The global demand for computing is undergoing a notable shift, propelled by factors such as AI/ML, the imperative for ubiquitous connectivity, and a steadfast focus on energy efficiency. In line with the industry’s unwavering commitment to continuous innovation at Moore’s Law cadence, a system technology co-optimization (STCO) approach has been adopted. Consequently, the boundaries between silicon technology and advanced packaging are becoming increasingly blurred.

This keynote delves into the advanced packaging toolset encompassing scaling, materials, testing, and standardization, available to the advanced packaging ecosystem as it navigates the STCO era of Moore’s Law. The importance of sharing ecosystem expertise and ideas across silicon and advanced packaging is underscored for unlocking industry-disrupting benefits. Furthermore, the keynote showcases current innovations aimed at tackling system-level challenges such as bandwidth, energy efficiency, power density, and thermal management.