22-23 October 2025
Singapore
22-23 September 2025 - Shanghai
07:30 – 08:50
Registration 签到注册
PART 4: 功率器件在人形机器人、低空飞行器及数据中心电源中的应用
09:00 – 09:05
Welcome speech by Day 2 moderator
Wilson Hong
International Semiconductor Industry Group (I.S.I.G.)
Formerly Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
峰会第二日主持人:洪文成 / 蔚来汽车
09:05 – 09:25
Keynote
Humanoid Robot and the Application of Semiconductor in It
人形机器人及其半导体应用
This presentation introduces the company Humanoid Robot Shanghai and its achievements in robot hardware, software, and AI algorithm then goes into the details of some of the hardware devices of humanoid robots, such as motor drivers, lidars, bionic hands, and control computers, elucidating the uses of electronic components in them and the demands that humanoid robots put on pertaining semiconductor domains.
Jingran Cheng
Humanoid Robot Shanghai Co., Ltd.
Jingran Cheng, software development manager of Humanoid Robot Shanghai, qualified as a master in condensed mater physics from Beijing University of Aeronautics and Astronautics, worked in FlashGet and Missfresh in the past, and cofounded Kanbox which specialized in consumer cloud storage. Currently I am responsible for the adaptation of motor drivers, sensors, effectors, and control computers to robots and for the implementation of application programming interfaces together with remote communication mechanisms for robots.
Company Profile
Humanoid Robot Shanghai is founded in 2023 to propel humanoid robot original hardware design, free software development, AI algorithm research, and its application in civil and industrial areas. The company was indorsed “Joint Humanoid Robot Innovation Center by the State and Local Authorities” in 2024. The major parts of our structural design and software framework can be found open sourced via www.openloong.net. Furthermore, we have built in Shanghai the first “Heterogeneous Humanoid Robot Training Arena” which focuses on data collection, model training and inferencing. Meanwhile, many affiliate training arenas are under construction nation-wide. Our robots are being assessed in various scenarios ranging from bank customer guidance, power plant patrolling and inspecting, automotive assembly work, civil service, and etcetera, in which city waste processing took the lead and came to fruition bringing about an order of one thousand robots.
Company Products & Services
The company’s product portfolio includes:
AzureLoong Pro – humanoid robot, as tall as 1.85 meters, 31 degrees of freedom, targeting patrolling and inspection, carrying and manipulation, data collection;
AzureLoong Lite – humanoid robot, as tall as 1.45 meters, 24 degrees of freedom, targeting customer guidance, human interaction;
NanoLoong – miniature bipedal robot, targeting education segment;
WheelLoong – wheeled bimanual robot, targeting civil service.
Dexterous Hand – 6 degrees of freedom robotic hand, RS485 communication;
Dexterous Hand Pro – 19 degrees of freedom robotic hand, EtherCAT communication.
Meanwhile, we offer:
Adaptation of our motion control software framework to third party robots;
Remote control and cloud data collection integral solution for robots;
API authoring for robots to interface which to our robot management and controlling cloud platform that is privately deployable.
09:30 – 09:50
Keynote
eVTOL marketing trend 低空飞行器未来市场趋势
1、低空经济火热带来低空飞行器的新市场机会。
2、应用场景有效落地是低空经济发展的核心,也是低空飞行器的挑战。
3、作为低空飞行器的核心零部件,适航低成本动力将成为低空场景落地的核心因素。
KeDa Xu
Falcon Sichuan Aviation Technology Co. Ltd
Mr. Xu Keda holds a master’s degree from Renmin University of China and brings over 20 years of experience from the General Armament Department.
He has deep insights into both the Chinese and global aviation engine markets, which allow him to set a clear strategic direction for the company and to navigate opportunities in today’s complex, fast-changing environment.
