In the present era, the utilization of AI in diverse applications is steadily increasing, contributing to strength individuals’ efficiency. Tools like ChatGPT play a pivotal role in enhancing people productivity by engaging users through text or voice inputs. Notably, Infineon’s high-performance silicon microphones enable seamless speech interaction with Natural Language Processing assistants. Prior to being processed by Large Language Models, audio data undergoes Speech-to-Text (STT) conversion, a crucial task to ensure accurate input for AI systems. STT operates by breaking down speech into “phonemes” and utilizing spectral comparison to transcribe the audio. Infineon’s initial trials evaluate the significance of high Signal-to-Noise Ratio (SNR) in applications like laptops interpreting the Error Word Rate. Furthermore, in True Wireless Stereo (TWS) and Smart-VR glasses devices, the fusion of AI with Infineon’s Vibration sensor shows the potential to revolutionize current architectures, delivering clear phone calls even any environmental conditions and outperforming current solutions.

In this presentation, Jakob will provide an overview of the MEMS loudspeaker industry from USound’s perspective, highlighting interesting trends. A focus will be placed on the potential of MEMS speakers as tweeters in 2-way earphones. Jakob will explain the technical advantages MEMS bring to this specific application and how these advantages benefit the market and ultimately enhance the user experience.

Sensors have become ubiquitous, blurring the line between being online and offline. AI plays a key role in sensors, enabling real-time context understanding and the ability to make decisions aimed at optimizing and reducing the power consumption of the final device. Sensors are no longer merely for data collection; thanks to AI, they can interact with their environment and significantly contribute to innovation and sustainability.

AI serves as the computational brain for advanced electronic applications, requiring high-quality sensory data to interact effectively with the environment. Emulating sophisticated sensory systems at a micromachined scale, MEMS technologies bridge this gap to enhance AI’s potential. Current advancements in MEMS — particularly in areas such as 3D LiDAR sensors, tactile sensors for robotics, and high dynamic range microphones —are pivotal in overcoming common AI bottlenecks. Additionally, MEMS integration can streamline neural networks, facilitating more efficient AI workflows. This talk will explore how MEMS technologies address crucial performance, reliability, stability and cost issues, thereby opening new market opportunities and significantly impacting future industry trajectories. We will also discuss how MEMS mitigates the power and thermal challenges posed by increasingly powerful and energy-intensive GPUs.

As Augmented Reality (AR) and Virtual Reality (VR) devices continue to mature, the need for lower size, weight, and power (SWaP) components will only increase. One solution to this demand is with Micro-Electromechanical Systems (MEMS). MEMS devices have become ubiquitous within the consumer electronics industry, and their unique balance of SWaP and performance present a unique opportunity to address the challenges associated with AR/VR development.
In this talk, I will introduce the AR/VR technology space and discuss multiple ways in which the sensing and compute demands push beyond previous methods of interacting with digital content. Current MEMS integration within these devices will be highlighted along with the constraints and opportunities for future MEMS integration.

Automotive MEMS based Actuator / Sensor and Optical Sensor devices continue to enable new exciting functionalities and applications in the automotive market — in Safety, Entertainment, Passenger Convenience and Advance Driver Assistance Systems (ADAS).

Increasing autonomous levels in the Automotive market requires higher performance for positioning and localization, inertial navigation and object detection / recognition while meeting government recommended or mandated implementation dates. These new functions and applications require more Advance Packaging Technologies, Heterogenous integration and Standard platforms.

The MEMS and Sensor Industry is evolving from a discrete single MEMS/sensor (leadframe + wirebond based packages) towards new packaging and interconnection technologies – such as a new standard Optical Packaging Platform or the use of Cu Pillars to interconnect devices. And increasing complexities require closer collaboration between the different stakeholders in the MEMS Actuator / Sensor and Optical Sensor Ecosystem.

• MEMS based sensors are a key-enabler in a wide range of applications: from automotive, over consumer to the life science domain. MEMS is expected to even further proliferate in everyday life, due to their continued miniaturization, steady increase in performance and the accessibility of new sensing functionalities.

• This is possible due to a constant high level of innovation in e.g., processing and packaging technologies, as well as due to novel system-level concepts. This shows the need for an overarching approach, integrating all development domains.

• In his presentation, Dr. Ando Feyh (MEMS Strategy Management, New Business and M&A), will cover a brief review and compare this to the progress achieved by recent advancements in the field of MEMS based sensors. Several examples from above outlined domains will be discussed for illustration.

At UltraSense Systems, we’re at the forefront of revolutionizing automotive touch interfaces with our state-of-the-art HMI Controller solutions and innovative In-Plane Sensing approach. Our advanced monolithic silicon/PMUT technology turns ordinary surfaces into highly responsive, solid surface touch interfaces, delivering an unparalleled driving experience. In today’s automotive industry, touch user interfaces are crucial for modernization and product differentiation.
Our groundbreaking multi-mode touch and force fusion sensing capabilities, enhanced by AI and Machine Learning algorithms, enable virtually any surface of any material (metal, glass, fabric,..) within a vehicle to function as an intuitive touch interface. At the core of our offerings is the smart-solid-surface Human Machine Interface (HMI) controller, which provides customizable features such as audio, illumination, haptics, and user feedback, all designed to elevate the driving experience. By replacing mechanical interfaces with intuitive Smart-Solid Surfaces using our PMUT technology platform, UltraSense enhances both automotive interior and exterior modernization, providing a cost-effective advanced tactile sensing/HMI solution for automotive OEMs.

