ISES Japan 2025 – Speakers Profiles

Keynote Speaker

Terushi Shimizu

Chairman

Day 1 / 09:20 - 09:40

Company Profile

Keynote Speaker

Norishige (Noly) Morimoto

VP of IBM Japan & CTO of Research & Development

Day 1 / 09:40 - 10:00

Joined IBM Japan in 1987, and later moved into IBM Research, after acquiring his master degree in EE&CS from MIT in 1995. In 2006, transferred to IBM Watson Research Center. He had served as a Director of IBM Research-Tokyo, CTO of IBM Asia Pacific Region, and VP of R&D in Japan, before becoming CTO of IBM Japan. He became Vice President of IBM Japan in 2023 and joined a member of BoD of IBM Japan in 2024.He is appointed as a member of Semiconductor and Digital Strategy Advisory Panel under the Ministry of Economy, Trade and Industry (METI).

Company Profile

Keynote Speaker

Hiroshi Iwatsubo

Executive Deputy President and CTO

Day 2 / 13:35 - 13:55

Hiroshi Iwatsubo graduated from Kyoto University, Department of Technology. He joined Murata Manufacturing Co., Ltd. in Kyoto, Japan in 1985. After engaging in the development of ceramic materials for four years, he was dispatched to Murata Europe GmbH in 1989 until his return to Murata Japan in 1993.
In 2012, he was appointed to Vice President, Head of Global Sales & Marketing
In 2015, he was appointed to Senior Executive Vice President (Board Member) Corporate Technology & Business Development Unit, In 2020, Senior Executive Vice President .
Hiroshi Iwatsubo currently serves as CTO and Executive Deputy President .

Company Profile

Keynote Speaker

Rahul Manepalli, Ph.D.

Intel Fellow, VP, Director of Substrate Packaging Technology Development

Day 2 / 09:00 - 09:20

Rahul Manepalli is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization in Intel. Rahul and his team are responsible for developing next generation of materials, processes and equipment for Intel’s package pathfinding and development efforts. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) and other substrate technologies. Rahul has also had an instrumental role in leading Intel’s assembly materials development and pathfinding efforts leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 100 patent publications in semiconductor packaging, over 50 technical papers and invited talks and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.

Company Profile

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.
To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

Keynote Speaker

Deepak Kulkarni

Senior Fellow Advanced Packaging

Day 1 / 11:10 - 11:30

Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.

Company Profile

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

Keynote Speaker

Kazunari Ishimaru

Senior Managing Executive Officer, Silicon Technology Division, IEEE Fellow

Day 1 / 11:30 - 11:50

Joined Toshiba, Semiconductor Device Engineering Labs. in 1988 and engaged in development of advanced SRAM/Logic technologies. 2006-2010: engaged in development of 32nm~20nm CMOS platform technologies with IBM as Toshiba’s representative (VP of R&D). 2013 Senior Manager of Advanced Memory Technology Development Dept. 2022 Director of Memory Technology R&D Center. Joined Rapidus Corporation in April 2023.

Company Profile

Speaker

Akira Minamikawa

Senior Analyst

Day 1 / 17:10 - 17:30

Company Profile

Omdia is a leading research and advisory group focused on the technology industry. With clients operating in over 120 countries, Omdia provides market-critical data, analysis, advice, and custom consulting. Information Classification: General Omdia was formed in 2020 following the merger of IHS Markit, Tractica, Ovum and Heavy Reading. Sitting at the heart of the Informa Tech portfolio, Omdia reaches over four million technology decision makers, influencers and practitioners that form part of the wider Informa Tech community and has specialist research practices focusing on Enterprise IT, AI, Internet of Things, Communications Service Providers, Cybersecurity, Components & Devices, Media & Entertainment and Government & Manufacturing.

Speaker

Kazuoki Matsugatani, P.h.D.

Senior Director, R&D Center

Day 2 / 14:15 - 14:35

Dr. Kazuoki Matsugatani joined DENSO CORPORATION in 1989, and has over 25 years of R&D experience in electronics, including compound semiconductors, microwave and millimeter-wave circuits, wireless communication systems, and ADAS. He has held key leadership roles such as Director of R&D Division 3, Director of ADAS Business and Technology Development. In 2017, he became Executive Director and Head of Engineering in Europe, and in 2019, Executive Officer and Head of Engineering in North America. After returning to Japan, he was appointed Senior Director at DENSO CORPORATION in 2021, and joined MIRISE Technologies as a Member of the Board in 2022.

