27-28 August 2025
Suwon
16:25 – 16:35
Innovative Sputtering Technology for Piezo-MEMS and Other Advanced Functional Devices Manufacturing
Functional devices such as Piezo-MEMS, tunable devices, on-chip capacitors, emerging semiconductor memories and solid-state Li batteries are essential to realize “Smart Society”. “New Materials” especially multi-elements compound oxides such as perovskite ferroelectric materials (PZT, BST, etc.) which can enable these functional devices are gaining greater interests in industry. Meanwhile challenges are arising in processing these new materials into thin films and integrating them into functional device stacks mainly due to difficulties induced by material properties such as dielectric or insulating natures which are different from those of conventional metal or semi-conductive materials. One of the main critical processes to fabricate thin films is sputtering which facing same issues in processing these “New Materials” reliably and reproducibly. ULVAC has been successfully developing sputtering technology solution by innovative RF(Radio-frequency) sputtering technology as well as novel thin-film growth processes for functional devices manufacturing. This talk will provide a brief overview of this technology as well as its usefulness in realizing reliable processing and advanced material and devices properties with using PZT Piezo-MEMS as an example.
Dr. Koukou Suu
ULVAC Technologies, Inc.
Dr. Koukou Suu graduated and received Ph.D degree in Engineering from Tohoku University, Japan in 1988 and 1993 respectively. He joined ULVAC, Inc. in 1993 and since then has been leading and engaging with developments of numerous semiconductor and electronics technologies including emerging non-volatile memories, high-K capacitors, LED, power devices, thin-film Li-battery as well as 3D packaging manufacturing technologies. He was General Manager of Institute of Semiconductor and Electronics Technologies of the company from 2008 to 2014. Currently he is Executive Officer and Senior Fellow of ULVAC, Inc. as well as President and CEO of ULVAC Technologies, Inc, a company representing ULVAC in North America. He is also an Adjunct Professor of Shanghai Institute of Microsystem and Information Technology of Chinese Academy of Science as well as an Adjunct Industrial Professor of University of South Australia.
Company Profile
ULVAC GmbH which was established in 1987 as the European subsidiary of ULVAC, Inc. headquartered in Munich, Germany. ULVAC’s solutions diversely incorporate equipment, materials, and services for Semiconductors, MEMS, Flat Panel Displays, Electronic Components, PCB, TFB, and other Vacuum Equipment for the European Markets.
ULVAC is the global leader for thin film PZT deposition and etch.
ULVAC GmbH
Klausnerring 4
85551 Kirchheim b. München
Germany
Fon: +49 – 89 – 96 09 09 – 0
Fax: +49 – 89 – 96 09 09 – 96
Email: ulvac@ulvac.de
http://www.ulvac.eu
Company Products & Services
For MEMS application ULVAC has developed systems dedicated to MEMS sensors, actuators, switches, lab-on-chip and micromirror manufacturing. This equipment range includes sputtering and etching for piezo electric materials like PZT, AlN and ScAlN, glass and metal etching, thick resist ashing, resist and polymer removal within trench structures, and others.
Piezoelectric materials can be used to further miniaturize a range of devices, including inertial sensors, tuneable RF devices, inkjet print heads, micromirrors, microphones, autofocus lenses and others. The integration of thin film deposition directly on CMOS-processed wafers is key for highly-integrated devices. ULVAC has developed high-volume processing sputtering method that allows sub 500°C processing temperatures, is configured to pole the piezoelectric crystals during the deposition process and is compatible with other CMOS processes.