许可达,中国人民大学硕士毕业,曾在总装工作20余年,对中国乃至世界航空发动机市场 的现状、趋势有着深刻理解,清晰定位企业发展方向,助力企业在复杂多变的市场环境中把 握发展机遇。
Company Profile
Falcon Aerospace Power Group, founded in 2020, specializes in the research and development, production, sales, and maintenance of power systems for general aviation and low-altitude applications. The company has established an R&D center in Zhuzhou, Hunan, and a heavy-fuel piston engine assembly base in Zhuhai, Guangdong. As of June 2025, Falcon has been recognized as a “Specialized and Innovative Enterprise” in Sichuan Province and as a National High-Tech Enterprise, holding over 40 patents. With leading capabilities in engine technology development, the company has launched three product lines—piston engines, turboprops, and hybrid power systems—providing practical power solutions for various types of low-altitude aircraft.
许可达 / 创始人兼 CEO
09:55 – 10:15
Keynote
Powering AI Today and Tomorrow: Innovations in Power Conversion Solutions
赋能当下与未来的人工智能:功率转换解决方案的创新
Data Center Power 数据中心电源
Wei Liu
Infineon Technologies AG
Mr. Liu Wei is Vice President of Infineon’s Power & Sensor Systems Division for Greater China and General Manager of Infineon Shenzhen. With over 20 years of experience in the semiconductor industry, he has a strong background in chip development, marketing, and business strategy. Since joining Infineon in 2021, he has led regional marketing for power ICs, power semiconductors, and sensors. In 2023, he was appointed General Manager of Infineon Shenzhen. Prior to Infineon, Mr. Liu held key leadership roles at Texas Instruments. He holds engineering degrees from Huazhong University of Science and Technology and North Carolina State University.
刘伟
英飞凌电源与传感系统事业部大中华区副总裁
英飞凌深圳总经理
刘伟先生目前担任英飞凌电源与传感系统事业部大中华区副总裁暨英飞凌深圳总经理,负责英飞凌电源与传感系统事业部在大中华区的市场管理事务及英飞凌深圳公司的日常管理。
刘伟先生拥有半导体领域20年的深厚经验,涵盖芯片产品研发、市场营销及推广。2021年,刘伟先生加入英飞凌,担任电源与传感系统事业部大中华区市场副总裁,负责电源芯片、功率半导体器件以及传感器等在大中华区的应用及产品市场营销策略。2023年10月,刘伟先生升任英飞凌深圳总经理。加入英飞凌前,刘伟先生曾就职于德州仪器负责产品线研发和运营管理,历任电源管理芯片系统开发经理、市场总监、产品线总经理等职务。
刘伟先生拥有华中科技大学电子工程学士学位及美国北卡罗莱纳州立大学电子工程硕士学位。
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
10:15 – 11:15
Networking + Coffee Break 社交及茶歇
11:15 – 11:35
Small Components, Big Impact: From Power to Signal Integrity for AI Servers by Nexperia
小元件撬动大价值 ——AI 服务器的功率与信号完整性技术解析
AI servers demand unprecedented levels of power efficiency, thermal resilience, and high-speed signal integrity – challenges that hinge on the performance of small but mission-critical components. In this presentation, I will show cases of Nexperia’s current portfolio and coming sampling Power Management ICs, Signal Interfacing iCs, advanced packaging technologies to ultra-low-loss power discrete and high-speed ESD protections that enables next-generation AI hardware. We explore Power Delivery, Signal Integrity, and System reliability. We’ll demonstrate component choices can reduce system bottlenecks, improve energy efficiency, and extend the lifespan of AI server platforms. Nexperia is the one-stop-shop for discrete & standard logic components and analog ICs.
Irene Deng
Nexperia
Irene Deng serves as General Manager for IC Solutions division at Nexperia, placing her among the company’s executive leadership as SVP. She is the central figure driving Nexperia’s expansion to analog and power ICs. Anchored globally in China, Europe, US, and rest of Asia areas, she’s guiding broader strategy to diversify Nexperia’s offerings beyond its traditional discrete devices toward high-value integrated circuits and high-power products. Since 2023, IC Solutions division has been releasing over triple digit new products annually in various product categories of Power IC, Isolation, Interfacing, Voltage Translators, Signal Path, and Standard Logic.
