ISES TV – ISES SEA 2023 – Day 1
Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging
- The anticipated growth of Semiconductor Industry by 2030
- The role of Advanced Packaging to support the scale of Moore’s Law
- Roadmap for advanced packaging for Intel
- How is advanced Packaging factory setup different vs traditional Assembly Test Factory
- Challenges in building a fab in Malaysia
- Collaboration opportunities for vendors and Malaysia to make the industry more effective and level the playing field
- Conclusion
Teng Chow Ooi
Sr Director Program Office
Intel Corporation