SiC materials and devices are rapidly gaining acceptance and being the game-changer in EV market future. The expected performance enhanced by SiC devices perfectly matches the need for the next generation of electrical vehicles, especially for the 800V EV platforms with high efficiency and high power density requirements.

However, a number of challenges must be addressed before SIC can be widely adopted and pursue its promises. Three major challenges, i.e., Manufacture Cost, Device and Packaging, and System Integration need to take care of, not alone by semiconductor manufacturers but together with up and down streams to collaborate.

Today, by gathering worldwide experts and players here, the presentation will focus on the market overview of SiC in automotive, promises and challenges, and how can we accelerate the adoption and breakthroughs.