ISES TV – ISES USA 2024 Day 1
Panel Discussion: Marking the Memory Wall a Memory: Prespectives on Technical and Economic Challenges
Dr. Ravi Mahajan
Intel Fellow, Assembly and Packaging Technology Pathfinding
Intel Corporation
Akshay Singh Ph.D.
VP, Advanced Packaging Technology Development
Micron Technology, Inc.
Dr. Sanjeev Aggarwal
President & CEO
Everspin Technologies, Inc.
Ji Park
SVP Memory Business Unit
Amkor Technology, Inc.
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
AMD