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This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

NPU as the core of AI application: Market & Trends

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Axel Bialke

SVP Asia

aiMotive

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Enabling AI revolution through innovations in Advanced Packaging and Chiplet Technology

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Deepak Kulkarni

Senior Fellow Advanced Packaging

AMD

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An OSAT Perspective of the Power Semiconductor Market

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Katsumi Furuse

Sr. Manager Wirebond/Power BU Power

Amkor Technology, Inc.

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Enabling the AI Era

Choon Khoon Lim

CEO, Business Group AP

ASMPT Limited

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Semiconductor Innovations Across a More Diversified End Market

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Oreste Donzella

Executive Vice President and Chief Strategy Officer

KLA

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Japan’s Policy Trends in Semiconductor and Digital Industry Strategy

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Hisashi Kanazashi

Director, IT Div

Ministry of Economy, Trade and Industry (METI)

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Scenario of Semi Industry Recovery

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Akira Minamikawa

Senior Analyst

OMDIA

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Renesas’ Technology Strategy for a Paradigm Shift in the Semiconductor Industry

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Shinichi Yoshioka

Senior Vice President and Chief Technology Officer

Renesas Electronics

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