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Hybrid Bonding: Innovation to Adoption

Abul Nuruzzaman photo

Abul Nuruzzaman

VP, Technology and IP Licensing


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A 360 View of Semiconductor Test from AI and Security Perspective

Michael Chang photo

Michael Chang

VP & GM, Advantest Cloud Solutions


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Digitalisation of Supply Chain – Using Latest Technology to Improve Logistics

Aziza Dada photo

Aziza Dada

Sector VP


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Innovation to Enable More Compute From Each Transistor

Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations


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Turning Metaverse to Photorealistic Digital Twins for Driving Smart Factory Innovations

CJ Hsieh photo

CJ Hsieh



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Unleashing the Power of AI: Opportunities and Challenges Ahead

Dr. Justin Chueh photo

Dr. Justin Chueh

Director Monolithic and Heterogeneous Integration Department


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Thinfilm Technology for Heat Dissipation Layers in HPC Applications

Ralph Zoberbier photo

Ralph Zoberbier

SVP & Head of Business Unit Advanced Packaging


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Opening Speech – Challenges & Opportunities of LLM and Generative AI: A Hardware Perspective

Dr. Ming-Der Shieh photo

Dr. Ming-Der Shieh

CTO of Electronic and Optoelectronic System Research Laborations (EOSL)

Industrial Technology Research Institute (ITRI)

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AI Computing in Large-Scale Era – The Golden Age of AI and IC

Dr. Bor-Sung Liang photo

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology


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How The Semiconductor Industry Is Poised to Enable The Metaverse

Dr. Ofer Shacham photo

Dr. Ofer Shacham

VP, Head of Silicon, at Meta Reality Labs


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Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow

Dr. Christian Ohde photo

Dr. Christian Ohde

Global Product Director SC/FEC


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Navigating the Dynamic Memory Market: Trends and Insights

Marco Mezger photo

Marco Mezger

COO & Executive Vice President


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Process Control Challenges in Packaging for High Performance Computing Applications

Dr. Monita Pau photo

Dr. Monita Pau

Strategic Marketing Director for Advanced Packaging

Onto Innovation

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Heterogeneous Integration Platform for Next Generation Computing

Dr. Seungwook Yoon photo

Dr. Seungwook Yoon

CVP Business Development Team, AVP

Samsung Electronics

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From Hyperscale Models to Heterogeneous SoCs: Industrializing Neural Network Deployment with ONNC

Luba Tang photo

Luba Tang


Skymizer Taiwan, Inc.

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3DIC W2W and D2W Hybrid Bonding

Thomas Schmidt photo

Thomas Schmidt

Product Manager, Bonder Division

SUSS MicroTec

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