Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.

Mr. Tomoshige NAMBU has served as the Director for IT Industry Division at the Ministry of Economy, Trade, and Industry (METI) in Japan since July 2025. He leads METI’s AI and semiconductor strategy.

Prior to his current position, he spent 3.5 years in NYC and Washington D.C. from December 2021 to June 2025, serving as Special Advisor for METI at the New York Office of the Japan External Trade Organization (JETRO). He was a senior METI representative in the US, covering trade and economic security policies.

During a more than 20-year career at METI, Mr. Nambu has held responsibilities across a diverse range of public policy areas. He was involved in the formulation of Japan’s economic policy in 2018-2021 as the Director for Macroeconomic Policy at METI. He also assumed the duty of Cabinet Counselor, drafting policy proposals on economic growth strategy under the direction of the Prime Minister’s office.

He was stationed in Washington D.C. as the Trade Attaché at the Embassy of Japan in the U.S. from 2012 to 2015 and worked on several bilateral trade issues such as TPP and energy exports from the U.S.

He joined METI in 2002 after receiving a Bachelor of Law from the University of Tokyo. He also holds an L.L.M from Harvard Law School. He served as the Asia Program Fellow at the Rajawali Foundation Institute for Asia in Harvard Kennedy School in 2009-2010. He currently lives in Tokyo with his wife.

In April 1980, he joined Sony Corporation (renamed Sony Group Corporation in April 2021), where he served as an engineer in the semiconductor business.
From 1991, he moved to the U.S. to be engaged in planning and control of semiconductor business at Sony Electronics’ Fab.
After returning to Japan, from 1999, he was assigned to Sony Computer Entertainment Inc. as the General Manager of the planning and control department, where he was responsible for the start-up of semiconductors for PlayStation.
In 2016, he was appointed Representative Director and President of Sony Semiconductor Solutions Corporation.
From 2020 to March 31, 2025, he was Representative Director, President and CEO of the company.
From 2021 to March 31, 2025, he was Senior EVP, Officer in charge of Imaging & Sensing Solutions Business, Sony Group Corporation.
He was appointed to Director and Chairman of Sony Semiconductor Solutions Corporation as of April 1, 2025.

Norishige Morimoto is Vice President and CTO of IBM Japan, and a Board Member since 2024. He joined IBM in 1987 as a hardware engineer and earned his Master’s in EE&CS from MIT in 1995. He has held global leadership roles including Director of IBM Research-Tokyo, CTO of IBM Asia Pacific, and VP of R&D Japan. He formerly chaired the Information Processing Society of Japan and served on boards of Temple University Japan and SMBC Group. He advises METI’s semiconductor strategy panel and is a member of JAOTEX, promoting innovation and leadership in Japan’s tech ecosystem.

Deepak Kulkarni is a Senior Fellow at Advanced Micro Devices (AMD), where he leads the Instinct and Optics Technology Development team. In this role, he develops heterogeneous architectures for AMD’s AI accelerator products and oversees Photonics technology development.

With twenty years in technology development, Deepak has led the development of several innovative technologies such as panel-level fan-out, Embedded Multi-die Interconnect Bridge (EMIB), Elevated Fan-Out Bridge (EFB), and 3.5D packaging solutions. Recognized with top awards at both AMD and Intel, and a frequent voice on high-level industry panels, Deepak brings both technical depth and strategic vision to advancing heterogeneous integration.

Deepak’s technical interests cover Co-packaged Optics, Panel-level packaging, and design-technology co-optimization. He holds forty patents and has published over twenty papers.  He earned his PhD in Mechanical Engineering with a minor in Computational Science from the University of Illinois at Urbana-Champaign.

Dr. Kazunari Ishimaru, IEEE Fellow, is CTO and Senior Managing Executive Officer at Rapidus Corporation. He began his career at Toshiba in 1988, contributing to SRAM and logic development. As VP of R&D at Toshiba America Electronic Components, he led 32nm–20nm CMOS projects with IBM. Returning to Japan, he oversaw logic manufacturing at Toshiba Oita and emerging memory R&D at Kioxia Yokkaichi, later becoming Director of the Institute of Memory Technology R&D. He joined Rapidus in 2023 and became CTO in 2025, driving Japan’s advanced semiconductor initiatives, including 2nm logic and the RUMS model for integrated manufacturing innovation.

Lode Lauwers is Senior Vice President Business Development and Strategy in IMEC, the nanoelectronics R&D Center in Leuven, Belgium. His current focus is to architect new global R&D collaborations and related business models, in line with semiconductor technology initiatives in various continents currently in conception. In that role he also guides imec’s Corporate Business Development strategies in nanoelectronics. Since he joined IMEC in 2005, he had various leading roles in IMEC’s technology business development and partner relation management. He has been driving over 2 decades the build-out, growth and business foundations of imec’s flagship core program with leading IC manufacturers, foundries, equipment and material suppliers and design and system houses. Earlier, he has been general manager of an ASIC design house, part of a US-based ASSP provider for the telecom industry, and scientific advisor for government funding in local and European cooperative networks in micro-electronics and telecommunications. He has a PhD in Electrical Engineering from KU Leuven.

Received PhD in Electronic Engineering from Tohoku university.

1991-2015
Ibiden Corporation
– Management for Package Substrate Development Leaded substrate technology pathfinding with major semiconductor IDM, Fab less, Foundry, OEMs more than 10 years.

