading wide-bandgap semiconductor automotive electronic components and module test solution technology, and has officially become the exclusive distributor of ipTEST LTD. in the UK. It can provide a full range of measurement solutions more efficiently to meet your needs.
main products:
Power semiconductor wafers, chips, components, and power module testing solutions.
Electrical test probe station (manual/semi-automatic/automatic), all electrical test probe station standard/custom configuration.
Electrical test system upgrade/maintenance/calibration/expansion (HP/Agilent/HP/Keysight/Keithley).
OST (Entrusted Measurement)/WBG/Low Current/Reliability/Burn-In.
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
NEXTIN is a global leading company in the fields of process defect detection and metrology with its proprietary technology and development of innovative ideas in semiconductor and display industries.
With its superior defect detection technology and metrology solutions for its world-wide customers, Nextin is helping its users achieve early process stabilization from the initial R&D phase and maximize their profits during mass production.
Nextin’s headquarters is in Dongtan, Hwasung, Korea and its Software Development Center is in the Technical Golden Triangle in Israel to provide high-quality solutions and technical support to its global customers.
AEGIS
:Patterned Wafer Inspection System for planar device process
2-dimensional Image Processing technology
IRIS
:Patterned Wafer inspection systems for 3-dimensional process
Through-focus Scanning Optical Microscope technology
KROKY
:High Performance Macro Inspection System
Pattern Dimension & Coplanarity Metrology
ResQ
:Electrostatic Charge Removal System
Enhancement of EUV Process Yields
by Removing Surface & Embedded Electric Charges in Film Stacks
Established in 1974, Plasma-Therm is a global manufacturer of advanced plasma processing equipment, providing tailored solutions to the specialty semiconductor markets, including wireless, power devices, photonics, sensors, and MEMS, advanced packaging, memory, and R&D. Plasma-Therm’s products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of Plasma-Therm’s global customer base.
Phone: +1 727-577-4999 or information@plasmatherm.com
Plasma-Therm’s product portfolio includes single wafer, batch, and cluster solutions for Etch (ICP, RIE, DSE, IBE, ALE); Deposition (PECVD, HDPCVD, F.A.S.T); Material Modification (HDRF, RTP); and Die Singulation Applications (PPDOT). Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of our global customer base.
When your expedited shipment needs to reach its destination fast, we do whatever it takes to make it happen. We are more than an international courier, we are your partner in emergency logistics. We understand your challenges and work tirelessly to find the perfect solution for every urgent shipment. Delivering customized, reliable, and efficient NFO and hand-carry solutions for time and mission-critical shipments from anywhere to everywhere in the world. CNW is a major supplier in the Semiconductor and Automotive Industry. In an aircraft on ground situation, getting the plane back in the air is priority #1. With global 48 offices worldwide, plus an arsenal of loyal local logistics partners, CNW is ready to take on your logistic challenges.
General email: info@cnwglobal.com
Phone number:
+1.800.852.2282
+1.718.656.7777
NFO
Our Next Flight Out service is what we’re known for. CNW’s longstanding relationships with airlines, paired with our unwavering determination and creative mindset, allow us to get your package to its destination on the fastest route possible – at a substantial cost savings.
We analyze every variable – such as connecting flight schedules, last minute delays, traffic, office operating hours and weather – before determining the fastest route to get your package to its destination. In fact, CNW’s dedicated team monitors each package as it passes through 16 unique milestones to ensure the trip goes smoothly. But you don’t have to worry about the process. We make it simple for you to move your expedited shipments – leave the logistics to us.
OBC
We analyze every variable – such as connecting flight schedules, last minute delays, traffic, office operating hours and weather – before determining the fastest route to get your package to its destination. In fact, CNW’s dedicated team monitors each package as it passes through 16 unique milestones to ensure the trip goes smoothly. But you don’t have to worry about the process. We make it simple for you to move your expedited shipments – leave the logistics to us.
Our On-Board Courier (OBC) service is secure, reliable, and gives your package that extra special care. All CNW couriers are highly trained and will transport your goods using only the best practices. Moving your shipment via On-Board Courier is as easy as making a phone call. Whenever you need us, we’re here.
