Driving the Future: Breakthroughs in Advanced Packaging, Glass Substrates, and Automotive Innovations

08:00 – 08:35

Registration

08:40 – 09:00

Welcome Speech

Salah Nasri

CEO and Co-Founder

International Semiconductor Industry Group (I.S.I.G.)

Tadahiro Suhara

CEO

TSSC

09:00 – 09:20

Opening Speech

Ministry of Economy, Trade and Industry (METI)

Powering AI Era with Advanced Innovations: Advanced Packaging, HBM, Advanced Manufacturing

09:20 – 09:40

Keynote

Terushi Shimizu

Chairman

Sony Semiconductor

09:40 – 10:00

Keynote

Reserved for TSMC  

10:00 – 10:20

Keynote

Norishige (Noly) Morimoto

VP of IBM Japan & CTO of Research & Development

IBM Japan, Ltd.

10:25 – 11:25

Networking & Business Meeting 1 + 2

11:30 – 11:50

Keynote

Reserved for Sk Hynix

11:50 – 12:10

Keynote

Reserved for Rapidus

12:10 – 12:30

Keynote

Deepak Kulkarni

Senior Fellow Advanced Packaging

AMD

12:35 – 13:50

LUNCH

13:55 – 14:15

Lode Lauwers

Senior Vice President Business Development & Sales

imec

14:15 – 14:35

Reserved for Micron Technology

14:35 – 14:55

Reserved

14:55 – 15:15

Reserved for Samsung 

15:15 – 15:35

Takahiro Ogura

Director & VP, AI Computing Division

Preferred Networks

15:40 – 16:40

Networking & Business Meeting 3 + 4

16:45 – 17:05

Resonac Corporation

17:05 – 17:15

ASMPT Limited

17:15 – 17:25

Lam Research Corporation

17:25 – 17:35

Akihiko Furuya

Executive Officer, Head of Semiconductor Subdivision, Electronics Division

TOPPAN Inc.

Market Insights

17:35 – 17:55

Yole Group

17:55 – 18:15

Akira Minamikawa photo

Akira Minamikawa

Senior Analyst

OMDIA

18:15 – 18:30

Dinner check-in

18:30 – 21:00

Gala Dinner

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