Company Profile
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
11:40 – 12:00
SiC Power Devices: The Core Technology Solution Reshaping the New Energy Landscape
SiC 功率器件:重塑新能源格局的核芯技术解决方案
In the current booming new energy market, the rapid advancement and widespread adoption of electric vehicle technology have become an irreversible trend. As consumers’ demands for the performance and user experience of electric vehicles continue to rise, the efficiency, stability, and safety of onboard charging systems have also garnered increased attention. In this presentation, we will share application cases of Fitpower’s silicon carbide solutions in onboard chargers (OBCs) and DC-DC converters, as well as our experience in the promotion and validation of these solutions in the 400V/800V main drive market.
在当前蓬勃发展的新能源市场中,电动汽车技术的快速进步与广泛普及已成为不可逆转的趋势。随着消费者对于电动汽车性能与体验的要求日益提升,车载充电系统的高效性、稳定性以及安全性也相应地受到了更高的关注。本次演讲将为大家分享飞锃碳化硅在车载OBC(车载充电机)和DC(直流转换器)领域的应用案例,以及在400V/800V主驱市场的推广和验证经验分享。
Heming Li
Alpha Power Solutions (Shanghai) Ltd.
李和明先生,浙江大学电气工程学院工学硕士,现任飞锃半导体产品市场VP。他在功率半导体相关领域拥有超过15年的经验,专注于新能源相关市场,具有丰富的碳化硅功率器件市场与应用经验,曾就职于英飞凌、意法半导体等国际半导体公司。
Company Profile
Alpha Power Solutions (APS) is China’s leading supplier of wide band gap power semiconductor devices. It is one of the pioneering companies in China to engage in the research and development of SiC devices and is the first to successfully use 6-inch SiC technologies , helping China make a breakthrough in this field.
APS adopts the CIDM strategy and has successfully deployed applications in leading domestic companies in the renew energy, photovoltaic energy storage, and EV-charging industries, providing them with Silicon carbide products and solutions for carbon neutrality.
Company Products & Services
SiC MOSFET, SiC Diode
李和明 / 产品市场副总裁
12:05 – 13:20
Buffet Lunch 自助午餐
13:25 – 14:10
Panel Discussion 圆桌讨论
Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案
Moderator
Jason Lin
Onto Innovation
Jason (Yu-Hsien) Lin is Director of Product Marketing at Onto Innovation, where he leads strategic initiatives in unpattern inspection technologies for advanced packaging, compound semiconductors, and AR/VR applications. With a strong track record of accelerating product adoption in emerging markets, Jason brings deep insight into aligning semiconductor solutions with diverse application needs.
Previously at KLA, Jason played a pivotal role in shaping product roadmaps and customer strategies, influencing major decisions such as a top IDM player’s adoption of next-generation inspection tools. His experience spans technical leadership, global benchmarking, and product lifecycle management across multiple nodes and geographies.
He is passionate about bridging engineering innovation with market strategy to enable scalable solutions across evolving semiconductor ecosystems.
Company Profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Panelist
Carsten Mohr
CuNex
Carsten is Executive Vice President of the Metal Foils division at SCHLENK and supports CuNex in the same position. He is a mechanical engineer by training and has an extensive track record in the silver paste and copper fabricating industry.
Company Profile
CuNex offers copper sinter pastes and preforms for high-power electronics packaging (die attach, substrate attach, die topside attach). Our copper-based interconnect materials follow a low pressure and rapid sintering approach ensuring improved reliability and performance at a substantial cost advantage over silver sintering.
After 7 years of extensive research, CuNex launched the Cuprum series of sinter pastes and CuForm sinter preforms. The copper pastes and preforms are suitable for Si, SiC and GaN devices as well as high power LEDs.
Specialized engineering solutions also allow for sinter lamination of substrates and die attach supporting embedded chip technologies.
The product development and volume manufacturing are driven by SCHLENK with a history of 150 years in copper and copper alloys.
The Cuprum pastes and CuForm preforms have class leading features:
– Low cost
– Fast drying in air
– Low sintering temperature and pressure
– Rapid sintering process
– High thermal conductivity
– Flexibility on die size and standard metallizations
– No nanoparticles
– Storage at room temperature for up to 6 months
Panelist
KeDa Xu
Falcon Sichuan Aviation Technology Co. Ltd
Mr. Xu Keda holds a master’s degree from Renmin University of China and brings over 20 years of experience from the General Armament Department.