Company Profile

DENSO is a €44.1 billion ($47.9 billion) global mobility supplier that develops advanced technology and components for nearly every vehicle make and model on the road today. With manufacturing at its core, DENSO invests in its around 200 facilities to produce electrification, powertrain, thermal, mobility electronics, advanced devices to create jobs that directly change how the world moves. The company’s around 158,000 employees are paving the way to a mobility future that improves lives, eliminates traffic accidents, and preserves the environment. Globally headquartered in Kariya, Japan, DENSO spent nearly 10 percent of its global consolidated sales on research and development in the fiscal year ending March 31, 2025.
In Europe, DENSO regional headquarters is located in Amsterdam, the Netherlands. DENSO has 36 official group companies located in 15 European countries and employs more than 13,000 people across its European organization. DENSO Europe’s consolidated revenue was €3.9 billion ($4.3 billion) for the fiscal year ending March 31, 2025.

Speaker

Lode Lauwers

Senior Vice President Business Development & Sales

Day 1 / 13:30 - 13:50

Lode Lauwers is Senior Vice President Business Development and Strategy in IMEC, the nanoelectronics R&D Center in Leuven, Belgium. His current focus is to architect new global R&D collaborations and related business models, in line with semiconductor technology initiatives in various continents currently in conception. In that role he also guides imec’s Corporate Business Development strategies in nanoelectronics. Since he joined IMEC in 2005, he had various leading roles in IMEC’s technology business development and partner relation management. He has been driving over 2 decades the build-out, growth and business foundations of imec’s flagship core program with leading IC manufacturers, foundries, equipment and material suppliers and design and system houses. Earlier, he has been general manager of an ASIC design house, part of a US-based ASSP provider for the telecom industry, and scientific advisor for government funding in local and European cooperative networks in micro-electronics and telecommunications. He has a PhD in Electrical Engineering from KU Leuven.

Company Profile

Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2021, imec’s revenue (P&L) totaled 732 million euro.
Further information on imec can be found at www.imec-int.com.

Speaker

Daisuke Murata

President and CEO

Day 2 / 13:55 - 14:15

Daisuke Murata has served as President and CEO of Murata Machinery, since September 2003. He has held a variety of ascending leadership positions at Murata Machinery since 1987.
He also now serves as Chairman of the Japan Textile Machinery Association, as Chairman of the Japan Institute of Material Handling, and Superintendent of the Japan Business Machine and Information System Industries Association. In July 2017, he became the SEMI International Board member.
He graduated with a Bachelor of Economics from Hitotsubashi University in 1984 and obtained MBA from the Graduate School of Business at Stanford University in 1990.

Company Profile

Murata Machinery (Muratec) is a worldwide leader and solution provider for automated material handling systems in semiconductor manufacturing and other manufacturing or distribution industries. Muratec also manufactures machinery and equipment such as Textile Machinery, Machine Tools, Sheet Metal Machinery, and Communication Equipment.
This year marks 90 years since its founding in 1935. Under the slogan “Innovation. Mark the turning point”, Muratec aims to create technologies that bring innovation to the market and society.

・Logistics & Automation Division
Logistics Center, Automated Storage & Retrieval Systems (AS/RS), Transportation Systems, Picking Systems, Sorting Systems, Data Management system
・Clean FA Division
Transport Systems & Storage Systems For Semiconductor fab.
・Machine Tools Division
CNC Twin-spindle Chucker, CNC Twin-spindle Turning Center, CNC Opposed Twin-spindle, FMC and FMS
CNC Turret Punch Press, CNC laser punch press,
Press Brake, Automatic CAD/CAM system for sheet metal working, FMC and FMS
・Textile Machinery Division
VORTEX Spinning Machines, Automatic Winders
・Communication Equipment Division
Digital Multifunctional Product, Laser Xerographic Printer Facsimile, LED Linear Array Optical Facsimile, Thermal Transfer Facsimile,
Document & IP Solutions

