Yeh, Nientze, Ph.D. in Electrical Engineering from National Central University, Taiwan. He has long been engaged in the research and industry of compound semiconductor materials and devices, especially having 25 years of industrial R&D experience in the field of wide band-gap semiconductor materials and devices. Proficient in the design and industrial manufacturing of compound semiconductor devices. Has served as a researcher at the Telecommunication Laboratories of Chunghwa Telecom Co, Ltd. and the technical head of a listed company in Taiwan. The research results have obtained more than 30 patent authorizations in the United States, Japan, the Chinese and Taiwan, and published more than 70 international journal papers. He has also participated as the project or subject leader in several major projects and national key R&D programs.
Currently serves as the technical director of Hunan Sanan Semiconductor Co, Ltd., responsible for the R&D and mass production of compound semiconductor power electronic devices, and successfully built a production line of wide band-gap semiconductor power electronic devices from epitaxy to devices.

Over three decades of global leadership experience in manufacturing semiconductor and electronics operations (internal and outsourcing), business development, sales, marketing, sourcing, supply chain, procurement, EHS and quality at companies large (Intel Corp, Onsemi, Advantest, AT&S) and small with 10yrs of expat experience in multiple countries in Asia and Latin America. Industry 4.0 consultant.

Hongpeng Wang graduated from the Department of Electronic Engineering of Tsinghua University with Bachelor and Master degree. He has worked in many well-known chip design companies as the head of R&D, and has more than 15 years of technical management experience. He is an expert in IC design and system architecture, and has successfully mass-produced 20+ chips for different applications.
In 2021, he founded Join Silicon. Join Silicon is a technology platform company focusing on IC design of advanced process technology, committed to IP independent R&D and service, enabling chip design and SoC customized solutions. Join Silicon provide advanced process IP, one-stop high-end SoC customization, as well as chiplet and advanced 2.5D/3D packaging products for customers in high-performance computing, data center, 5G communications, artificial intelligence, automotive electronics etc..

Angeline Tee brings over 25 years of global expertise in the MEMS and microelectronics industry. She is currently responsible for strategic planning, partnership management, and business development for the Microsystem Division at Silicon Austria Lab (SAL), Villach. In this role, she supports the coordination of various EU-funded collaborative programs, including pilot lines, while also managing partnerships with the diverse stakeholders involved.

Angeline holds an Honor’s degree in Applied Science (Materials Engineering) and a Master of Science in Electrical Engineering from the National University of Singapore (NUS). She also earned an MBA from the University of Birmingham, providing her with a strategic and managerial outlook.With 15 years of technical expertise in MEMS process engineering, Angeline transitioned into business-oriented roles, focusing on strategic marketing and business development. She has since worked with GLOBALFOUNDRIES, XFAB MEMS Foundry, and the Institute of Microelectronics at A*STAR, where she has concentrated on market research, industrial collaboration, and strategic partnerships to drive organizational growth and sustainability.

With her diverse skill set, comprehensive industry experience, and strong academic background, Angeline is committed to advancing technological innovation within the MEMS and microelectronics industry.

Ding Xuanming, born in 1983, graduated with a master’s degree in Electrical Engineering from Shanghai University. In November 2019, he founded Lipus Semiconductor in Wuxi, focusing on the research, production, and sales of IGBT and SiC power semiconductor products. These products are primarily used in applications such as electric vehicles, hydrogen energy, photovoltaics, industrial frequency converters, wind power, smart grids, and medical devices. Currently, he is responsible for the operations of Lipus, including team building, market promotion, financing, and production line construction. The company is in a rapid growth phase, having completed a total financing of 250 million yuan in just three years.

Haisheng Yu, graduated from Shanghai Jiao Tong University with a PhD and postdoctoral experience, primarily engaged in the development of automotive powertrain and chassis control systems. With over 20 years of extensive industry experience in technology development in this field, she hold more than 80 authorized patents and have published over 30 papers in SCI and EI journals. She have also participated in several national and provincial-level projects.