• 17:00 – 17:10

State-of-the art solutions for AI Chip manufacturing

Over the past nine months, the AI chip boom has accelerated considerably. High-bandwidth memory (HBM) chips, which are an essential part of AI chips, are undergoing rapid technological advancements. While temporary bonding will still be needed for wafer thinning of HBM3 chips and following generations, production of HBM chips is supposed to shift from thermal compression (TC) bonding to hybrid bonding solutions. TC may still be the preferred option for HBM4, as hybrid bonding is significantly more expensive. However, with HBM5 at the latest, the switch to hybrid bonding is expected to take place due to higher I/O densities. SUSS MicroTec has developed a D2W hybrid bonding solution together with flip-chip bonder specialist SET and also offers W2W hybrid bonding solutions, thus providing the technologies required for the next generations of HBM and AI chips.

Watch on ISES TV > PPTs in ISES Docs >
Robert Wanninger photo

Robert Wanninger

Senior Vice President Business Unit Advanced Backend Solutions

SUSS MicroTec

Robert Wanninger is Senior Vice President of the Advanced Backend Solutions (ABS) business unit at SUSS. With leading equipment and process solutions for Imaging, Coating and Bonding applications, SUSS ABS business unit is well positioned to serve the semiconductor industry. Robert brings ~25 years of experience in semiconductor industry. Prior to joining SUSS in 2021, he has worked over 20 years at Infineon in various management positions and spend two years in Korea as COO of LS Power Semitech. He holds a PhD in Chemistry from the University of Regensburg, Germany.

View Full Profile

SUSS MicroTec is a leading manufacturer of system and process solutions for micropatterning in the semiconductor industry and related markets. The company has more than 70 years of engineering experience and is a partner for high-volume production as well as for research and development. In close collaboration with research institutes and industry partners, SUSS MicroTec drives the development of next-generation technologies such as 3D integration and nanoimprint lithography as well as key processes for MEMS and LED production. With its global infrastructure for applications and service, SUSS MicroTec supports more than 8,000 installed systems worldwide. The headquarters of SUSS MicroTec is in Garching, near Munich, Germany.

View Full Profile