He has deep insights into both the Chinese and global aviation engine markets, which allow him to set a clear strategic direction for the company and to navigate opportunities in today’s complex, fast-changing environment.
许可达,中国人民大学硕士毕业,曾在总装工作20余年,对中国乃至世界航空发动机市场 的现状、趋势有着深刻理解,清晰定位企业发展方向,助力企业在复杂多变的市场环境中把 握发展机遇。
Company Profile
Falcon Aerospace Power Group, founded in 2020, specializes in the research and development, production, sales, and maintenance of power systems for general aviation and low-altitude applications. The company has established an R&D center in Zhuzhou, Hunan, and a heavy-fuel piston engine assembly base in Zhuhai, Guangdong. As of June 2025, Falcon has been recognized as a “Specialized and Innovative Enterprise” in Sichuan Province and as a National High-Tech Enterprise, holding over 40 patents. With leading capabilities in engine technology development, the company has launched three product lines—piston engines, turboprops, and hybrid power systems—providing practical power solutions for various types of low-altitude aircraft.
Panelist
Jingran Cheng
Humanoid Robot Shanghai Co., Ltd.
Jingran Cheng, software development manager of Humanoid Robot Shanghai, qualified as a master in condensed mater physics from Beijing University of Aeronautics and Astronautics, worked in FlashGet and Missfresh in the past, and cofounded Kanbox which specialized in consumer cloud storage. Currently I am responsible for the adaptation of motor drivers, sensors, effectors, and control computers to robots and for the implementation of application programming interfaces together with remote communication mechanisms for robots.
Company Profile
Humanoid Robot Shanghai is founded in 2023 to propel humanoid robot original hardware design, free software development, AI algorithm research, and its application in civil and industrial areas. The company was indorsed “Joint Humanoid Robot Innovation Center by the State and Local Authorities” in 2024. The major parts of our structural design and software framework can be found open sourced via www.openloong.net. Furthermore, we have built in Shanghai the first “Heterogeneous Humanoid Robot Training Arena” which focuses on data collection, model training and inferencing. Meanwhile, many affiliate training arenas are under construction nation-wide. Our robots are being assessed in various scenarios ranging from bank customer guidance, power plant patrolling and inspecting, automotive assembly work, civil service, and etcetera, in which city waste processing took the lead and came to fruition bringing about an order of one thousand robots.
Company Products & Services
The company’s product portfolio includes:
AzureLoong Pro – humanoid robot, as tall as 1.85 meters, 31 degrees of freedom, targeting patrolling and inspection, carrying and manipulation, data collection;
AzureLoong Lite – humanoid robot, as tall as 1.45 meters, 24 degrees of freedom, targeting customer guidance, human interaction;
NanoLoong – miniature bipedal robot, targeting education segment;
WheelLoong – wheeled bimanual robot, targeting civil service.
Dexterous Hand – 6 degrees of freedom robotic hand, RS485 communication;
Dexterous Hand Pro – 19 degrees of freedom robotic hand, EtherCAT communication.
Meanwhile, we offer:
Adaptation of our motion control software framework to third party robots;
Remote control and cloud data collection integral solution for robots;
API authoring for robots to interface which to our robot management and controlling cloud platform that is privately deployable.
Panelist
International Semiconductor Industry Group (I.S.I.G.)
Formerly Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Panelist
Irene Deng
Nexperia
Irene Deng serves as General Manager for IC Solutions division at Nexperia, placing her among the company’s executive leadership as SVP. She is the central figure driving Nexperia’s expansion to analog and power ICs. Anchored globally in China, Europe, US, and rest of Asia areas, she’s guiding broader strategy to diversify Nexperia’s offerings beyond its traditional discrete devices toward high-value integrated circuits and high-power products. Since 2023, IC Solutions division has been releasing over triple digit new products annually in various product categories of Power IC, Isolation, Interfacing, Voltage Translators, Signal Path, and Standard Logic.
Company Profile
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
Panelist
Jun Li
ROHM Semiconductor
JUNLI joined ROHM in 2003, and have been in charge of ROHM China Technical Center for almost 20 years, including applications and promotions of ROHM semiconductors in consumers, automobile and industry.
