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NPU as the core of AI application: Market & Trends

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Axel Bialke

SVP Asia


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Enabling AI revolution through innovations in Advanced Packaging and Chiplet Technology

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Deepak Kulkarni

Senior Fellow Advanced Packaging


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An OSAT Perspective of the Power Semiconductor Market

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Katsumi Furuse

Sr. Manager Wirebond/Power BU Power

Amkor Technology, Inc.

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Enabling the AI Era

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Choon Khoon Lim

Senior Vice President; Co-CEO, Semiconductor Solutions Segment

ASMPT Limited

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Semiconductor Innovations Across a More Diversified End Market

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Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group


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Japan’s Policy Trends in Semiconductor and Digital Industry Strategy

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Hisashi Kanazashi

Director, IT Div

Ministry of Economy, Trade and Industry (METI)

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Scenario of Semi Industry Recovery

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Akira Minamikawa

Senior Analyst


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Renesas’ Technology Strategy for a Paradigm Shift in the Semiconductor Industry

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Shinichi Yoshioka

Senior Vice President and Chief Technology Officer


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