The cutting-edge semiconductors necessary for the evolution of AI are supported by advances in material and equipment technology. The emergence of chiplet package structures has led to increased complexity in packaging, making collaboration between materials and equipment manufacturers more critical than ever.

Resonac, a co-creative chemical company that provides a variety of semiconductor materials such as CMP slurry, etching gas, materials for HBM, epoxy molding compounds, substrate core materials, and more, is advancing materials technology development through open innovation activities. Resonac has started a Packaging Solution Center to propose one-stop solutions for customers and has established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment, and substrates for 2.xD and 3D packages. Additionally, we will soon start an open innovation activity in Silicon Valley called “US-JOINT.” In this presentation, we will describe our co-creation strategy.