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ISES TV –

MEMS Breaks Through the AI Bottleneck

AI serves as the computational brain for advanced electronic applications, requiring high-quality sensory data to interact effectively with the environment. Emulating sophisticated sensory systems at a micromachined scale, MEMS technologies bridge this gap to enhance AI’s potential. Current advancements in MEMS — particularly in areas such as 3D LiDAR sensors, tactile sensors for robotics, and high dynamic range microphones —are pivotal in overcoming common AI bottlenecks. Additionally, MEMS integration can streamline neural networks, facilitating more efficient AI workflows. This talk will explore how MEMS technologies address crucial performance, reliability, stability and cost issues, thereby opening new market opportunities and significantly impacting future industry trajectories. We will also discuss how MEMS mitigates the power and thermal challenges posed by increasingly powerful and energy-intensive GPUs.

Eric Aguilar

CEO

Omnitron Sensors