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The Role of Extrinsic (Early Life) Failures and Stabilization Stress and Burn-In During the Production of Silicon Carbide and Gallium Nitride Power Semiconductors

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Gayn Erickson

President & CEO

Aehr Test Systems

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How Laser is Enabling The Power Semiconductor Roadmap

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Jeroen van Borkulo

Head of Business & Marketing

ASMPT

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BelGaN – Moving to The Next Chapter

Dr. Marnix Tack photo

Dr. Marnix Tack

CTO & VP Business Development

BelGan

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ICeGaN: the Call of the GaN Revolution

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Dr. Giorgia Longobardi

Founder and CEO

Cambridge GaN Devices

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The EDA breakthrough solution for SiC and GaN Front-End and Back-End

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Luca Lillacci

General Manager

EDA Industries

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Opening Address

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Lucilla Sioli

Director Artificial Intelligence and Digital Industry

EU Commission

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Thin Film Solutions for Wide Bang Gap (WBG) Power Devices

Dr. Vinoth Sundaramoorthy photo

Dr. Vinoth Sundaramoorthy

Product Marketing Manager

Evatec

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The European Chips Act. A Framework for Revitalizing the European Semiconductor Ecosystem

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Dr. Thomas Morgenstern

EVP Frontend IFAG FE

Infineon Technologies AG

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Innoscience’s GaN Power Devices: Reliable, Price Competitive and Mass Manufactured

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Denis Marcon

General Manager

Innoscience

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Process Control Trends for WBG Power Devices

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Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

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Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

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Dr. Christian Ohde

Global Product Director SC/FEC

Atotech

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GaN D-Mode vs. GaN E-Mode: A Clash of Technologies or The Perfect Co-Existence?

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Bas Verheijen

Senior Director GaN Technology and Operations

Nexperia

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Customized Silicon and SOI Wafers Enabling Enhanced Power Devices

Dr. Atte Haapalinna photo

Dr. Atte Haapalinna

CTO

Okmetic

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Meeting Challenges in Power Device Fabrication with Advanced Metrology and Inspection

Dr. Vamsi Velidandla photo

Dr. Vamsi Velidandla

Senior Director, Product Management

Onto Innovation

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SiC / IGBT Power Module Assembly & Test Equipment Solutions

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Michael Koelbl

General Manager Pentamaster Automation Germany GmbH

Pentamaster

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Empowering Power Electronics Packaging Through Photonic Debonding

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Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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Future of SiC Power Modules in Automotive and Industrial Applications

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Claus A Petersen

President

Semikron Danfoss

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Innovative Traction Drives with SiC Semiconductors

Dr. Ladislav Sobotka photo

Dr. Ladislav Sobotka

Engineering and R&D Director

Skoda Electric

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Business Benefits Of SmartSiC™: Unrivaled Technology For Sic In Automotive

Ph.D. Emmanuel Sabonnadière photo

Ph.D. Emmanuel Sabonnadière

VP Division Automotive & Industrial

Soitec

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Addressing Testing Challenges for Power Modules and Three-Level Inverters

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Elia Petrogalli

Sales Manager Semi & MEMS Business Unit

SPEA

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Intrinsic Reliability and Product Qualification Testing in GaN Power Semiconductors Do One the Other or Both?

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Roland Shaw

President of Accel-RF

STAr Technologies

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TEL: Moving Into the MAGIC Era of Semiconductors

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Neil Armstrong

Director Sales Development

TEL

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Total Solution of Process Kits to Enabling an Efficient Supply Chain in FAB

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Jimmy Tao

Marketing Director

Tessvida

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Volkswagen Group – Power Electronics In-House Development

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Alexander Krick

EVP Technical Development

Volkswagen Group Components

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