• 16:00 – 16:10

How Laser is Enabling The Power Semiconductor Roadmap

To keep up with the drive for improved electrical performance of Power Semiconductor devices, chip designers are looking at thinner wafers and moving from Si to SiC and GaN wafer substrates. Due to the increased electrification in our daily life we see a strong increase in power semiconductor applications for mobile, automotive, industrial, renewable energies, etc. As a result of this increase in volume, the market is looking at new wafer singulation technologies to keep up with the technology requirements as well as the cost. ASMPT developed a patented Ultra-Violet (UV) nano second laser dicing technology for thin SiC wafers (100 – 150 μm), which allows customers to continue their technology roadmap and which is competitive from a Cost of Ownership (CoO) to the conventional saw blade dicing technology. Blade dicing is encountering yield issues and due to the hardness of SiC, high consumable cost and low throughput. During our presentation at ISES EU Power 2023 we will share the laser technology concept used and the results achieved for dicing of thin SiC power semiconductor devices including reliability data and CoO.

Key words: SiC, Dicing, Power Semiconductors, Thin Wafer, Multiple Beam

Jeroen van Borkulo photo

Jeroen van Borkulo

Head of Business & Marketing

ASMPT

Jeroen van Borkulo received a Bachelors’ degree in Applied Physics – specialized in photonics from the Hague University of Applied Sciences and followed Executive Program at Nyenrode Business University.

Joined ASMPT in 2014 in the role of product marketing manager. In his current role leads the business development and marketing team for ASMPT’s Laser dicing and grooving BU. Jeroen has over 20 years’ experience in laser material processing applications in the semiconductor industry.

ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

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