An increased density of IC chips and other components to increase processing speed highly will be required for post-5G/6G systems. Therefore, there is a need for technologies that allow for high-density packaging of differing chips within a single semiconductor package. In this presentation, Advanced Packaging and Substrate materials trend such as organic core, dry film, solder resist, PID for RDL and glass related materials would be introduced.

Furthermore, Open innovation activity using Resonac’s Advanced Packaging pilot line would be discussed. Resonac has started Packaging Solution Center to propose one-stop solution for customers in 2019 and established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package. We are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large advanced package. This presentation will cover these Resonac’s co-creation activities and development.