Speaker

Akihiko Furuya

Executive Officer, Head of Semiconductor Subdivision, Electronics Division

Day 1 / 16:40 - 16:50

Graduated From Nagasaki University Master’s Degree
(Appointed Dates)
April 1993 　 Joined Toppan Printing Co.,Ltd., Electronics Division
April 1996 　 TOPPAN Kumamoto Technical Research Institute.
April 2002 　 TOPPAN (Corporate) Technical Research Institute
April 2010 　 General Manager, FC-BGA Engineering Department, Toyama Plant
April 2014 　 General Manager, FC-BGA Engineering Department, Niigata Plant
April 2018 　 Head of Technical Development Headquarters Ⅱ, Electronics Division
April 2022 　 Head of Semiconductor Business, Electronics Division
April 2023 　 Executive Officer, Head of Semiconductor Business, Electronics Division
October 2023 TOPPAN Inc. Executive Officer, Head of Semiconductor Business, Electronics Division
April 2025　 TOPPAN Inc. Executive Officer, Head of Semiconductor Subdivision, Electronics Division

Company Profile

TOPPAN Inc. has grown beyond its traditional printing business and now offers a broad range of products and services with printing technologies at their core in the Information & Communication, Living & Industry, and Electronics segments.

Turning printing technologies into leading edge electronics products
Semiconductor-Related(FC-BGA Substrates, Color Filter Arrays, Etched Products, Photomasks/Nanoimprint Molds, LSI Design/LSI Turnkey Service)
Display-Related(Color Filters, TFT LCDs, Surface Treatment Films, Light Control Film)

Speaker

Maksym Plakhotnyuk, Ph.D.

CEO & Founder

Day 2 / 11:20 - 11:30

Maksym Plakhotnyuk is the CEO and founder of ATLANT 3D, a pioneering deep-tech company at the forefront of innovation, developing the world’s most advanced atomic-scale manufacturing platform. Maksym is the inventor of the first-ever atomic layer advanced manufacturing technology, enabling atomic-precision development of materials, devices, and microsystems. A scientist with a Ph.D. in Nanotechnology and Photovoltaics, he has deep expertise in nanotechnologies, renewable and exponential technologies, semiconductor processing, photovoltaics, solid-state physics, and material science. A Fulbright scholar, Hello Tomorrow Grand Winner, and proud Ukrainian, Maksym has earned global recognition for his work. With 15+ years of experience and numerous patents, he leads ATLANT 3D’s mission to redefine nanofabrication.

Company Profile

ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.

ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.

Speaker

Nelson Fan

APT Business Lead,VP of Business Development APT ASMPT

Session info not yet published.

Company Profile

ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

Speaker

Takahiro Ogura

President of AI Computing Division

Day 1 / 14:30 - 14:50

Takahiro Ogura is a seasoned leader in high-performance computing with over 20 years of experience. He currently heads the AI Computing Division at Preferred Networks (PFN), overseeing the company’s critical computing infrastructure technologies including the MN-Core™ series of AI semiconductors and in-house supercomputers. Prior to joining PFN, he served as the after-sales service manager for domestic high-performance computing clients at Fujitsu, where he began his career as a systems engineer working on supercomputer systems projects. A notable career highlight was his instrumental role in the design and development of the Fugaku (Post-K) supercomputer at Japan’s national research and development agency RIKEN. Ogura received a Master’s degree from Tsukuba University’s Systems and Engineering program in 2005.

Company Profile

Preferred Networks (PFN) is a leading Japanese AI technology company known for its vertically integrated development of cutting-edge technologies—from custom AI chips, generative AI foundation models to real-world AI solutions and products. PFN plays a key role in advancing Japan’s AI sovereignty and has earned a strong domestic reputation. PFN’s AI solutions span across diverse industries including manufacturing, materials, energy, pharmaceuticals, healthcare, finance, retail, and entertainment. The company is currently developing a novel AI inference chip, leveraging its highly energy-efficient MN-Core™ logic and a new memory technology, with a release targeted for early 2027.

