Redefining Semiconductor Excellence: Innovation, Sustainability, and Global Transformation

07:30 – 08:50

Registration 签到注册

PART 4: Power Devices Applications in Humanoid Robot, eVTOL and Date Center Power

PART 4: 功率器件在人形机器人、低空飞行器及数据中心电源中的应用 

09:00 – 09:05

Welcome speech by Day 2 moderator

Wilson Hong

Chair of ISIG China

International Semiconductor Industry Group (I.S.I.G.)

09:05 – 09:25

Keynote

Humanoid Robot and the Application of Semiconductor in It

人形机器人及其半导体应用 

This presentation introduces the company Humanoid Robot Shanghai and its achievements in robot hardware, software, and AI algorithm then goes into the details of some of the hardware devices of humanoid robots, such as motor drivers, lidars, bionic hands, and control computers, elucidating the uses of electronic components in them and the demands that humanoid robots put on pertaining semiconductor domains.

Jingran Cheng

Software Development Manager

Humanoid Robot Shanghai Co., Ltd.

09:30 – 09:50

Keynote

eVTOL marketing trend 低空飞行器未来市场趋势

1、低空经济火热带来低空飞行器的新市场机会。

2、应用场景有效落地是低空经济发展的核心,也是低空飞行器的挑战。

3、作为低空飞行器的核心零部件,适航低成本动力将成为低空场景落地的核心因素。

  1. The booming low-altitude economy has brought about new market opportunities for low-altitude aircraft.
  2. The effective implementation of application scenarios is the core of the development of the low-altitude economy and also a challenge for low-altitude aircraft.
  3. As a core component of low-altitude aircraft, airworthy and low-cost power will become a key factor in the implementation of low-altitude scenarios.

KeDa Xu

Founder & CEO

Falcon Sichuan Aviation Technology Co. Ltd

09:55 – 10:15

Keynote

Powering AI Today and Tomorrow: Innovations in Power Conversion Solutions

赋能当下与未来的人工智能:功率转换解决方案的创新 

Data Center Power 数据中心电源

Wei Liu

VP, Infineon Technologies, Marketing Head of Consumer, Computing & Communication, Infineon Technologies Greater China, Site Head for Infineon Shenzhen

Infineon Technologies AG

10:15 – 11:15

Networking + Coffee Break 社交及茶歇

11:15 – 11:35

Small Components, Big Impact: From Power to Signal Integrity for AI Servers by Nexperia

小元件撬动大价值 ——AI 服务器的功率与信号完整性技术解析

AI servers demand unprecedented levels of power efficiency, thermal resilience, and high-speed signal integrity – challenges that hinge on the performance of small but mission-critical components. In this presentation, I will show cases of Nexperia’s current portfolio and coming sampling Power Management ICs, Signal Interfacing iCs, advanced packaging technologies to ultra-low-loss power discrete and high-speed ESD protections that enables next-generation AI hardware. We explore Power Delivery, Signal Integrity, and System reliability. We’ll demonstrate component choices can reduce system bottlenecks, improve energy efficiency, and extend the lifespan of AI server platforms. Nexperia is the one-stop-shop for discrete & standard logic components and analog ICs.

Irene Deng

SVP

Nexperia

11:40 – 12:00

SiC Power Devices: The Core Technology Solution Reshaping the New Energy Landscape

SiC 功率器件:重塑新能源格局的核芯技术解决方案

In the current booming new energy market, the rapid advancement and widespread adoption of electric vehicle technology have become an irreversible trend. As consumers’ demands for the performance and user experience of electric vehicles continue to rise, the efficiency, stability, and safety of onboard charging systems have also garnered increased attention. In this presentation, we will share application cases of Fitpower’s silicon carbide solutions in onboard chargers (OBCs) and DC-DC converters, as well as our experience in the promotion and validation of these solutions in the 400V/800V main drive market.

在当前蓬勃发展的新能源市场中,电动汽车技术的快速进步与广泛普及已成为不可逆转的趋势。随着消费者对于电动汽车性能与体验的要求日益提升,车载充电系统的高效性、稳定性以及安全性也相应地受到了更高的关注。本次演讲将为大家分享飞锃碳化硅在车载OBC(车载充电机)和DC(直流转换器)领域的应用案例,以及在400V/800V主驱市场的推广和验证经验分享。

Heming Li

Product Marketing VP

Alpha Power Solutions (Shanghai) Ltd.

12:05 – 13:20

Buffet Lunch 自助午餐

13:25 – 14:10

Panel Discussion 圆桌讨论

Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案 

 

Moderator

Jason Lin

Product Marketing Director

Onto Innovation

Panelist

Carsten Mohr

General Manager

CuNex

Panelist

KeDa Xu

Founder & CEO

Falcon Sichuan Aviation Technology Co. Ltd

Panelist

Jingran Cheng

Software Development Manager

Humanoid Robot Shanghai Co., Ltd.

