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ISES TV –

Panel Session: Standardization for Chiplet and Advanced Packaging

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Kuan-Neng Chen, Ph.D.

Dean/Chair Professor

NYCU

Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

Walter Chen

SVP, Greater China Sales & Marketing

Amkor Technology, Inc.

Bret Street

Bret Street

Senior Director of Advanced Packaging

Micron Technology

Kam Lee

Senior Director, Advanced Packaging Technology and Service

TSMC