Company Profile
ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.
14:10 – 14:35
Opportunities and Challenges for Energy and Power Semiconductors in the AI Era
AI 时代对能源和功率半导体的机遇和挑战
Alan Zhou, Ph.D.
Pixelworks
Dr. Alan Zhou has over 30 years of executive experience in multinational and startup companies within the semiconductor industry. Currently serving as the CEO of Shanghai Pixelworks Stock Limited Co. Formerly he was the CEO of BelGaN and Chairman of GaNcool. Before that, he was an Executive Vice President (EVP) of Pixelworks and the President of its China subsidiary, he was responsible for corporate restructuring, financing, acquisitions, and preparations for a STAR Market listing; He also served as the managing partner and Chief Strategy Officer (CTO) at the National IC Fund’s Fujian Anxin Capital, overseeing global investments and acquisitions for the third generation compound semiconductors; a Corporate Vice President at Qualcomm in charge of the smartphone chipset business worth over $3 billion; and a Managing Director at Lucent Technologies, where he led the development and design of China’s first local brand GSM mobile phone reference design and chipset. In 1998, he co-founded MEMSIC, a MEMS sensor company listed in NASDAQ around 2007; and in 1994, served as the General Manager of AT&T Bell Laboratories in Wuxi, managing the technology transfer and construction of China’s first sub-micron very large scale integrated circuit (VLSI) manufacturing Fab for the national 908 Project, which led to the establishment of CSMC went public in HongKong, then acquired by China Resources Group, now known as China Resources Microelectronics listed in the STAR exchange. Dr.Zhou graduated from MIT and earned a Master and Doctor degree in Microelectronics and Computer Science.
Company Profile
Pixelworks’ technology and solutions cover end to end, optimized video delivery that is true to its creator’s intent with a highly authentic viewing experience. Our innovations over two decades has resulted in a strong IP portfolio related to the visual display of digital image data. Our vision is that every screen, no matter how big or small, deserves the highest picture quality. This vision has driven us to develop technology that spans the range from digital projection systems and large flat panel displays to small, low power mobile devices such as smartphones. We also develop innovative methods to apply our core technologies to reduce overall system power and help reduce the bandwidth burden that comes with the display of HD and UHD video.
The relentless advancement of display technology and explosive growth of video consumption driven by digital delivery systems and mobile applications are increasing the necessity and demand for Video Display Processing technology. To meet this growing demand, we deliver our technology as IP cores, semiconductors, software and custom ASIC solutions. This flexible approach allows our customers to deliver the highest video quality in a multitude of applications and form factors while also providing the ability for end product differentiation. Our primary target markets include smartphones, tablets and digital projection systems.
We focus our investments on developing video enhancement solutions for Video Delivery, Mobile Devices and Projectors market segments, with particular attention to increasing performance, video quality, device functionality and saving power. Additionally, we look for ways to leverage our research and development investment into products that address other high-value markets where our innovative proprietary technology provides differentiation for us and our customers. We continually seek to expand our technology portfolio through internal development, co-development with business partners.
PART 5: 功率封装创新新
14:40 – 15:00
Tackling the Power Wall-Next Level of Integration Technologies in PCB and Substrates
突破功率墙:PCB 与基板集成技术的进阶之路
The presentation explores how advanced integration technologies in PCBs and substrates are key to overcoming critical challenges of the power wall. It highlights the growing energy demands driven by AI and data-centric applications, and the need for efficient power management in high-performance computing. Through innovations like embedded packaging, GaN and SiC modules, and advanced substrates, AT&S demonstrates solutions that enhance thermal performance, reduce electrical losses, and support heterogeneous integration—paving the way for scalable, energy-efficient electronics in automotive, data centers, and beyond.
Hong (Rainbow) Yuan
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Rainbow Yuan is a seasoned technology executive with over two decades of experience in the electronics and telecommunications industry. Her leadership roles have spanned various domains including product engineering, front-end engineering, strategic marketing, and business development. Currently she is serving as the Vice President of Technology at AT&S Headquater in Leoben, Austria, she leads global teams in Application Engineering Excellence and Technology Development, driving innovation and aligning technology strategies with business goals.