Panelist

Wilson Hong
Chair of ISIG China

International Semiconductor Industry Group (I.S.I.G.)

Panelist

Irene Deng

SVP

Nexperia

Panelist

Jun Li

General Manager (FAE Head Quarter), Shanghai

ROHM Semiconductor

14:10 – 14:35

Opportunities and Challenges for Energy and Power Semiconductors in the AI Era

AI 时代对能源和功率半导体的机遇和挑战

Alan Zhou, Ph.D.

CEO

Pixelworks

PART 5: Power Packaging Innovations

PART 5: 功率封装创新新 

14:40 – 15:00

Tackling the Power Wall-Next Level of Integration Technologies in PCB and Substrates

突破功率墙:PCB 与基板集成技术的进阶之路 

The presentation explores how advanced integration technologies in PCBs and substrates are key to overcoming critical challenges of the power wall. It highlights the growing energy demands driven by AI and data-centric applications, and the need for efficient power management in high-performance computing. Through innovations like embedded packaging, GaN and SiC modules, and advanced substrates, AT&S demonstrates solutions that enhance thermal performance, reduce electrical losses, and support heterogeneous integration—paving the way for scalable, energy-efficient electronics in automotive, data centers, and beyond.

Hong (Rainbow) Yuan

VP of Technology

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

15:05 – 15:25

Breaking the Mold and Driving Innovation – Challenges and Advances in Automotive Power Packaging Technology

突破常规,驱动创新 – 汽车功率封装技术的挑战与进展

This report focuses on the automotive power semiconductor market, providing a comprehensive analysis of its core applications and key technological challenges. By examining the market landscape and the critical role of power semiconductors in electric vehicles (EVs) and intelligent systems, the report identifies major technical bottlenecks and industry barriers. It also highlights JCETs strategic layout in power semiconductor packaging and testing, including cutting-edge solutions where AI integration significantly enhances efficiency across the entire packaging and testing process. Additionally, the report showcases the advanced capabilities of JCETs new automotive electronics factory and emphasizes its comprehensive one-stop servicecovering design, packaging, and testingto meet diverse customer needs.

Gang Jung

Vice President

JCET

15:30 – 15:40

Plating of Through-Glass-Vias

玻璃通孔电镀

The IC substrate industry is the foundation of the semiconductor ecosystem, with its innovation and advancements directly affecting the performance, reliability, and efficiency of electronic products. Glass Through-Via (TGV) technology is one of the most promising advancements in this field, offering high electrical performance, improved thermal management, and significant miniaturization potential. However, achieving these advantages entails numerous technical and manufacturing challenges. Glass, as a substrate material, has excellent electrical insulation, low dielectric constant, and better CTE values compared to organic cores, but its brittleness presents significant challenges. Ensuring the mechanical integrity of glass substrates throughout the stages of via formation, metallization, and subsequent stacking requires innovative methods and precise control of processing parameters.

Marcus Elmar Lang

CTO

Simetric Semiconductor Solutions Co., Ltd.

15:45 – 16:05

Advanced Packaging Materials Innovation through Co-creative Activities

协同创新赋能先进封装材料:技术突破与应用探索

In the semiconductor field that supports the evolution of generative AI, innovative packaging technology is attracting increasing attention.
Resonac, a co-creation chemical company, has established a Packaging Solution Center to provide one-stop solutions for its customers,
and has launched the evaluation platform “JOINT2” together with materials, substrate, and equipment manufacturers to accelerate the development of cutting-edge packaging technologies.
In this presentation, we will discuss trends in advanced packaging materials and the latest technologies related to panel interposers. We will also highlight the value and material innovations generated through co-creation activities.

Hidenori Abe

Executive director, Electronics Business Headquarters and CTO for semiconductor materials

Resonac Holding Corporation

16:10 – 17:10

Networking and Coffee Break

PART 6: Investment & Venture Capital: Fueling Future Innovation

PART 6: 投资与风险资本:助力未来创新 

17:10 – 17:55

Panel Discussion 圆桌讨论

Topic: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
投资与风险资本的关键作用 —— 驱动突破性技术,助力中国半导体生态发展 

Moderator

Alan Zhou, Ph.D.

CEO

Pixelworks

Panelist

Leon(Yenan) Wu, Ph.D.

Founding Partner & CEO

Xi’an Longding Investment Management Co., Ltd.

Panelist

Cynthia Zhang

Founding Partner

FutureX Capital

Panelist

Jianhui Wang

Partner

South China Venture Capital

Panelist

Jun Wang
Chairman

MTM CAPITAL CO., LTD

17:55 – 18:05

Closing speech by moderator

Wilson Hong

Chair of ISIG China

International Semiconductor Industry Group (I.S.I.G.)

18:05 – 18:30

Networking and Drink Reception 社交及酒会

The End of Day 2 

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