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New Challenges for MEMS and Sensor Packaging
Adrian Arcedera
SVP Memory, MEMS and Sensor Business Unit
Amkor Technology, Inc.
Crossbreeding of MEMS, CMOS, CSOI, Optics and Assembly
Dr. Stefan Majoni
Director Foundry MEMS
Bosch
Fan-out Wafer Level MEMS Packaging for Automotive Applications
Senni Laaksonen
VP Research and Development
Murata Manufacturing Co., Ltd.
About Mesoline’s Emerging 3D Micro Printing Technology, Microchannel Particle Deposition (MPD), Used for MEMS & Sensors
Thomas Russell
CEO and Co-Founder
Mesoline
Let’s Mobilize Digital Innovation in Europe
Samira Nik
Programme Manager – Quantum Technologies and Electronics
European Innovation Council and SMEs Agency (EC EISMEA)
Accelerating MEMS Product Validation and Commercialization with IME ScAlN MEMS Platform
Angeline Tee
Deputy Director Business Development
Innovating For A Greener Future: The Role Of MEMS Microphones In Driving Sustainable And Energy Efficient Consumer Electronics
Gunar Lorenz, Ph.D.
Senior Director Technical Marketing Sensors
Infineon Technologies AG
Improving the LLM experience with sensor provided context
Michael Pate, Ph.D.
Director of Audio Technology Development
MEMS Test Equipment Standardization: New Opportunities for OSATs and IDMs
Marco Pratillo
Sales Manager Semi & MEMS Test Equipment BU
SPEA
Meeting Challenges in MEMS with Advanced Metrology and Inspection Capabilities
Mike Rosa, Ph.D.
CMO & SVP Strategy
Onto Innovation
EVATEC – Mastering Deposition Technologies from Core to Package
Maurus Tschirky
Senior Strategic Marketing Manager
Evatec
Innovative Sputtering Technology for Piezo-MEMS and Other Advanced Functional Devices Manufacturing
Dr. Koukou Suu
Executive Officer and Senior Fellow of ULVAC, Inc / President and CEO of ULVAC Technologies, Inc
AMEC Company Update and Offshore Manufacturing Plan
Pat Walsh
Managing Director NA/EU
AMEC
Atomic-Layer Advanced Manufacturing
Maksym Plakhotnyuk, Ph.D.
CEO & Founder
ATLANT 3D
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