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ISES TV –

Chiplet Ecosystem Acceleration

View Agenda Item

The speaker will share the work of TSMC in Chiplet Ecosystem acceleration by following outlines.

Outlines:

  • Forces Driving Chiplet and Integration
  • Advanced CMOS Technologies
  • Advanced Packaging Technologies
  • Design Enablement and Ecosystem
KC Hsu photo

K.C. Hsu

VP, Research & Development / Integrated Interconnect & Packaging

TSMC