Redefining Semiconductor Excellence: Innovation, Sustainability, and Global Transformation

07:30 – 08:50

Registration 签到注册

PART 4: Power Devices Applications in Humanoid Robot, eVTOL and Date Center Power

PART 4: 功率器件在人形机器人、低空飞行器及数据中心电源中的应用 

09:00 – 09:05

Welcome speech by Day 2 moderator

Wilson Hong

Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering

NIO

09:05 – 09:25

Keynote

Humanoid Robotics 人形机器人
Unitree 宇数科技 

09:30 – 09:50

Keynote

eVTOL marketing trend 低空飞行器未来市场趋势

1、低空经济火热带来低空飞行器的新市场机会。

2、应用场景有效落地是低空经济发展的核心,也是低空飞行器的挑战。

3、作为低空飞行器的核心零部件,适航低成本动力将成为低空场景落地的核心因素。

  1. The booming low-altitude economy has brought about new market opportunities for low-altitude aircraft.
  2. The effective implementation of application scenarios is the core of the development of the low-altitude economy and also a challenge for low-altitude aircraft.
  3. As a core component of low-altitude aircraft, airworthy and low-cost power will become a key factor in the implementation of low-altitude scenarios.

KeDa Xu

Founder & CEO

Falcon Sichuan Aviation Technology Co. Ltd

09:55 – 10:15

Keynote

Data Center Power 数据中心电源
Infineon 英飞凌 

Wei Liu

Vice President of Infineon’s Power & Sensor Systems Division for Greater China and General Manager of Infineon Shenzhen

Infineon Technologies AG

10:15 – 11:15

Networking + Coffee Break 社交及茶歇

11:15 – 11:35

Reserved speak slot 

11:40 – 12:00

Small Components, Big Impact: From Power to Signal Integrity for AI Servers by Nexperia

AI servers demand unprecedented levels of power efficiency, thermal resilience, and high-speed signal integrity – challenges that hinge on the performance of small but mission-critical components. In this presentation, I will show cases of Nexperia’s current portfolio and coming sampling Power Management ICs, Signal Interfacing iCs, advanced packaging technologies to ultra-low-loss power discrete and high-speed ESD protections that enables next-generation AI hardware. We explore Power Delivery, Signal Integrity, and System reliability. We’ll demonstrate component choices can reduce system bottlenecks, improve energy efficiency, and extend the lifespan of AI server platforms.

Irene Deng

SVP

Nexperia

12:05 – 12:25

SiC 功率器件:重塑新能源格局的核芯技术解决方案

在当前蓬勃发展的新能源市场中,电动汽车技术的快速进步与广泛普及已成为不可逆转的趋势。随着消费者对于电动汽车性能与体验的要求日益提升,车载充电系统的高效性、稳定性以及安全性也相应地受到了更高的关注。本次演讲将为大家分享飞锃碳化硅在车载OBC(车载充电机)和DC(直流转换器)领域的应用案例,以及在400V/800V主驱市场的推广和验证经验分享。

Heming Li

Product Marketing VP

Alpha Power Solutions (Shanghai) Ltd.

12:25 – 13:45

Buffet Lunch 自助午餐

13:45 – 14:30

Panel Discussion 圆桌讨论

Topic: Tailoring Semiconductor Solutions for Diverse Application Ecosystems
多元化应用生态定制半导体解决方案 

 

Moderator

Onto Innovation

Panelist

Wilson Hong

Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering

NIO

Panelist

KeDa Xu

Founder & CEO

Falcon Sichuan Aviation Technology Co. Ltd

Panelist

Jun Li

General Manager (FAE Head Quarter), Shanghai

ROHM Semiconductor

Panelist

Irene Deng
SVP

Nexperia

Panelist

Carsten Mohr

General Manager

CuNex

PART 5: Power Packaging Innovations

PART 5: 功率封装创新新 

14:30 – 14:50

Embeded Chip Packaging topic
Reserved for AT&S 

14:55 – 15:15

Gang Jung

Vice President

JCET

15:20 – 15:30

Marcus Lang

CTO

Simetric Semiconductor Solutions Co., Ltd.

15:35 – 15:55

Advanced Packaging Materials Innovation through Co-creative Activities

In the semiconductor field that supports the evolution of generative AI, innovative packaging technology is attracting increasing attention.
Resonac, a co-creation chemical company, has established a Packaging Solution Center to provide one-stop solutions for its customers,
and has launched the evaluation platform “JOINT2” together with materials, substrate, and equipment manufacturers to accelerate the development of cutting-edge packaging technologies.
In this presentation, we will discuss trends in advanced packaging materials and the latest technologies related to panel interposers. We will also highlight the value and material innovations generated through co-creation activities.

Hidenori Abe

CTO for semiconductor materials, Resonac Holdings Corporation & Executive director, Electronics Business Headquarters, Resonac Corporation

Resonac Corporation

16:00 – 16:10

Reserved

Semikron Danfoss

16:10 – 17:00

Networking and Coffee Break

PART 6: Investment & Venture Capital: Fueling Future Innovation

PART 6: 投资与风险资本:助力未来创新 

17:00 – 17:45

Panel Discussion 圆桌讨论

Topic: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
投资与风险资本的关键作用 —— 驱动突破性技术,助力中国半导体生态发展 

Moderator

Alan Zhou, Ph.D.

CEO, Shanghai

Pixelworks

Panelist

Leon(Yenan) Wu, Ph.D.

Founding Partner & CEO

Xi’an Longding Investment Management Co., Ltd.

Panelist

Cynthia Zhang

Founder

FutureX Capital

17:45 – 17:55

Closing speech by moderator

Wilson Hong

Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering

NIO

17:55 – 18:30

Networking and Drink Reception 社交及酒会

The end of Day 2 

End of content

End of content