Select a 2025 summit below to view its ISES Docs

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

The Role of Extrinsic (Early Life) Failures and Stabilization Stress and Burn-In During the Production of Silicon Carbide and Gallium Nitride Power Semiconductors

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Gayn Erickson

President & CEO

Aehr Test Systems

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How Laser is Enabling The Power Semiconductor Roadmap

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Jeroen van Borkulo

Head of Business & Marketing

ASMPT Limited

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BelGaN – Moving to The Next Chapter

Dr. Marnix Tack photo

Dr. Marnix Tack

CTO & VP Business Development

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ICeGaN: the Call of the GaN Revolution

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Dr. Giorgia Longobardi

Founder and CEO

Cambridge GaN Devices

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The EDA breakthrough solution for SiC and GaN Front-End and Back-End

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Luca Lillacci

General Manager

EDA Industries S.p.a

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Opening Address

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Lucilla Sioli

Director Artificial Intelligence and Digital Industry

EU Commission

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Thin Film Solutions for Wide Bang Gap (WBG) Power Devices

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Dr. Vinoth Sundaramoorthy

Product Marketing Manager

Evatec

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The European Chips Act. A Framework for Revitalizing the European Semiconductor Ecosystem

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Dr. Thomas Morgenstern

EVP Frontend IFAG FE

Infineon Technologies AG

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Innoscience’s GaN Power Devices: Reliable, Price Competitive and Mass Manufactured

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Denis Marcon

General Manager

Innoscience

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Process Control Trends for WBG Power Devices

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Oreste Donzella

Executive Vice President and Chief Strategy Officer

KLA

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Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

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Dr. Christian Ohde

Global Product Director SC/FEC

mks | Atotech

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GaN D-Mode vs. GaN E-Mode: A Clash of Technologies or The Perfect Co-Existence?

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Bas Verheijen

Senior Director GaN Technology and Operations

Nexperia

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Customized Silicon and SOI Wafers Enabling Enhanced Power Devices

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Dr. Atte Haapalinna

CTO

Okmetic Oy

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Meeting Challenges in Power Device Fabrication with Advanced Metrology and Inspection

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Dr. Vamsi Velidandla

Senior Director, Product Management

Onto Innovation

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SiC / IGBT Power Module Assembly & Test Equipment Solutions

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Michael Koelbl

General Manager Pentamaster Automation Germany GmbH

Pentamaster Technology

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Empowering Power Electronics Packaging Through Photonic Debonding

Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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Future of SiC Power Modules in Automotive and Industrial Applications

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Claus A Petersen

President

Semikron Danfoss

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Innovative Traction Drives with SiC Semiconductors

Dr. Ladislav Sobotka photo

Dr. Ladislav Sobotka

Engineering and R&D Director

Skoda Electric

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Business Benefits Of SmartSiC™: Unrivaled Technology For Sic In Automotive

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Ph.D. Emmanuel Sabonnadière

VP Division Automotive & Industrial

Soitec

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Addressing Testing Challenges for Power Modules and Three-Level Inverters

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Elia Petrogalli

Sales Manager Semi & MEMS Business Unit

SPEA

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Intrinsic Reliability and Product Qualification Testing in GaN Power Semiconductors Do One the Other or Both?

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Roland Shaw

President of Accel-RF

STAr Technologies

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TEL: Moving Into the MAGIC Era of Semiconductors

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Neil Armstrong

Director Sales Development

Tokyo Electron

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Total Solution of Process Kits to Enabling an Efficient Supply Chain in FAB

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Jimmy Tao

Marketing Director

Tessvida

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Volkswagen Group – Power Electronics In-House Development

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Alexander Krick

EVP Technical Development

Volkswagen Group Components

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