2015-2022
TDK Corporation
– Management for Development and business operation of Thin film component and Module. Leaded cutting edge components, MEMS and embedded IC modules.

2022-
Samsung Japan Corporation, Device Solutions R&D Japan
– Head of Advanced Package Lab of Samsung Japan Corporation and also Corporate Vice President of Samsung Electronics Corporation.
– Launch Advanced Package lab in Yokohama and setting up R&D environment at MinatoMirai.

Takahiro Ogura is a seasoned leader in high-performance computing with over 20 years of experience. He currently heads the AI Computing Division at Preferred Networks (PFN), overseeing the company’s critical computing infrastructure technologies including the MN-Core™ series of AI semiconductors and in-house supercomputers. Prior to joining PFN, he served as the after-sales service manager for domestic high-performance computing clients at Fujitsu, where he began his career as a systems engineer working on supercomputer systems projects. A notable career highlight was his instrumental role in the design and development of the Fugaku (Post-K) supercomputer at Japan’s national research and development agency RIKEN. Ogura received a Master’s degree from Tsukuba University’s Systems and Engineering program in 2005.

Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.

Herbert Oetzlinger , graduated HTL Braunau 1987 in high power electronics/ electrotechnics.

Herbert worked in the Semiconductor industry for 30+ years, focused on wet processing .

Special focus on advanced packaging in electroplating and wet etching/cleaning of wafers and substrates. For many years he was VP of Sales with Semitool Inc, where he excelled with his in-depth knowledge of process and hardware. During this time, Herbert worked with many worldwide leading companies on Fan-out, E-WLB and other new developments in wafer level advanced packaging.

In 2012, he founded Semsysco GmbH and is also heading the company as CEO.

LAM – Semsysco is a world leader in high speed electrochemical deposition with a pedigree and expertise in all-around wet processing for wafer and panel level.

Graduated From Nagasaki University Master’s Degree

(Appointed Dates)
April 1993 　       Joined Toppan Printing Co.,Ltd., Electronics Division
April 1996 　       TOPPAN Kumamoto Technical Research Institute.
April 2002 　       TOPPAN (Corporate) Technical Research Institute
April 2010 　       General Manager, FC-BGA Engineering Department, Toyama Plant
April 2014 　       General Manager, FC-BGA Engineering Department, Niigata Plant
April 2018 　       Head of Technical Development Headquarters Ⅱ, Electronics Division
April 2022 　      Head of Semiconductor Business, Electronics Division
April 2023 　      Executive Officer, Head of Semiconductor Business, Electronics Division
October 2023      TOPPAN Inc. Executive Officer, Head of Semiconductor Business, Electronics Division
April 2025　      TOPPAN Inc. Executive Officer, Head of Semiconductor Subdivision, Electronics Division

Dimitrios Damianos is a Senior Manager for Consulting Services at Yole Group.

With over 10 years of experience in the fields of nanotechnology, semiconductors, market research and strategy consulting, Dimitrios provides strategic insights and tailored solutions/consulting projects to clients across the whole semiconductor value chain and emerging technologies, and is also responsible for commercial & customer relationships.

Dimitrios has successfully managed and authored multiple market reports and client projects, including market analysis, competitive intelligence, marketing/go-to-market studies, technology assessments, strategy, Due Diligence and tech M&A for clients ranging from startups and R&D institutes to Fortune 500 companies and governments.

He holds a BSc in Physics and MSc in Photonics, as well as a PhD in optics & microelectronics.

Akira Minamikawa
Born on 6 Dec, 1958
Informa Intelligence LLC
Senior Consulting Director

From Aug ,2019. Senior Consulting Director, Informa Intelligence LLC, UK
Nov, 2010. Consulting Director, IHS Global Inc. U.S.A

Jul, 2004. President and CEO of Data Garage Inc.

From Apr, 2003 to Feb 2004, Technology Head & Senior Analyst, Research Department, Credit Lyonnais Securities Co., Ltd.

From Jun, 2000 to Apr 2003, Director & Senior Analyst, Research Dep,
WestLB Securities Company

From Jan 1996 to May 2005, Director, IDC Japan, Inc.

From Mat 1990, to Dec 2005, Senior Analyst, Dataquest Semiconductor Industry Analysis Department, Gartner Japan, Inc.

From Apr 1982, to May 1990, HongKong Motorola Marketing specialist, Motorola Inc.

He has served as a core analyst for the Global Electronics and Semiconductor Mid- to Long-Term Outlook Committee at JEITA for 20 years. We have strengthened our research and consulting activities in Asia, including regularly delivering presentations at semiconductor symposiums hosted by Taiwan. He is a member of the Japan Patent Office’s technical review committee for automotive patents and semiconductor-related patent review committee. Member of the Research Evaluation Committee for NEDO’s “Development of FeRAM Manufacturing Technology” project. He is also an evaluation committee member for the “Post-5G Information and Communications System Infrastructure Strengthening Research and Development Project” and the “Technology Development Project for Strengthening the Manufacturing Infrastructure for Energy-Saving Electronics.” He is also an advisor to the Tokyo Institute of Technology’s Open Innovation Organization.

Lecture activities & writing activities
He regularly lectures at seminars hosted by JEITA, Electronic Devices News, SEMI Japan, NEDIA, SEAJ, and others. He also actively engages in public relations activities, including writing articles for media outlets and appearing on TV.