Mo Maghsoudnia
Biography
Mo Maghsoudnia is the visionary Founder and dedicated CEO at the helm of UltraSense Systems, a pioneering company in the technology and manufacturing sector. With a track record of transformative leadership and innovation, Mo has been instrumental in shaping the industry landscape.
Before founding UltraSense, Mo Maghsoudnia made significant contributions as the Vice President of Technology & Manufacturing at InvenSense. In this influential role, he oversaw global operations and spearheaded the development of cutting-edge Process Technology. Under his guidance, InvenSense achieved remarkable success, culminating in its acquisition by TDK for a staggering $1.4 billion in 2017.
Prior to his tenure at InvenSense, Mo Maghsoudnia served as the Vice President of Manufacturing at NetLogic MicroSystems. Here, he demonstrated his exceptional ability to steer manufacturing operations, elevating the company from a single product line to a diversified product portfolio powerhouse. His adept leadership, combined with a diverse product range, paved the way for Broadcom’s acquisition of NetLogic MicroSystems for a
remarkable $4 billion in 2012.
Mo’s expertise is firmly rooted in his academic pursuits, holding a Master of Science in Electrical Engineering from Santa Clara University. His passion for innovation is further underscored by his impressive intellectual property portfolio, boasting 12 patents, and an extensive list of research papers that he has authored.
Mo Maghsoudnia’s unwavering commitment to technological advancement and his exceptional leadership have left an indelible mark on the tech and manufacturing sectors, solidifying his status as a true industry luminary.
Company Profile
UltraSense Systems
UltraSense Systems is pioneering the next generation of human–machine interface intelligence, built on its proprietary ultrasound and piezoelectric platform that fuses sensing, haptics, and edge processing into compact, solid-state systems. Its multimodal sensor-fusion architecture—integrating touch, force, ultrasound, lighting, and haptic feedback—creates a unified tactile interface layer that transforms how users interact with devices and environments. The company’s silicon and systems portfolio enables software-defined smart surfaces that operate across diverse materials and form factors, delivering the responsiveness, precision, and design freedom demanded by advanced mobility and next-generation consumer electronics. In automotive, UltraSense Systems powers intelligent cabin interfaces that integrate sensing, actuation, and illumination into seamless surfaces for a futuristic in-cabin experience. In high-end consumer devices, including smartphones and AR glasses, its solutions enable thinner, more immersive, and spatially aware user experiences. Built on deep expertise in ultrasound physics, MEMS, and mixed-signal ASIC design, UltraSense Systems is extending its technology platform into new domains where tactile perception and spatial awareness will define the next era of user experience—combining precision sensing, embedded intelligence, and solid-state reliability to bridge the physical and digital worlds. For more information, visit www.UltraSenseSystems.com.