27-28 August 2025
Suwon
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Advanced Micro-Fabrication Equipment Inc. China (AMEC, stock code: 688012) is an innovative Asia-based semiconductor equipment company with a range of proprietary fabrication solutions designed to advance technology, increase productivity, and reduce manufacturing costs for leading global manufacturers of semiconductors and LEDs. Headquartered in Shanghai, the company is an entrenched supplier of dielectric and TSV etch tools, helping chipmakers build devices at process nodes as low as 5nm and beyond. In addition, AMEC’s MOCVD system has become a market leader in China for producers of LEDs and power devices. AMEC products are used today by technology leaders in Chinese mainland and Taiwan region, as well as Singapore, Korea, Germany, Italy and so on.
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Silicon Austria Labs (SAL) has been founded to be a top European research center for electronic-based systems. In the network of science and economy, we carry out research at a global level and create the basis of groundbreaking products and processes.
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
ULVAC GmbH which was established in 1987 as the European subsidiary of ULVAC, Inc. headquartered in Munich, Germany. ULVAC’s solutions diversely incorporate equipment, materials, and services for Semiconductors, MEMS, Flat Panel Displays, Electronic Components, PCB, TFB, and other Vacuum Equipment for the European Markets.
ULVAC is the global leader for thin film PZT deposition and etch.
ULVAC GmbH
Klausnerring 4
85551 Kirchheim b. München
Germany
Fon: +49 – 89 – 96 09 09 – 0
Fax: +49 – 89 – 96 09 09 – 96
Email: ulvac@ulvac.de
http://www.ulvac.eu
For MEMS application ULVAC has developed systems dedicated to MEMS sensors, actuators, switches, lab-on-chip and micromirror manufacturing. This equipment range includes sputtering and etching for piezo electric materials like PZT, AlN and ScAlN, glass and metal etching, thick resist ashing, resist and polymer removal within trench structures, and others.
Piezoelectric materials can be used to further miniaturize a range of devices, including inertial sensors, tuneable RF devices, inkjet print heads, micromirrors, microphones, autofocus lenses and others. The integration of thin film deposition directly on CMOS-processed wafers is key for highly-integrated devices. ULVAC has developed high-volume processing sputtering method that allows sub 500°C processing temperatures, is configured to pole the piezoelectric crystals during the deposition process and is compatible with other CMOS processes.
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.
With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert team that understands the specific needs of shipments such as those in the semiconductor business.
From NFO, to OBC, dedicated drives, charters and more, the Airspace technology will calculate the best routing for you, taking your specific requirements into consideration as well as automating the process to save your team valuable time.
Your supply chain is complicated — we make it easy for you.
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes.
EVG’s products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications.
With application labs and cleanrooms in Europe, North America and Asia, EVG is focused on delivering superior process expertise to its global R&D and production customer and partner base.
Founded in 1980, the company is headquartered in Austria, with fully-owned subsidiaries in the U.S., Japan, South Korea, China, Singapore and Taiwan. The company employs more than 1600 people worldwide.
EVG’s products, which include lithography, bonding, nanoimprint and metrology systems, play an essential role in enabling today’s leading device makers to develop and manufacture tomorrow’s technology innovations.
EVG holds the dominant market share for all types of wafer bonding equipment and is a technology leader in lithography for advanced packaging and nanotechnology. Our metrology systems are optimized to ensure the tightest process control and highest yields for our industry-leading process equipment.
With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in the U.S. and Japan, EVG’s process engineering team offers comprehensive technical support and advice to the semiconductor industry. We are focused on delivering superior process expertise to our global R&D and production customer and partner base. Our process development teams work hand-in-hand with customers, from the initial process development through to the final integration at their production sites. Services range from equipment demonstrations and feasibility studies to small-to-medium-scale pilot-line production to shorten time to market.
Customer satisfaction is critically important for EVG. Our worldwide customer support centers and spare parts supply network deliver on our commitment to provide on-demand, quality service that our local customers and partners have come to expect from EVG.
Okmetic, established in 1985, is the 7th largest silicon wafer manufacturer in the world. The company specializes in 150-200 mm silicon and SOI wafers, serving power, MEMS, and RF device industries. Okmetic is a key player in the power device sector, offering optimized silicon wafers for discrete power devices, power management applications, and GaN growth.
Okmetic has worldwide sales organization and headquarters located in Finland, where the majority of its silicon wafers is manufactured. The company’s fab expansion set to be operational in early 2025 will increase 200 mm wafer capacity significantly. Okmetic operations are certified under ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016, highlighting its commitment to quality and sustainability.
