27-28 August 2025
Suwon
An increased density of IC chips and other components to increase processing speed highly will be required for post-5G/6G systems. Therefore, there is a need for technologies that allow for high-density packaging of differing chips within a single semiconductor package.
Resonac has started Packaging Solution Center to propose one-stop solution for customers in 2019 and established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package.
We are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large advanced package.
Hidenori Abe
CTO, Semiconductor Materials, Resonac Holdings Corporation
Resonac Corporation
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