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Welcome Speech

Salah Nasri photo

Salah Nasri

Senior Advisor to President

ISES

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Greater Phoenix: A Global Destination for Industrial Innovation

Chris Camacho photo

Chris Camacho

President & CEO

Greater Phoenix Economic Council (GPEC)

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Advanced Packaging Ecosystem

Dr. Babak Sabi photo

Dr. Babak Sabi

SVP & GM Assembly and Test Technology Development

Intel Corporation

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Unleash Product Innovations with 3DFabric

Dr. Jun He photo

Dr. Jun He

VP Quality & Reliability, Advanced Packaging Technology & Service

TSMC

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Advanced Packaging: Enabling Moore’s Law’s Next Frontier

Dr. Raja Swaminathan photo

Dr. Raja Swaminathan

CVP, Advanced Packaging

AMD

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Processing Innovations to Address the Manufacturing Challenges of Heterogeneous Integration

Len Tedeschi photo

Len Tedeschi

VP & GM Core Packaging Products

Applied Materials

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Bridging Front End, Packaging And Substrates To Advance The Semiconductor Roadmap

Oreste Donzella photo

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

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IC Packaging Panel Discussion

Curtis Zwenger photo

Curtis Zwenger

VP, Advanced SiP Product Development

Amkor Technology, Inc.

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A 360 View of Semiconductor Test from AI and Security Perspective

Claudionor Coelho photo

Claudionor Coelho

Chief AI Officer, SVP of Engineering

Advantest

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Package Design and Reliability Need in Server Systems

Viresh Patel photo

Viresh Patel

VP Packaging Technology

Renesas

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Navigating Through a Correction in the Semiconductor Market

Mario Morales photo

Mario Morales

Group VP, Enabling Technologies and Semiconductors

IDC

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Not All Nanograined Copper Is Created Equal

Dr. Yun Zhang photo

Dr. Yun Zhang

Founder & CEO

Shinhao Materials

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Valuation of Artificial Intelligence for Semiconductor Equipment

Jon Hander photo

Jon Hander

AVP Panel Products

ASMPT Limited

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Advanced Packaging Materials and Evaluation Platform at Resonac

Abe Hidenori photo

Hidenori Abe

Electronics R&D Center GM

Resonac Corporation

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AICS Solutions to High Value Problems

Keith Best photo

Keith Best

Director, Product Marketing, Lithography

Onto Innovation

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Advanced Packaging – the Need for Standards

Dr. Shekhar Chandrashekhar photo

Dr. Shekhar Chandrashekhar

CEO

iNEMI

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Workforce Diversity Initiatives in the CHIPS Act Panel Session

Amy Leong photo

Amy Leong

Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions

Formfactor

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