Company Profile
Technology and digitalisation are having an ever-growing impact on our lives and are increasingly shaping our daily routines at home and at work. The advances achieved in these fields in recent years are truly breathtaking and have created crucial momentum for growth in every sector of the economy.
As a global technology enterprise, AT&S is actively involved in these developments and plays a decisive role in shaping the digital world of tomorrow. The high-end PCBs and IC substrates AT&S supplies influence future industry standards, products and applications in a number of key industries. Our products’ unrivalled quality and constant innovation secures our customers’ long-term competitiveness. AT&S brings its expertise to bear wherever data is processed, transmitted or stored, or complex systems and machinery need to be controlled or supplied with energy. Thanks to our years of experience in microelectronics, we have the engineers and knowledge needed to overcome any technical challenge. We have developed the best products, processes and technologies in the industry – and constantly strive to develop further and make sure we stay one step ahead.
Company Products & Services
Our printed circuit boards and IC substrates represent the very latest technology and can be found in cars, industrial plants, servers, medical technology products and consumer electronics. Video streaming, apps, social media and other cornerstones of everyday digital life would not be possible without AT&S. Our technologies and products are a driving force behind rapidly advancing miniaturisation in the electronics industry and enable maximum performance in the smallest of spaces. Our products: IC substrates, Substrate-like printed circuit boards and modules, Flexible and rigid-flex printed curcuit boards, Thermally enhanced printed circuit boards, HDI printed circuit boards, Cavity printed circuit boards, ECP printed circuit boards, High-frequency & high-speed printed circuit boards, Multilayer printed circuit boards, Test & reference boards, Double-sided printed circuit boards.
15:05 – 15:25
Breaking the Mold and Driving Innovation – Challenges and Advances in Automotive Power Packaging Technology
突破常规,驱动创新 – 汽车功率封装技术的挑战与进展
This report focuses on the automotive power semiconductor market, providing a comprehensive analysis of its core applications and key technological challenges. By examining the market landscape and the critical role of power semiconductors in electric vehicles (EVs) and intelligent systems, the report identifies major technical bottlenecks and industry barriers. It also highlights JCET’s strategic layout in power semiconductor packaging and testing, including cutting-edge solutions where AI integration significantly enhances efficiency across the entire packaging and testing process. Additionally, the report showcases the advanced capabilities of JCET’s new automotive electronics factory and emphasizes its comprehensive one-stop service—covering design, packaging, and testing—to meet diverse customer needs.
Gang Jung
JCET
Korean veteran Automotive Electronic Expert, Currently serving as GM of JCET Automotive BU. With over 23years of profound expertise at the world’s top semiconductor packaging & testing companies and leading global Tier1 suppliers, he processes extensive experience in R&D, supply chain optimization,quality management and OEM customer service. Mr. Jung Gang has consistently pursued the mission of being the “Global Automotive Industry’s Best Partner.” Through technological innovation and lean management, he continues to drive globalization in the smart mobility sector.
Company Profile
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
15:30 – 15:40
Plating of Through-Glass-Vias
玻璃通孔电镀
The IC substrate industry is the foundation of the semiconductor ecosystem, with its innovation and advancements directly affecting the performance, reliability, and efficiency of electronic products. Glass Through-Via (TGV) technology is one of the most promising advancements in this field, offering high electrical performance, improved thermal management, and significant miniaturization potential. However, achieving these advantages entails numerous technical and manufacturing challenges. Glass, as a substrate material, has excellent electrical insulation, low dielectric constant, and better CTE values compared to organic cores, but its brittleness presents significant challenges. Ensuring the mechanical integrity of glass substrates throughout the stages of via formation, metallization, and subsequent stacking requires innovative methods and precise control of processing parameters.
Marcus Elmar Lang
Simetric Semiconductor Solutions Co., Ltd.
Mr. Marcus Elmar Lang, co-founder and CTO of Simetric Semiconductor Solutions, has over 30 years of expertise in PCB and IC substrate manufacturing. Holder of 20+ inventions and several technology awards, he played a leading role in enabling mass production of 9/12μm substrates at a top IC substrate company. He has also provided key process support to global equipment manufacturers and, together with a major OEM, successfully advanced Panel Level Packaging (PLP) technology into industrial production.
