14:55 – 15:00
Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging
In today’s rapidly evolving technology landscape, the semiconductor industry is constantly pushing the boundaries of innovation to meet the demands of increasingly complex systems. With the popularity of Artificial Intelligence and high demand for new power management, the importance of thermal management cannot be overstated.
As semiconductor devices shrink in size and complexity increases, they generate higher power densities, resulting in elevated operating temperatures. This poses critical wafer testing challenges for manufacturers in terms of temperature accuracy and uniformity, as even minor thermal deviations can significantly impact the performance and reliability of these advanced chips.
This presentation will introduce ERS’s latest developments in wafer probing and advanced packaging; two critical areas that are geared towards maximizing yield and guaranteeing performance.
Laurent Giai-Miniet
ERS electronic GmbH
Laurent is the CEO of ERS electronic GmbH, and oversees the Sales, Marketing, Applications and Business Development team. He has more than 25 years of experience in the semiconductor industry and has held leadership positions in renowned companies such as Texas Instruments and Infineon, as well as in high-tech start-ups. Laurent has an MBA from the Institut d’Administration des Entreprises of Aix-en-Provence (France).
Company Profile
ERS electronic GmbH, located near Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process. ERS’s headquarter, sales department, engineering center and production facilities are in Germany, and they also have sales, demo centers and support offices in the US, China and Taiwan.
Phone: +49 898941320
Email: info@ers-gmbh.de
Website: www.ers-gmbh.com
Company Products & Services
ERS electronic GmbH has gained an outstanding reputation in the industry, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, ERS’s renowned thermal chuck system AC3 Fusion with add-on technologies like High Thermal Uniformity, Anti-magnetic and High Voltage/Current are integral components in most wafer probers across the semiconductor industry.
Leveraging its decades of thermal management experience, ERS launched the first ever Thermal Debonding and Warpage Adjustment tool for Fan-out Wafer- and Panel-level Packaging applications in 2008. Since then, the company has contributed to driving innovation in the Advanced Packaging space, by supporting different wafer formats and panels. The company’s most recent innovations include the Wave3000, a warpage inspection tool that enables the measurement and analysis of warped wafers composed of different materials in less than 1 minute. In 2024, ERS also introduced its series of semi-automatic and fully-automatic PhotoThermal debonding machines, offering a breakthrough solution for TBDB processes. This innovative method minimizes operational costs while ensuring high throughput and exceptional process flexibility, regardless of adhesive material type or supplier. By lowering operational costs by more than 30% compared to laser debonding and enhancing efficiency, this technology is well-suited for applications involving AI chips, power ICs, GPUs, and high-bandwidth memory (HBM).