Preferred Networks (PFN) develops cutting-edge technologies across the AI value chain from semiconductors, supercomputers, generative AI foundation models to AI solutions and products:
MN-Core™ — a series of highly energy-efficient AI chips, which made a debut topping the Green500 list of the world’s most energy-efficient supercomputers three times in 2020/21. PFN is currently developing a new line of MN-Core chips focused on AI inference, set for release in early 2027.
Preferred Computing Platform™ (PFCP™︎) — a cloud-based service that provides users with access to the computing power of MN-Core 2. PFN has also announced a joint venture with Mitsubishi Corporation and IIJ aiming to launch an MN-Core™-based IaaS commercial service in 2026.
PLaMo™ — a series of Large Language Models developed fully from scratch by PFN, delivering top-tier performance in Japanese-language capabilities. These models power a wide range of AI applications in sectors such as finance, healthcare, and the public sector.
Matlantis™ — a cloud-based, high-speed universal atomistic simulator. Powered by a machine learning interatomic potential (MLIP), Matlantis significantly accelerates the simulation workflow in new materials discovery across industries such as semiconductor, automotive, and energy, by bypassing traditional heavy electronic state calculations.

Speaker

Holger H. Kuehnlein, P.h.D.

Senior Vice President, Technology & Innovation

Day 2 / 11:10 - 11:20

Holger H. Kuehnlein’s scientific career began in 1999 at the Technical University of Dresden, a key institution within the Silicon Saxony high-tech cluster. His early industrial experience at KSW MicroTec GmbH involved Electrochemical Deposition (ECD) for flip-chip bumps and packaging. His university research until 2004 focused on enhancing mass transfer and metal deposition in microstructures using pulse plating and magnetic fields.
His PhD. at ATOTECH Germany GmbH Berlin, on electrodeposited Cu2ZnSn for CZTS compound semiconductors, led him to RENA Technologies in 2007. He was instrumental in RENA’s success story in PV, driving advancements in wet chemical cleaning, etching, and plating for PERC, TOPCON, and IBC cell technologies. Since 2015, as head of Technology & Innovation at RENA, he’s significantly contributed to the SEMI industry. While specializing in wet chemical processes, he diversified RENA into mobile device glass components, semiconductor wafering, and plating. His development efforts since then have also encompassed new wet chemical processes for Lithium-ion batteries.
His current work is particularly focused on wet chemical Through-Glass Via (TGV) etching and metallization of Glass Core Panel Substrates for advanced packaging in high-performance computing and AI applications, involving close collaboration with key players in glass, material and packaging industries. His team also leverages electrochemical methods for polishing, porosification, and deposition for critical materials like Silicon Carbide (SiC) and Silicon (Si) in areas like epitaxial-wafering, with recent investigations extending to Gallium Nitride (GaN) and Gallium Oxide (GaO) for next generation power applications.

Company Profile

Founded in 1993, RENA Technologies has established itself as a global leader in mechanical and process engineering, for a diverse range of industries. We specialize in providing cutting-edge wet processing solutions for the semiconductor, solar, additive manufacturing, glass, and medtech industries.
A key area of expertise is wet chemical immersion, spray and single wafer processes for the manufacturing of semiconductors. With over 1,100 systems installed worldwide, our technology is trusted by manufacturers around the globe to enhance efficiency and production quality.
RENA Technologies employs approximately 1,000 professionals worldwide, all dedicated to innovation and excellence in our field. Headquartered in Gütenbach, Germany, and manufacturing sites in Albany, OR and Wykroty, Poland, we continue to drive advancements in process engineering, ensuring our customers receive the highest quality solutions for their manufacturing needs.
On top we provide worldwide onsite service support with over 150 Experts in 20 locations globally to ensure flawless installation and operation of our tools.

RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes like etching, stripping, cleaning or drying. RENA offers proven standard machines as well as customer-specific solutions and process support.

Speaker

Hidenori Abe

CTO for semiconductor materials, Resonac Holdings Corporation & Executive director, Electronics Business Headquarters, Resonac Corporation

Day 1 / 16:00 - 16:20

Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.

Company Profile

Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.