Company Profile
Simetric Semiconductor Solutions Co., Ltd., founded in June 2020 and headquartered in Shenzhen, is a high-tech enterprise dedicated to advanced IC manufacturing. The company focuses on electrochemical deposition (ECD), etching, and micropore processing equipment, and has independently developed cutting-edge electroplating and etching technologies. With proven capabilities in 5-micron fine line electroplating, TGV precision hole filling, and micro copper pillar processes, Simetric has successfully introduced corresponding mass production equipment. As an independent Chinese enterprise, the company provides comprehensive solutions that integrate both equipment and process technologies, serving customers in domestic and international markets.
The IC substrate industry plays a critical role as the foundation of the semiconductor ecosystem. Its technological innovations directly impact the performance, reliability, and efficiency of electronic products. Within this field, Glass Through-Via (TGV) technology represents one of the most promising advancements, enabling superior electrical performance, enhanced thermal management, and significant miniaturization potential. At the same time, TGV presents unique challenges due to the brittle nature of glass substrates. Ensuring mechanical integrity throughout via formation, metallization, and stacking requires precise process control and innovative engineering approaches—areas where Simetric continues to deliver industry-leading expertise and solutions.
Company Products & Services
Founded in 2020 and headquartered in Shenzhen, Simetric is a high-tech enterprise specializing in advanced IC substrate manufacturing solutions. The company focuses on electrochemical deposition (ECD), etching, and micropore processing, with proven expertise in 5-micron fine line electroplating, Through-Glass Via (TGV) precision hole filling, and micro copper pillar processes.
Simetric designs and develops mass production equipment alongside proprietary process technologies, enabling customers to achieve high-yield, high-reliability manufacturing. Its integrated solutions cover the full chain from equipment innovation to process optimization, supporting both domestic and international clients in scaling next-generation IC substrates.
With TGV and advanced substrate technologies at the core, Simetric is helping drive miniaturization, improved electrical performance, and thermal efficiency in semiconductor packaging. By combining independent R&D with deep process know-how, the company continues to deliver breakthrough solutions that strengthen the global semiconductor ecosystem.
15:45 – 16:05
Advanced Packaging Materials Innovation through Co-creative Activities
协同创新赋能先进封装材料:技术突破与应用探索
In the semiconductor field that supports the evolution of generative AI, innovative packaging technology is attracting increasing attention.
Resonac, a co-creation chemical company, has established a Packaging Solution Center to provide one-stop solutions for its customers,
and has launched the evaluation platform “JOINT2” together with materials, substrate, and equipment manufacturers to accelerate the development of cutting-edge packaging technologies.
In this presentation, we will discuss trends in advanced packaging materials and the latest technologies related to panel interposers. We will also highlight the value and material innovations generated through co-creation activities.
Hidenori Abe
Resonac Holding Corporation
Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.
Company Profile
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
16:10 – 17:10
Networking and Coffee Break
PART 6: 投资与风险资本:助力未来创新
17:10 – 17:55
Panel Discussion 圆桌讨论
Topic: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
投资与风险资本的关键作用 —— 驱动突破性技术,助力中国半导体生态发展
Moderator
Alan Zhou, Ph.D.
Pixelworks
Dr. Alan Zhou has over 30 years of executive experience in multinational and startup companies within the semiconductor industry. Currently serving as the CEO of Shanghai Pixelworks Stock Limited Co. Formerly he was the CEO of BelGaN and Chairman of GaNcool. Before that, he was an Executive Vice President (EVP) of Pixelworks and the President of its China subsidiary, he was responsible for corporate restructuring, financing, acquisitions, and preparations for a STAR Market listing; He also served as the managing partner and Chief Strategy Officer (CTO) at the National IC Fund’s Fujian Anxin Capital, overseeing global investments and acquisitions for the third generation compound semiconductors; a Corporate Vice President at Qualcomm in charge of the smartphone chipset business worth over $3 billion; and a Managing Director at Lucent Technologies, where he led the development and design of China’s first local brand GSM mobile phone reference design and chipset. In 1998, he co-founded MEMSIC, a MEMS sensor company listed in NASDAQ around 2007; and in 1994, served as the General Manager of AT&T Bell Laboratories in Wuxi, managing the technology transfer and construction of China’s first sub-micron very large scale integrated circuit (VLSI) manufacturing Fab for the national 908 Project, which led to the establishment of CSMC went public in HongKong, then acquired by China Resources Group, now known as China Resources Microelectronics listed in the STAR exchange. Dr.Zhou graduated from MIT and earned a Master and Doctor degree in Microelectronics and Computer Science.
