Driving the Future: Breakthroughs in Advanced Packaging, Glass Substrates, and Automotive Innovations

08:20 – 08:55

Registration

Advancing Substrate Technologies: Glass & Panel Substrates in Next-Gen Semiconductor and Packaging Solutions

09:00 – 09:20

Keynote

Rahul Manepalli, Ph.D.

Intel Fellow, VP, Director of Substrate Packaging Technology Development

Intel Corporation

09:20 – 09:40

Reserved for Ibiden 

09:40 – 10:00

Reserved for Shinko 

10:05 – 11:05

Networking & Business Meeting 5+ 6

11:10 – 11:20

RENA Technologies GmbH

11:20 – 11:30

Reserved for Corning

11:35 – 12:15

Panel Discussion: Advanced Packaging

Moderator: Onto Innovation

Panelists reserved for:
Rapidus
Amkor   Technology
Intel Corporation
UTAC

12:20 – 13:30

LUNCH

Shaping the Future of Power Semiconductor and Automotive with Cutting-Edge Innovations

13:35 – 13:55

Keynote

Hiroshi Iwatsubo

Executive Deputy President and CTO

Murata Manufacturing Co., Ltd.

13:55 – 14:15

Daisuke Murata

President and CEO

Murata Machinery

14:15 – 14:35

Mitsubishi Electric Corporation

14:40 – 15:40

Networking & Business Meeting 7

15:45 – 16:05

DENSO

Denso

16:05 – 16:25

Reserved for Renesas

16:25 – 16:45

Reserved for Fuji Electric  

16:45 – 17:05

Soitec

17:05 – 17:10

Closing Remark

I.S.I.G./

Tadahiro Suhara

CEO

TSSC

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