ACF
Occasionally, there are extreme situations when the only way to get your package to its destination on time is with an air charter. When that happens, CNW has got you covered. We can charter an aircraft dedicated solely to your shipment – large or small – to guarantee on time delivery of any package.
CuNex offers copper sinter pastes and preforms for high-power electronics packaging (die attach, substrate attach, die topside attach). Our copper-based interconnect materials follow a low pressure and rapid sintering approach ensuring improved reliability and performance at a substantial cost advantage over silver sintering.
After 7 years of extensive research, CuNex launched the Cuprum series of sinter pastes and CuForm sinter preforms. The copper pastes and preforms are suitable for Si, SiC and GaN devices as well as high power LEDs.
Specialized engineering solutions also allow for sinter lamination of substrates and die attach supporting embedded chip technologies.
The product development and volume manufacturing are driven by SCHLENK with a history of 150 years in copper and copper alloys.
The Cuprum pastes and CuForm preforms have class leading features:
– Low cost
– Fast drying in air
– Low sintering temperature and pressure
– Rapid sintering process
– High thermal conductivity
– Flexibility on die size and standard metallizations
– No nanoparticles
– Storage at room temperature for up to 6 months
D-SIMLAB Technologies is a software company providing high-performance, AI-enabled, simulation-based Digital Twin solutions for business analytics and decision support in asset-intensive industries, with a focus on Semiconductor Manufacturing (D-SIMCON suite) and Aviation Maintenance, Repair and Overhaul industries (D-SIMSPAIR suite).
D-SIMLAB is a spin-off company from the Singapore Institute of Manufacturing Technology (SIMTech) under the Agency for Science Technology and Research (A*STAR). The head office is in Singapore, and D-SIMLAB also has representations in Germany, the US, Malaysia and China.
D-SIMCON solutions have been implemented with more than 10 IDM/Foundry/DRAM/LED customers operating more than 30 fabs worldwide, both 150mm/200mm and 300mm, as well as Assembly & Test. D-SIMLAB’s success lies in deploying production-ready solutions portraying many domain-specific characteristics, essential for the generation of operationally feasible plans and schedules, enabling customers to extract immediate value.
Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com
NAURA has always upheld its mission to propel the industry forward and unlock infinite possibilities. The company has its roots in the foundational semiconductor products sector and focuses on semiconductor equipment, vacuum and Li-ion battery equipment, and precision electronic components. Its products are widely applied in integrated circuits, advanced packaging, semiconductor lighting, third-generation semiconductors, new energy photovoltaics, new displays, vacuum heat treatment, new energy Li-ion batteries, and other fields. NAURA is committed to becoming a trusted leader in the sector of foundational semiconductor products.
NAURA’s main products include high-end semiconductor process equipment and key components like etchers, PVD systems, ALD systems, CVD systems, oxidation/diffusion furnaces, cleaners, and gas mass flow controllers. These are widely used in integrated circuits, advanced packaging, semiconductor lighting, MEMS, power semiconductors, compound semiconductors, new energy photovoltaics, and flat panel displays, providing solutions for the semiconductor, new energy, and new material sectors.
Naso Tech founded in 2018, has been focused on designing and manufacturing high-end equipment for advanced materials. Our core team members are from University of Cambridge and well- known industry firms, who bring strong and wealth of expertise to the company.
We are experienced in the field of advanced semiconductor manufacturing equipment, including chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), Atomic Layer Deposition(ALD) and ETCH(etching).
CVD:NASO TECH’s SiC Epitaxial Reactor is a specialized equipment designed for the epitaxial layer growth—a core process in silicon carbide chip production. This step is critical for manufacturing diodes and power semiconductor devices.
PVD:NASO TECH’s PVD Equipment primarily deposits various metallic and non-metallic thin films on wafer surfaces during semiconductor fabrication. It plays a key role in forming essential conductive pathways, electrode contacts, and protective barriers or integrated circuits.
ALD:NASO TECH’s ALD System is used in perovskite solar cell manufacturing for depositing high-quality functional layers with extreme uniformity and conformity—such as electron transport layers (ETL) and interface passivation layers. It addresses critical challenges in cell stability and efficienc.
