• 14:55 – 15:00

Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging

In today’s rapidly evolving technology landscape, the semiconductor industry is constantly pushing the boundaries of innovation to meet the demands of increasingly complex systems. With the popularity of Artificial Intelligence and high demand for new power management, the importance of thermal management cannot be overstated.

As semiconductor devices shrink in size and complexity increases, they generate higher power densities, resulting in elevated operating temperatures. This poses critical wafer testing challenges for manufacturers in terms of temperature accuracy and uniformity, as even minor thermal deviations can significantly impact the performance and reliability of these advanced chips.

This presentation will introduce ERS’s latest developments in wafer probing and advanced packaging; two critical areas that are geared towards maximizing yield and guaranteeing performance.

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Laurent Giai-Miniet photo

Laurent Giai-Miniet


ERS Electronic GmbH

Laurent is the CEO of ERS electronic GmbH, and oversees the Sales, Marketing, Applications and Business Development team. He has more than 25 years of experience in the semiconductor industry and has held leadership positions in renowned companies such as Texas Instruments and Infineon, as well as in high-tech start-ups. Laurent has an MBA from the Institut d’Administration des Entreprises of Aix-en-Provence (France).

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ERS electronic GmbH, located near Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process. ERS’s headquarter, sales department, engineering center and production facilities are in Germany, and they also have sales and support offices worldwide.

Phone: +49 898941320
Email: info@ers-gmbh.de
Website: www.ers-gmbh.com

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