Okmetic is the leading supplier of advanced, high value-added silicon wafers for the manufacture of MEMS and sensors, RF filters and devices as well as power devices. We have the most extensive 150 to 200mm wafer portfolio in the market comprising of comprehensive lines of SOI wafers and High Resistivity RFSi® wafers as well as Patterned wafers, SSP and DSP wafers, TSV wafers, Wafers for Power devices and GaN-on-Si applications.
Okmetic’s silicon wafers are tailored to the customer’s product, process and technology needs, and produced in volume production. This ensures optimum wafer performance leading to multiple customer benefits: increased device performance and functionality, more advanced design possibilities, improved yield as well as streamlined and cost-effective manufacturing. Our silicon wafer solutions can be found e.g. in smartphones, portable devices and automotive electronics, and they support applications related to industrial process control, healthcare, the Internet of Things, and power and efficiency improvement.
OSAI Automation System S.p.A. Benefit Company, founded in 1991, is a company that designs and manufactures standard equipment for semiconductor testing as well as complete automation lines, with high technology content and through a cross technology portfolio: from test handlers for MEMS (wide range of stimuli units entirely designed by OSAI) up to test and assembly lines for power devices (discrete and modules).
In addition to OSAI headquarters located in Parella, its resale and assistance network is made up of over 40 distributors all over the world, with over 50 local staff and 3 commercial branches (USA, Germany and China).
SPEKTRA Schwingungstechnik und Akustik GmbH Dresden, Germany was founded in 1994 and has established itself as a renowned manufacturer of components and systems for the testing and calibration of sensors. The products of the family business are used worldwide for the reliable measurement of dynamic physical quantities such as vibration, acceleration, sound pressure or alternating charge.
As from 2008, SPEKTRA also includes the APS trademark under which the company manufactures and sells long-stroke vibration exciters (shakers) and runs a marketing office in California, USA under the name of APS Dynamics, Inc. Through this merger, forces based on decades of experience could be bundled to develop a new generation of even more powerful vibration control systems.
Furthermore the company‘s calibration laboratory is accredited by DAkkS and offers a wide range of calibration services. And all this at a level of measurement uncertainty that can normally only be guaranteed by topmost national metrology laboratories.
SPEKTRA is often pioneer when it comes to the development, manufacturing or distribution of measuring and testing systems as well as calibration equipment. The use of such technology to provide special services and equipment for metrological and industrial applications enabled the company to reach an international top position in a growing market.
SPEKTRA LABS is your brand for excellence. With an international network of laboratories in Europe and the USA, we offer a wide range of testing and calibration services for dynamic measurement parameters – including vibration, shock, sound level as well as tilt and rotation rate.
Our accredited laboratories combine state-of-the-art technology with certified processes: So that you can rely on correct measuring results and smooth processes at all times.
MEMS-Testing at different levels (Lab and Fab):
From individual laboratory-scale sensor technology to highfrequency mass production. TESTelligence for MEMS sensors. Discover our S-TEST systems.
S-TEST Lab:
The S-TEST Lab systems offer a wide range of sensor system tests for development and laboratory environments. Its flexible system components allow users to quickly respond to different test requirements and sensor types. From parametric tests, functional tests, measurement comparisons, to characterization, our system solutions provide sensor developers with comprehensive capabilities for early detection of design flaws.
S-TEST Fab – optimized functions for efficient mass testing
The S-TEST 16 Fab systems are designed for use in the mass production of sensors. Their optimized design allows operation in temperature controlled cabinets. Variable throughput rates and test coverage can be achieved from small test series to highly parallel testing of several hundred sensors.
Calibration system CS Q-LEAP:
Sensor calibration is our core competence. Calibration laboratory SPEKTRA
The product group “Calibration Solutions” includes calibration systems as well as services. The SPEKTRA family of CS18 and the newest CS Q-LEAPTM calibration systems offers the calibration for the following measurands:
Acceleration (0.05 Hz … 350 kHz)
Shock (few mm/s² … 2,000 km/s²)
Acoustics (0.1 Hz … 20 kHz, until 124 dB)
Dynamic Force (10 Hz … 1 kHz, few mN … 20 kN)
Dynamic Pressure (up to 4,000 bar)
Mobile calibration system CV-10:
The CV-10 provides all the benefits of a mobile system. With the proven user-friendly interface of SPEKTRA.
Discover how smart, easy and flexible the on-site test and calibration of accelerometers, proximity probes and velocity sensors can be.
SUMCO is a leading silicon wafer supplier to the semiconductor industry.
SUMCO mission: It is the mission of the SUMCO Group to be the world’s No. 1 silicon wafer supplier by exceeding the expectation of our customers and stockholders, by recognizing the value of our employees and by being good neighbors in communities
Other detailed information you can find on the website: https://www.sumcosi.com/english/
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our proven ion beam, laser annealing, lithography, metal organic chemical vapor deposition (MOCVD) and single wafer etch & clean technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit www.veeco.com.
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