Advanced Packaging Materials and Evaluation Platform at Resonac

ISES Docs:

An increased density of IC chips and other components to increase processing speed highly will be required for post-5G/6G systems. Therefore, there is a need for technologies that allow for high-density packaging of differing chips within a single semiconductor package.

Resonac has started Packaging Solution Center to propose one-stop solution for customers in 2019 and established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package.

We are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large advanced package.

Abe Hidenori photo

Hidenori Abe

Electronics R&D Center GM

Resonac Corporation

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