27-28 August 2025
Suwon
2-3 December 2025 - Tokyo
08:20 – 08:55
Registration
09:00 – 09:20
Keynote
Rahul Manepalli, Ph.D.
Intel Corporation
Rahul Manepalli is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization in Intel. Rahul and his team are responsible for developing next generation of materials, processes and equipment for Intel’s package pathfinding and development efforts. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) and other substrate technologies. Rahul has also had an instrumental role in leading Intel’s assembly materials development and pathfinding efforts leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 100 patent publications in semiconductor packaging, over 50 technical papers and invited talks and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.
Company Profile
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.
To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.
09:20 – 09:40
Reserved for Ibiden
09:40 – 10:00
Reserved for Shinko
10:05 – 11:05
Networking & Business Meeting 5+ 6
11:10 – 11:20
RENA Technologies GmbH
Company Profile
Founded in 1993, RENA Technologies has established itself as a global leader in mechanical and process engineering, for a diverse range of industries. We specialize in providing cutting-edge wet processing solutions for the semiconductor, solar, additive manufacturing, glass, and medtech industries.
A key area of expertise is wet chemical immersion, spray and single wafer processes for the manufacturing of semiconductors. With over 1,100 systems installed worldwide, our technology is trusted by manufacturers around the globe to enhance efficiency and production quality.
RENA Technologies employs approximately 1,000 professionals worldwide, all dedicated to innovation and excellence in our field. Headquartered in Gütenbach, Germany, and manufacturing sites in Albany, OR and Wykroty, Poland, we continue to drive advancements in process engineering, ensuring our customers receive the highest quality solutions for their manufacturing needs.
On top we provide worldwide onsite service support with over 150 Experts in 20 locations globally to ensure flawless installation and operation of our tools.
Company Products & Services
RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes like etching, stripping, cleaning or drying. RENA offers proven standard machines as well as customer-specific solutions and process support.
11:20 – 11:30
Reserved for Corning
11:35 – 12:15
Panel Discussion: Advanced Packaging
Moderator: Onto Innovation
Panelists reserved for:
Rapidus
Amkor Technology
Intel Corporation
UTAC
12:20 – 13:30
LUNCH
13:35 – 13:55
Keynote
Hiroshi Iwatsubo
Murata Manufacturing Co., Ltd.
Hiroshi Iwatsubo graduated from Kyoto University, Department of Technology. He joined Murata Manufacturing Co., Ltd. in Kyoto, Japan in 1985. After engaging in the development of ceramic materials for four years, he was dispatched to Murata Europe GmbH in 1989 until his return to Murata Japan in 1993.
In 2012, he was appointed to Vice President, Head of Global Sales & Marketing
In 2015, he was appointed to Senior Executive Vice President (Board Member) Corporate Technology & Business Development Unit, In 2020, Senior Executive Vice President .
Hiroshi Iwatsubo currently serves as CTO and Executive Deputy President .
13:55 – 14:15
Daisuke Murata
Murata Machinery
Daisuke Murata has served as President and CEO of Murata Machinery, since September 2003. He has held a variety of ascending leadership positions at Murata Machinery since 1987.
He also now serves as Chairman of the Japan Textile Machinery Association, as Chairman of the Japan Institute of Material Handling, and Superintendent of the Japan Business Machine and Information System Industries Association. In July 2017, he became the SEMI International Board member.
He graduated with a Bachelor of Economics from Hitotsubashi University in 1984 and obtained MBA from the Graduate School of Business at Stanford University in 1990.
Company Profile
Murata Machinery (Muratec) is a worldwide leader and solution provider for automated material handling systems in semiconductor manufacturing and other manufacturing or distribution industries. Muratec also manufactures machinery and equipment such as Textile Machinery, Machine Tools, Sheet Metal Machinery, and Communication Equipment.
This year marks 90 years since its founding in 1935. Under the slogan “Innovation. Mark the turning point”, Muratec aims to create technologies that bring innovation to the market and society.
Company Products & Services
14:15 – 14:35
Mitsubishi Electric Corporation
Company Profile
Mitsubishi Electric is one of the world’s leading names in the manufacture and sales of electrical and electronic products and systems used in a broad range of fields and applications.
We are contributing to the realization of “Green Transformation” (GX) and “Digital Transformation” (DX)with innovative and ever-evolving semiconductors & devices.These include power devices that achieve energy-saving, miniaturization,and high-reliability for power electronic equipment, optical devices and high-frequency devices realizing seamless communication at high speed and high capacity, and infrared sensors capable of advanced temperature detection enabling identification of people and objects as well as discernment of people’s movements.
14:40 – 15:40
Networking & Business Meeting 7
16:05 – 16:25
Reserved for Renesas
16:25 – 16:45
Reserved for Fuji Electric
16:45 – 17:05
Soitec
Company Profile
Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.
In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.
With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.
Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.
For more information visit: www.soitec.com.
17:05 – 17:10
Closing Remark
I.S.I.G./
Tadahiro Suhara
TSSC
Education:
・Bachelor, Economics, Doshisha University, Japan, 1983
Experience:
・TSSC, CEO, 2023/5~
・JSR Corporation, Managing Officer, 2019~2023
・Screen Semiconductor Solutions , CEO, 2014~2019
・Dainippon Screen Manufacturing , 1983~2014
Company Profile
TSSC is a consulting company to support Semiconductor and Semiconductor Supply Chain for enabling continuous Semiconductor industry’s growth.
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