MEMS process sequences and capabilities are frequently reused for advanced packaging and 3D integration applications. Bringing these to market presents multiple technology and business model challenges. This presentation will discuss progress and future trends.

Vehicles have undergone remarkable changes over the last decades, with semiconductor sensor content increasing dramatically in recent years as more safety and comfort applications are implemented in today’s cars. These sensors need to fulfil their performance requirements whilst concurrently being able to meet stringent automotive reliability criteria – and achieve this in small form factors, adequate cost levels, and with fast time to market. This poses significant challenges to sensor packaging and testing facilities, especially when considering that sensor packages can differ significantly and the package itself is a major contributor to the sensor performance. In this presentation, we will look at how vehicles have evolved to become the collection of sensors they are today, discuss some of the key sensor applications and package structures used for said applications, and give some perspective of packaging trends observed for the next generation of automotive sensors.

This talk focuses on the cutting-edge developments in CMOS technology that are revolutionizing the capabilities of MEMS sensors. By exploring the synergies between CMOS technology and MEMS sensors, this talk sheds light on the transformative potential of neuromorphic and sensor fusion in pushing the boundaries of sensor technology. Through the implementation of edge AI methodologies, we will also show you the improvement in the following aspects:

• AI in sensor: neuromorphic and sensor fusion have been proven as an effective approach to improve the sensor performance while achieving the low power consumption requirement for wearable products. We will showcase our latest result with AI integrated sensors.
• Privacy for always-on sensor: with the increasing need of 24/7 health monitoring, RF radar has been proposed by industry partners to replace optical and acoustic sensors. During this talk, we will give a performance and cost comparation from the foundry’s point of view.
• Challenge in biosensor: with the increasing computing functions integrated into biosensor, many devices are moving from legacy node to advanced CMOS technology. Major challenges to combine advanced CMOS with microfluidics emerged. In this talk, we will proposal a call for action to resolve this issue.
• Internet of Medical Things: with the rise in digital therapeutics and at-home diagnostics, we see the need to improve foundry quality control to address such mid-risk medical devices with function safety and root-of-trust approach.

This presentation delves into the critical world of production testing for MEMS environmental sensors. As these devices play a pivotal role in the environmental monitoring in many situations (from industry, to homes, to hospitals), ensuring their correct performance is of vital importance. Manufacturers face several challenges in guaranteeing the accuracy and reliability of their sensors, whose production testing can be a complex and time-consuming process. As these devices are sensitive to multiple environmental factors and respond to various stimuli (pressure, temperature, humidity, gas, …), the key thing about their testing resides in the need to develop testing setups able to capture all the electrical and mechanical aspects of the sensor, simulating and controlling a multiplicity of environmental factors. The sensor-type specificities represent a second challenge: each sensor type might require unique testing procedures and hardware setup, and this customization can be time-consuming and costly. Finally, while many applications are requiring more accurate and sensitive devices (that means, very accurate test equipment too), achieving high-volume production requires test cost efficiency. We will showcase how the latest advancements in test equipment are revolutionizing the approach for MEMS environmental sensors, solving all these challenges.

InchFab offers a new approach to MEMS foundries. It gives the MEMS industry a low cost and fast cycle time microfab service solution designed for today’s microfabricated technologies, addressing the needs of the bio, medical, IoT, aerospace and industrial sensing markets. At InchFab, we enable rapid, cost- efficient development and rapid, low risk scaling to production for today’s emerging technologies. InchFab’s low capex approach to foundry expansion will be discussed as will the ability of InchFab to assist regions wanting to quickly develop their semiconductor infrastructure.

The potential to transform industrial manufacturing lies in jetting ultra high viscosity fluids, merging the scalability, flexibility, and digital printing capabilities of NovoJet inkjet technology with the superior properties of functional materials. The ability to jet ultra high viscosity fluids via drop-on-demand inkjet, surpassing previous standards, was first announced by Borrell et al. in 2021. Initially, only small printheads with limited commercial capabilities had been developed and tested, with a tentative specification for a commercial printhead anticipated. Over the past three years, substantial progress has been made in optimizing the underlying actuator technology, enabling jetting of fluids with viscosities up to 250 mPa·s for Newtonian fluids. NovoJet technology is poised to revolutionize applications in fuel cells, printed electronics, MEMS, semiconductors, and more.

Light-based sensing technologies have enabled and improved wide range of use cases. This presentation explores the foundational technologies, working principles and building blocks of light-based sensing and actuating. The focus is on specific use case values coming from consumer applications. Key technologies include specialization for light sensing of semiconductor, package, and system architecture including software. Complementing and competing technologies, such as radar and ultrasonic are also discussed. The presentation concludes with a call for industry collaboration to unleash the value of light- sensing in attractive verticals.