• 11:40 – 11:50

Assembly Technologies for the Front End

The drive towards 3D chiplets to extend Moore’s law is changing the way we think about advanced packaging interconnect. Assembly processes like die attach that used to be performed only in back-end factories are now being inserted into front-end wafer fabrication process flows. This presentation explores the latest advancements in front-end assembly technologies, focusing on bringing hybrid bonding into production and improving its accuracy and speed. We will also delve into recent advancements in TCB for 3D chip-to-wafer connections. The discussion will compare and contrast the relative benefits of hybrid bonding and TCB for both logic and memory applications. The adoption of these technologies in high performance AI devices and other applications will be discussed.

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Chris Scanlan

SVP Technology


Chris Scanlan is Senior Vice President Technology at Besi Switzerland where he is leading advanced technology road map development and technical promotion. Prior to joining Besi he was Vice President of Worldwide Applications Engineering at JCET Group where he was responsible for business development, technical program management, and product design. From 2009 to 2019 he was SVP of Product Development at Deca Technologies, a wafer level packaging technology provider. As a founding member of Deca, Chris was primarily responsible for the development of Deca’s portfolio of intellectual property and technology relating to M-Series fan-out, Adaptive Patterning and advanced wafer-level manufacturing methods. Chris worked at Amkor Technology for 10 years where he held leadership positions including VP of Global R&D, VP of the Advanced Products business unit and VP of the System-in-Package business unit. Chris started his career at Motorola Semiconductor where we developed a manufacturing line for high power IGBT modules, and managed the transfer of Motorola’s fcCSP technology from R&D to production. He has 70 issued US patents related to semiconductor packaging. He earned his Master of Science degree in Materials Engineering from the University of Wisconsin-Milwaukee.

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BE Semiconductor Industries N.V. (“Besi”)is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries focusing primarily on the advanced packaging segment of the market. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud infrastructure, computing, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY Nasdaq International Designation) and its headquarters are located in Duiven, the Netherlands. Research and Development is organizedin Switzerland, Austria and the Netherlands. Support and production is in Singapore, Malaysia and China. For more information, please visit our website at www.besi.com.

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