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ISES Welcome Address

Kamel Ait Mahiout photo

Kamel Ait Mahiout

President

ISES

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Chiplet Ecosystem Acceleration

KC Hsu photo

K.C. Hsu

VP, Research & Development / Integrated Interconnect & Packaging

TSMC

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HBM (High Bandwidth Memory) and Advanced Packaging Technology for AI Era

Kangwook Lee photo

Dr. Kangwook Lee

SVP and Head of PKG Development

SK Hynix

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Powering the AI Revolution through Innovations in High Bandwidth Memory

Bret Street

Bret Street

Senior Director of Advanced Packaging

Micron Technology, Inc.

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Generative AI Driven Advanced Packaging and Materials Innovation

Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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Advanced Packaging Technologies for Heterogenous Integration: Glass Core Package Substrate

Rahul Manepalli, Ph.D. photo

Rahul Manepalli, Ph.D.

Intel Fellow; Director Substrate TD Module Engineering

Intel Corporation

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Panel Session: Standardization for Chiplet and Advanced Packaging

Dr. Kuan-Neng Chen photo

Dr. Kuan-Neng Chen

Chair Professor

NYCU

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Heterogeneous Integration for Photonic Light Engines

Dr. Radha Nagarajan photo

Dr. Radha Nagarajan

SVP & CTO

Marvell Technology

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Optical I/O Technology for the Future of AI

Mark Wade photo

Mark Wade

CEO

Ayar Labs

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Enabling Metrology, Inspection and Lithography Technologies for AI and HPC Packaging

Dr. Monita Pau photo

Dr. Monita Pau

Strategic Marketing Director for Advanced Packaging

Onto Innovation

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Wet Process and TBDB for Heterogeneous Integration

Eric Lee photo

Eric Lee

President of Sales Group

Scientech

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Co-Packaged Optics and Solutions for High Volume manufacturing

Dr. Johann Weinhändler photo

Dr. Johann Weinhändler

Managing Director

ASMPT Limited

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State-of-the art solutions for AI Chip manufacturing

Robert Wanninger photo

Robert Wanninger

Senior Vice President Business Unit Advanced Backend Solutions

SUSS MicroTec

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The Impact of PulseForge’s Photonic Debonding on Temporary Bonding and Debonding Processes

Vikram Turkani photo

Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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Innovative laser assisted bonding processes for next generation advanced packaging

Matthias Fettke photo

Matthias Fettke

VP Advanced Packaging Equipment

PacTech

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Disruptions in Semiconductor Supply Chain

Michael Mo photo

Michael Mo

Partner and Managing Director

AlixPartners

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