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AI Computing on Edge Devices

Dr. Bor-Sung Liang photo

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

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Disruptions in Semiconductor Supply Chain

Michael Mo photo

Michael Mo

Partner and Managing Director

AlixPartners

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Generative AI Driven Advanced Packaging and Materials Innovation

Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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RISC-V Accelerating ML Innovation and Beyond

Samuel Chiang photo

Samuel Chiang

Deputy Technical Director

Andes Technology

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Co-Packaged Optics and Solutions for High Volume manufacturing

Dr. Johann Weinhändler photo

Dr. Johann Weinhändler

Managing Director

ASMPT Limited

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REALITY Twin vs. Digital Twin: Revolutionizing Industrial Remote Management

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CJ Hsieh

COO

ASPEED

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Assembly Technologies for the Front End

Chris Scanlan photo

Chris Scanlan

SVP Technology

Besi

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Innovative laser assisted bonding processes for next generation advanced packaging

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Matthias Fettke

VP Advanced Packaging Equipment

PacTech

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Optical I/O Technology for the Future of AI

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Mark Wade

CEO

Ayar Labs

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The Impact of PulseForge’s Photonic Debonding on Temporary Bonding and Debonding Processes

Vikram Turkani photo

Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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Wet Process and TBDB for Heterogeneous Integration

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Eric Lee

President of Sales Group

Scientech

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State-of-the art solutions for AI Chip manufacturing

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Robert Wanninger

Senior Vice President Business Unit Advanced Backend Solutions

SUSS MicroTec

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Micro LED Technology and Platform Trend

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Sam Chen

Senior Director

Unikorn Semiconductor Corporation

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Generative AI and Chiplet: Impact on semiconductor industry and position of Taiwan

Jéröme Azémar photo

Jérôme Azemar

Custom Project Business Development Director

Yole Group

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