Speaker

Hisashi Kanazashi

Director, IT Div

Keynote Speaker

Kazunari Ishimaru

Senior Managing Executive Officer, Silicon Technology Division, IEEE Fellow

Keynote Speaker

Dr. Yasumitsu Orii

Senior Managing Executive Officer, 3D Assembly Division

Keynote Speaker

Hamid Azimi, Ph.D.

Chairman of the Board

Formerly CVP of Intel

Speaker

Lode Lauwers

Senior Vice President Business Development & Sales

Keynote Speaker

Shinichi Yoshioka

Senior Vice President and Chief Technology Officer

Keynote Speaker

Deepak Kulkarni

Senior Fellow Advanced Packaging

Keynote Speaker

Kathy Yan, Ph.D.

Director of New Technology & System Integration, Advance Packaging and Test

Speaker

Axel Bialke

SVP Asia

Speaker

Katsumi Furuse

Sr. Manager Wirebond/Power BU Power

Speaker

Choon Khoon Lim

CEO, Business Group AP

Panelist

Dr. Koukou Suu

President, Entegris Japan

Panel Moderator

Dr. Nahomi Aoto

Professor by Special Designation

Speaker

Joe Wu

CEO

Speaker

Oreste Donzella

Executive Vice President and Chief Strategy Officer

Panel Moderator

Ken Shibata

President Japan

Speaker

Shigeru Shiratake

Corporate Vice President DRAM Process Integration and Device Technology

Speaker

Akira Minamikawa

Senior Analyst

Speaker

Toshihito Tsuga

Regional Account Business Unit

Panelist

Hidenori Abe

CTO, Semiconductor Materials, Resonac Holdings Corporation

Speaker

Seung Wook Yoon, Ph.D, MBA

CVP Business Development Team, AVP

Panelist

Christophe Maleville

CTO and Senior EVP Innovation

Panelist

Dr. Tetsuo Endo

Director/Professor

Panelist

Dr. Kazuaki Sawada

Professor

Speaker

Joseph Roybal

Senior Vice President of Global Backend Operations

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