Substrates production to face some new challenges. Chaplet’s requirement increasing, new materials are needed, miniaturization, power consumption, thermal management, High Frequency requirements, Cost, Geo-political situation, and investments security for new fab.

Embedded Traces process is one of the answers of the challenges, ET opens new design opportunities for the next generation of substrates, secure CAPEX investments due to the extended capabilities including automation, a green production technology with reduced water and power consumption can open the possibility of near shoring.