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ISES TV –

Panel Discussion: Challenges for SEA to Move Towards Advanced Packaging Technology

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Fouzun Naseer photo

Fouzun Naseer

Director R&D, Technology, Industry

CREST

Kam Lee

Senior Director, Advanced Packaging Technology and Service

TSMC

Amarjit Sandhu photo

Amarjit Sandhu

CVP of Assembly and Test, NAND Operations

Micron Technology, Inc.

Teng Chow Ooi photo

Teng Chow Ooi

Sr Director Program Office

Intel Corporation

Thiagesh K Lingam photo

Thiagesh K Lingam

Senior Director

MIMOS

Charng Yee Heng

CEO

Globetronics Technology Bhd