Company Profile
Pixelworks’ technology and solutions cover end to end, optimized video delivery that is true to its creator’s intent with a highly authentic viewing experience. Our innovations over two decades has resulted in a strong IP portfolio related to the visual display of digital image data. Our vision is that every screen, no matter how big or small, deserves the highest picture quality. This vision has driven us to develop technology that spans the range from digital projection systems and large flat panel displays to small, low power mobile devices such as smartphones. We also develop innovative methods to apply our core technologies to reduce overall system power and help reduce the bandwidth burden that comes with the display of HD and UHD video.
The relentless advancement of display technology and explosive growth of video consumption driven by digital delivery systems and mobile applications are increasing the necessity and demand for Video Display Processing technology. To meet this growing demand, we deliver our technology as IP cores, semiconductors, software and custom ASIC solutions. This flexible approach allows our customers to deliver the highest video quality in a multitude of applications and form factors while also providing the ability for end product differentiation. Our primary target markets include smartphones, tablets and digital projection systems.
We focus our investments on developing video enhancement solutions for Video Delivery, Mobile Devices and Projectors market segments, with particular attention to increasing performance, video quality, device functionality and saving power. Additionally, we look for ways to leverage our research and development investment into products that address other high-value markets where our innovative proprietary technology provides differentiation for us and our customers. We continually seek to expand our technology portfolio through internal development, co-development with business partners.
Panelist
Leon(Yenan) Wu, Ph.D.
Xi’an Longding Investment Management Co., Ltd.
Company Profile
Xi’an Longding Investment Management Co., Ltd. (referred to as “Longding”) was established in 2014. It is a high-end investment management company focused on the needs of national development, with “finance” and “industry” as the core drivers, focusing on hard technology tracks such as semiconductors, new energy, and information technology.
西安龙鼎投资管理有限公司(简称“龙鼎投资”)成立于2014年,是一家以国家发展需求为核心导向,以“金融”+“产业”为核心引擎,专注半导 体、新能源、信息技术等硬科技赛道的精品投资管理公司。
Panelist
Cynthia Zhang
FutureX Capital
Cynthia Zhang is the founder of FutureX Capital, a boutique all-stage fund focused on global high-tech and AI companies. Some of her notable portfolio includes Bytedance (TikTok), NIO (NYSE: NIO), Meituan (3690.HK), Xiaomi (1810.HK), and Kingsoft Cloud (NASDAQ: KC). She has been consistently recognized as one of the Top 50 Female Investors and Top Technology GP in China.
Prior to founding FutureX, Cynthia was the founder of the Private Equity Division at China Asset Management Company, one of the largest asset management firms in Asia.
Cynthia holds a bachelor’s degree in Computer Science from the National University of Singapore, an EMBA from Tsinghua University’s PBC School of Finance, and is an alumna of the Stanford Executive Program at Stanford Graduate School of Business.
Company Profile
FutureX Capital invests in visionary founders building transformative AI technologies across all stages. With $3B+ accumulated investment and deep roots in the US and China tech ecosystems, we’re positioned at the forefront of the next wave of innovation.
Panelist
Jianhui Wang
South China Venture Capital
Panelist
MTM CAPITAL CO., LTD
17:55 – 18:05
Closing speech by moderator
Wilson Hong
International Semiconductor Industry Group (I.S.I.G.)
Formerly Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
翌日峰会总结演讲 — 洪文成 / 蔚来汽车
18:05 – 18:30
Networking and Drink Reception 社交及酒会
The End of Day 2
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