Vehicles have undergone remarkable changes over the last decades, with semiconductor sensor content increasing dramatically in recent years as more safety and comfort applications are implemented in today’s cars. These sensors need to fulfil their performance requirements whilst concurrently being able to meet stringent automotive reliability criteria – and achieve this in small form factors, adequate cost levels, and with fast time to market. This poses significant challenges to sensor packaging and testing facilities, especially when considering that sensor packages can differ significantly and the package itself is a major contributor to the sensor performance. In this presentation, we will look at how vehicles have evolved to become the collection of sensors they are today, discuss some of the key sensor applications and package structures used for said applications, and give some perspective of packaging trends observed for the next generation of automotive sensors.