• 10:50 – 11:10

Heterogeneous Integration Enabled by Advanced Chiplet Packaging

With the growing demand of high performance IC, heterogeneous system integration of multiple smaller chiplets by advanced packaging technology becomes one of the major driving forces of the semiconductor industry innovation. New technologies in high bandwidth 2.5D and 3D interconnection enable complex designs implementation. Chip-Package co-design is prerequisite to meet the target performance and STCO (system-technology co-optimization) methodology is critical to advance chiplet architecture for optimal system performance.

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Dr. Yang Cheng photo

Dr. Yang Cheng

Senior Director Design Service BU

JCET Group Co., Ltd.

Dr. Yang has 20 years’ of experience in electronics system and IC packaging development. At present he is senior director of advanced packaging and SiP design at JCET. Before joining JCET, he was at Flex on SiP products and technology development in IoT, automotive, medical, and industrial applications, covering design, manufacturing, and testing areas. He has worked at Intel on memory packaging design and technology development for 13 years. Dr. Yang hold a Ph.D. degree from National University of Singapore, EMBA from Washington University in St. Louis, and Master and Bachelor from Shanghai Jiaotong University.

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JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

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