Pentamaster Group provides automation technology and solutions to multinational manufacturers in the automotive, semiconductor, electro-optical, consumer electronics, and medical sector, spanning across APAC, North America and Europe. Besides the HQ and production plant in Penang, Malaysia, the Group has strategic presence globally with offices located in the USA, Japan, Germany, Singapore and production facilities in China.
With the speed and magnitude of technology progress today, Pentamaster Group will always be bold enough to explore new innovations. For years, the Group has been one of the leading global providers of automated test equipment to suit different requirements and needs of customers from various industries. In the automotive segment, the group has developed a proprietary SiC wafer burn-in system, being one of the top four manufacturers in the world, in creating a niche market space for this growth sub-segment and to solidify the Group’s position in the automotive industry.
Plasmatreat is the key enabler technology for microfine cleaning, surface activation and atmospheric plasma coatings (CVD) of nearly all kinds of materials – from plastics, metals and glass in a wide variety of industries including semiconductors. We prepare surfaces in an environmentally friendly way – replacing the need for chemicals and primers.
Atmospheric plasma equipment enabling state of the art surface preparation – activation, cleaning, reduction and nano-coatings for:
Flux-free Advanced Chip Packaging, Power Modules, Wire Bonding, Display Bonding, LED, PCBA and Consumer Electronics.
Area-selective, inline plasma processes in atmosphere including CVD coatings (dielectric barrier coatings, tie layers and anti-corrosion protection).
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
Teradyne (NASDAQ:TER) brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. They solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI. Its Industrial Automation offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs. In 2021, Teradyne had revenue of $3.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.
Corporate Headquarters
+1 978-370-2700
Contact Us
www.teradyne.com
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:
通快霍廷格电子有限公司成立于1922年,总部设于德国弗莱堡,是世界领先的等离子体电源制造商,产品主要用于:半导体,显示器和太阳能领域,以及光学镀膜,装饰镀膜,工业镀膜,大面积玻璃镀膜等行业的等离子体应用,于1990年正式加入通快集团。通快霍廷格电子致力于开发、制造用于各种沉积和干法刻蚀工艺的等离子电源,在电源领域拥有一百多年的经验积累,在欧洲、美洲和亚洲分别设有销售和服务子公司和分支机构。
2006年,通快霍廷格电子中国成立,至今已经深耕中国市场19年。如今,通快霍廷格在中国设有亚太区应用中心、维修中心、电源及匹配器生产中心,为客户提供所有生产过程中的优质服务。2023年,通快霍廷格中国新工厂在太仓建成开业,这是通快霍廷格继德国、波兰之后布局的全球第三家生产制造基地。
TRUMPF Huettinger is a high-tech company and a leading global manufacturer of DC, medium-frequency, high-frequency and semiconductor-based solid-state microwave generators.
The business units include plasma technology, industrial heating, battery inverter systems as well as microwave generators and amplifiers. These process power supplies are being used in many key processes in research, development and production. As a part of TRUMPF – technology leader of industrial lasers and machine tools – TRUMPF Electronics is headquartered in Freiburg/Germany and has sales and service branches in Europe, US and Asia providing a global IoT based service support.
Product introduction:
1. TruPlasma DC 4000 (G2) Series
TruPlasma DC 4000 (G2) 系列专为金属,金属氧化物,绝缘材料的反应直流溅射而开发。电源以直流脉冲的形式输出,在高要求的膜层质量和大产能的PVD 和PECVD 工艺中证明了它的优势。
The TruPlasma DC Series 4000 (G2) combines the excellent arc handling of TRUMPF Hüttinger with the advantages of DC pulse technology. This means you gain improved coating results with fewer defects, along with a higher deposition rate. The results are brilliant surfaces and a high level of production power.
2. TruPlasma DC 3000 (G2) Series
TruPlasma DC 3000 (G2) 系列适合众多直流溅射工艺,得益于先进的电弧管理和集成水冷装置,该款直流电源同样可用作脉冲式直流电源的高性价比替代方案。此外,极其紧凑的结构使其方便集成至现有应用中。
The TruPlasma DC Series 3000 (G2) is suited to numerous DC sputtering processes. The DC generators also make an interesting cost-effective alternative to pulsed DC generators due to their progressive arc management and the integrated water cooling. The very compact design also enables simple integration into existing applications.