Speaker

Tomoshige Nambu

Director for IT Industry Division

Opening Speech

Day 1 / 09:00 - 09:20

Mr. Tomoshige NAMBU has served as the Director for IT Industry Division at the Ministry of Economy, Trade, and Industry (METI) in Japan since July 2025. He leads METI’s AI and semiconductor strategy.
Prior to his current position, he spent 3.5 years in NYC and Washington D.C. from December 2021 to June 2025, serving as Special Advisor for METI at the New York Office of the Japan External Trade Organization (JETRO). He was a senior METI representative in the US, covering trade and economic security policies.
During a more than 20-year career at METI, Mr. Nambu has held responsibilities across a diverse range of public policy areas. He was involved in the formulation of Japan’s economic policy in 2018-2021 as the Director for Macroeconomic Policy at METI. He also assumed the duty of Cabinet Counselor, drafting policy proposals on economic growth strategy under the direction of the Prime Minister’s office.
He was stationed in Washington D.C. as the Trade Attaché at the Embassy of Japan in the U.S. from 2012 to 2015 and worked on several bilateral trade issues such as TPP and energy exports from the U.S.
He joined METI in 2002 after receiving a Bachelor of Law from the University of Tokyo. He also holds an L.L.M from Harvard Law School. He served as the Asia Program Fellow at the Rajawali Foundation Institute for Asia in Harvard Kennedy School in 2009-2010. He currently lives in Tokyo with his wife.

Company Profile

METI has been transforming itself to respond to the needs of the times.
METI has a history of responding to the changing needs of society. Therefore, its history is the history of Japan’s progress.
In 1949, the Ministry of Commerce and Industry was reorganized and the Ministry of International Trade and Industry was established. Its internal subdivisions consisted of eight bureaus: Minister’s Secretariat, Trade Bureau, Trade Promotion Bureau, Enterprise Trade Bureau, Textile Trade Bureau, General Merchandise Trade Bureau, Machinery Trade Bureau, Chemical Trade Bureau, and Iron and Steel Trade Bureau.
In addition, four agencies, the Resources Agency, Small and Medium Enterprise Agency, Industrial Technology Agency, and Patent Office; eight regional trade and industry bureaus; and four regional coal bureaus were established as external subdivisions.

Speaker

Tadahiro Suhara

CEO

Welcome Speech

Day 1 / 08:40 - 09:00

Closing Remark

Day 2 / 16:55 - 17:00

I.S.I.G./

Education:
・Bachelor, Economics, Doshisha University, Japan, 1983
Experience:
・TSSC, CEO, 2023/5～
・JSR Corporation, Managing Officer, 2019～2023
・Screen Semiconductor Solutions , CEO, 2014～2019
・Dainippon Screen Manufacturing , 1983～2014

Company Profile

TSSC is a consulting company to support Semiconductor and Semiconductor Supply Chain for enabling continuous Semiconductor industry’s growth.

Speaker

Salah Nasri

CEO and Co-Founder

Welcome Speech

Day 1 / 08:40 - 09:00

Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.

Company Profile

Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.

Speaker

Soitec

Session info not yet published

Company Profile

Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.
In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.
With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.
Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.
For more information visit: www.soitec.com.

Speaker

Yole Group

Session info not yet published

Company Profile

Yole Group is a leading international market research and strategy consulting firm, delivering in-depth analyses across market trends, technology developments, teardowns, and reverse costing. Leveraging deep semiconductor expertise, its team of analysts also provides custom consulting services, offering strategic, technical, and market insights tailored to address specific business challenges and opportunities.

Speaker

Lam Research Corporation

Session info not yet published

Company Profile

Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com

We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.

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Completed Summits

Completed Summits

I.S.E.S. Japan 2025

Supported by:

2025 Speakers

Terushi Shimizu

Norishige (Noly) Morimoto

Hiroshi Iwatsubo

Rahul Manepalli, Ph.D.

Deepak Kulkarni

Kazunari Ishimaru

Akira Minamikawa

Kazuoki Matsugatani, P.h.D.

Lode Lauwers

Daisuke Murata

Akihiko Furuya

Maksym Plakhotnyuk, Ph.D.

Nelson Fan

Takahiro Ogura

Holger H. Kuehnlein, P.h.D.

Hidenori Abe

Tomoshige Nambu

Tadahiro Suhara

Salah Nasri

Soitec

Yole Group