04:25 – 04:45

Reserved 

Driving the Future: Breakthroughs in Advanced Packaging, Glass Substrates, and Automotive Innovations

08:20 – 08:55

Registration

Advancing Substrate Technologies: Glass & Panel Substrates in Next-Gen Semiconductor and Packaging Solutions

09:00 – 09:20

Keynote

Rahul Manepalli, Ph.D.

Intel Fellow, VP, Director of Substrate Packaging Technology Development

Intel Corporation

09:20 – 09:40

Reserved for Ibiden 

09:40 – 10:00

Reserved for Shinko 

10:05 – 11:05

Networking & Business Meeting 5+ 6

11:10 – 11:20

Holger H. Kuehnlein, P.h.D.

Senior Vice President, Technology & Innovation

RENA Technologies GmbH

11:20 – 11:30

Maksym Plakhotnyuk, Ph.D.

CEO & Founder

ATLANT 3D

11:35 – 12:15

Panel Discussion: Advanced Packaging

 

 

Moderator

Onto Innovation

12:20 – 13:30

LUNCH

Shaping the Future of Power Semiconductor and Automotive with Cutting-Edge Innovations

13:35 – 13:55

Keynote

Hiroshi Iwatsubo

Executive Deputy President and CTO

Murata Manufacturing Co., Ltd.

13:55 – 14:15

Daisuke Murata

President and CEO

Murata Machinery

14:15 – 14:35

Kazuoki Matsugatani, P.h.D.

Senior Director, R&D Center

DENSO CORPORATION

14:35 – 14:45

Soitec

14:50 – 15:30

Networking & Business Meeting 7

15:55 – 16:15

Reserved for Renesas

16:15 – 16:25

Reserved for Fuji Electric  

16:25 – 16:45

Reserved

16:55 – 17:00

Closing Remark

I.S.I.G./

Tadahiro Suhara

CEO

TSSC

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