27-28 August 2025
Suwon
PulseForge is at the forefront of semiconductor technology innovation. This presentation highlights our flagship photonic debonding (PDB) technology and its transformative impact on Temporary Bonding and Debonding (TB/DB) processes. PDB technology utilizes broadband light (200 nm – 1100 nm) from flashlamps, paired with an engineered light-absorbing layer, to achieve superior results in wafer thinning, Fan-out, and substrate transfer applications.
As TB/DB processes become increasingly prevalent, particularly with high-bandwidth memory chips and other advanced packaging applications, our presentation provides a comprehensive assessment of PDB’s effectiveness with thinned silicon wafers. We also offer a comparative yield analysis of devices as fab-out and post-TBDB processes with photonic debonding. Furthermore, we will emphasize the substantial cost of ownership benefits that PDB offers, demonstrating clear advantages of PDB over traditional debonding processes and making it a compelling choice for semiconductor manufacturers looking to enhance performance and reduce costs.
The PDB features a uniform, large-area illumination (75 mm x 150 mm), ensuring enhanced yield, high throughput, and cost-effectiveness for both wafer-level and panel-level packaging.
Vikram Turkani
Director, Technology Partnerships and Strategic Business Development
PulseForge
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