3. TruPlasma RF 1000/3000 (G2/13) Series
全新一代的射频电源TruPlasma RF 1000 / 3000 (G2/13.56M) 系列,对工艺过程中的所有参数进行实时监测,即使在要求严苛的等离子体工艺中,仍能确保可靠供电。其稳定的输出功率和高精度控制确保高效高生产效率的同时,实现最佳工艺效果。
The TruPlasma RF Series 1000 / 3000 (G2/13) are the latest generation of RF generators. Due to innovative functions such as the patented CombineLine coupling technology or real-time measurement of all process parameters, reliable power supply even in demanding plasma processes is guaranteed – the optimal conditions for reproducible results and high productivity.
4. TruPlasma LF Series
TruPlasma LF 1000 系列电源基于创新的平台概念, 频率范围有350k,400k,2M,功率范围1~10kw,适用于各类半导体,光伏,ALD,刻蚀等离子应用。
TruPlasma LF 1000 series are based on an innovative platform concept with frequency ranges of 350k, 400k, 2M and power ranges from 1 to 10kw for all types of semiconductors, photovoltaic, ALD, and etch plasma applications.
5. TruPlasma VHF 3000 series
TruPlasma VHF 3000 系列电源基于创新的平台概念, 频率覆盖27M;40M;60M。功率范围1~10kw。可满足极为苛刻的生产要求。VHF 电源的纯水冷模块化结构与极高的功率密度设计可以确保大功率输出下的稳定性。
TruPlasma VHF 3000 series power supply is based on an innovative platform concept covering frequencies of 27M, 40M, 60M, and power ranges of 1~10kw to meet the most demanding production requirements. the VHF power supply’s pure water-cooled modular construction and extremely high power density design ensure stability at high power outputs.
Trymax, your partner for plasma
Our core business is to support semiconductor manufacturers throughout the world with innovative plasma-based solutions for ashing, descum, surface preparation, isotropic etch, photoresist curing and charge erase that are used in the fabrication of integrated circuits.
Trymax Semiconductor Equipment designs, manufactures, and markets its own NEO equipment. A wide range of different NEO platforms are available, from single chamber semi-automatic tools, through to multi chamber high volume manufacturing platforms. Trymax offers a number of different plasma technology chambers which are configurable across all NEO platforms. This enables Trymax to offer an extremely wide range of different process capabilities to meet customer’s requirements.
Trymax is a privately held company. It has been on operation since 2003 and has its registered headquarters in Nijmegen, the Netherlands. We are ISO-9001 accredited and operate on a global basis, supporting our customers who operate across Europe, Asia and America.
ULVAC GmbH which was established in 1987 as the European subsidiary of ULVAC, Inc. headquartered in Munich, Germany. ULVAC’s solutions diversely incorporate equipment, materials, and services for Semiconductors, MEMS, Flat Panel Displays, Electronic Components, PCB, TFB, and other Vacuum Equipment for the European Markets.
ULVAC is the global leader for thin film PZT deposition and etch.
ULVAC GmbH
Klausnerring 4
85551 Kirchheim b. München
Germany
Fon: +49 – 89 – 96 09 09 – 0
Fax: +49 – 89 – 96 09 09 – 96
Email: ulvac@ulvac.de
http://www.ulvac.eu
For MEMS application ULVAC has developed systems dedicated to MEMS sensors, actuators, switches, lab-on-chip and micromirror manufacturing. This equipment range includes sputtering and etching for piezo electric materials like PZT, AlN and ScAlN, glass and metal etching, thick resist ashing, resist and polymer removal within trench structures, and others.
Piezoelectric materials can be used to further miniaturize a range of devices, including inertial sensors, tuneable RF devices, inkjet print heads, micromirrors, microphones, autofocus lenses and others. The integration of thin film deposition directly on CMOS-processed wafers is key for highly-integrated devices. ULVAC has developed high-volume processing sputtering method that allows sub 500°C processing temperatures, is configured to pole the piezoelectric crystals during the deposition process and is compatible with other CMOS processes.
End of content
End of content