Speaker
Jianmin Li
Packaging R&D Director, Amkor Technology China, Inc.
New Package Solutions for Automotive Optical Sensors
Day 1 / 09:00 -
Advanced Driver Assistance Systems (ADAS) are designed to help the driving process and enhance car/road safety. Automotive optical sensors enable ADAS and the autonomous driving transition from SAE J3016 Level 2 towards Level 4/5, according to SAE International (formerly the Society of Automotive Engineers).
Current optical sensor chip designs require custom package solutions which have assembly packaging and test challenges. In addition, stringent reliability requirements increase the development time to select materials, run process evaluation, optimize process parameters and complete reliability verification for automotive applications.
New automotive optical package innovations extend Amkor’s broad package portfolio capabilities and expertise to benefit automotive customers. The solution to current automotive image sensor application challenges involves creating a package platform that utilizes an assembly open toolbox, adopts a new generation of wafer fabrication requirement, achieves faster development cycle time and manages cost efficiency.
This presentation will discuss a standard package platform to design alternative package solutions, overcome technical challenges and satisfy the Automotive Electronics Council’s AEC Q100 reliability requirements for automotive optical sensors.
Jianmin joined Amkor in 2013, and is currently packaging R&D director in Amkor Assembly & Test (Shanghai) Co. Ltd, responsible for developing various package type including memory SCSP, flip chip package, SiP and optical sensor packages. He has more than 20 years of experience in assembly process engineering area. Prior to joining Amkor, Jianmin was an assembly process engineer in Intel and IBM. He holds a Master degree in Material Engineering from Fudan University.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Speaker
Frank Ruschmeier
Director of Application Engineering
Perceiving the future with embedded AI and MEMS sensors
Day 1 / 10:00 -
We are living in the era of technological revolution, where the integration of embedded Artificial Intelligence (AI) and Micro-Electro-Mechanical Systems (MEMS) sensors is shaping the future in astounding ways. This speech delves into the potential of this collaboration and demonstrates how it is bringing practical and exciting transformations to our daily lives. Embedded AI utilizes learning algorithms and data analysis to enable devices not only to meet our needs but also to predict and surpass them. MEMS sensors serve as the senses of these intelligent systems, allowing them to perceive and understand the physical world around them.
In this speech, Mr. Hongyu will explore specific application and use cases, such as personal environmental & health monitoring and personalized fitness application, to illustrate how these technologies are impacting and enhancing our quality of life.
Frank Ruschmeier has been appointed as the Director of Application Engineering at Bosch Sensortec in Shanghai since 2023, marking over a decade of impactful contributions to the technology sector. As Lead Product Manager at ETAS GmbH, Stuttgart, and Application Field Manager at ETAS China, he led significant projects in embedded systems, contributing to the evolution of Software Defined Vehicle Verification and Validation.
Before ETAS, Frank showcased expertise as the Project Leader for Hardware/Electronics at Ushio – Xtreme Technologies GmbH in Aachen, Germany, from August 2010 to January 2013. His career commenced at Philips Extreme UV GmbH, progressing from Development Engineer to Project Leader and System Architect in the semiconductor area for extreme ultraviolet lithography development.
Frank holds a Diploma in Communications and Electronics Engineering from Aachen, Germany, and a Master of Science in International Business from Maastricht University, The Netherlands.
In his current role at Bosch Sensortec, Frank continues to drive innovation and lead teams, solidifying his reputation as a forward-thinking professional shaping the future of sensor technologies in the semiconductor industry.
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Speaker
Dr. Yuan Lu
Manager Technical Marketing Management
EVATEC – Thin Film Production Solutions for HeterogeneousIntegration
Day 1 / 11:00 -
Heterogeneous Integration requires knowledge in functional layers within the dies, along with expertise in Advanced Packaging. Whereas the first part is genuinely core competence of Evatec for piezoelectric sensing or actuating elements, we also have a strong footprint in the AP court. The interdisciplinary approach is of the essence there, for instance in heat dissipation, magnetic shielding, or stress compensation. Mastering the 3rd dimension is also common for both MEMS and AP, where TSVs are elementary.
A variety of deposition technologies such as PVD, PECVD and PEALD on specific tool concepts (batch, single wafer or inline) enables the realization of interesting combinations. This is where Photonics, Optoelectronics, Semiconductors and Advanced Packaging come together – forming today’s MEMS devices.
Dr. Yuan Lu, manager technical marketing management at Evatec China. He participated in the project of BAW device research and development between Evatec and global RF-filter top companies. Besides, he was doing of the strategic marketing of MEMS state-owned company, including filter, IMU, temperature and gas MEMS project cooperation and investment. Currently his team is focusing on the solution and strategic marketing of business unit semiconductor, optoelectronics, photonics in Evatec China.
Company Profile
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
Virtual Speaker
Jörg Amelung
Deputy Institute Director Division, Director Engineering, Manufacturing & Test
From Concept to Production: Unleashing the Potential of MEMS-based Ultrasound
Day 1 / 12:00 -
MEMS device advancements are often correlated with the basic development of specific technologies. The Fraunhofer IPMS, renowned for its expertise in MEMS technology development, offers comprehensive development services ranging from initial ideation to qualified processes and transfer towards volume production. Ultrasonic sensors have already found widespread use in numerous application areas, including medical monitoring and object detection. Micromechanical ultrasonic transducers (MUT) based on MEMS, as exemplified by the Fraunhofer IPMS, introduces unique characteristics that enable innovative applications. This presentation will cover the key development aspects, from the initial concept to a stable technology, using this technology development example and is specifically tailored for business executives and development managers.
Jörg Amelung is Deputy Director of the Fraunhofer Institute for Photonic Microsystems (IPMS) and heads the MEMS Engineering, Manufacturing & Test division. Fraunhofer IPMS is a leading research institute in the MEMS field, equipped with high quality microsystem cleanrooms (200 – 300 mm wafer). As an expert and manager in MEMS technology, Jörg Amelung has been driving the development of smart microsystem technologies since 1993. He also played a key role in OLED development and founded two companies specializing in this field.
Company Profile
Fraunhofer IPMS is a leading international research and development service provider for electronic and photonic microsystems in the application fields of Smart Industrial Solutions, Bio and Health, Mobility as well as Green and Sustainable Microelectronics. Research focuses on customer-specific miniaturized sensors and actuators, MEMS systems, microdisplays and integrated circuits as well as wireless and wired data communication, neuromorphic and quantum computing. Services range from consulting and design to process development and pilot series production.
The Fraunhofer IPMS is one of 75 institutes of the Fraunhofer-Gesellschaft, the leading organization for applied research in Europe. With nearly 32,000 employees Fraunhofer operates with an annual budget of €3.6 billion, €3.1 billion of which is generated by contract research — Fraunhofer’s core business model.
The range of services includes wafer processing, characterization & testing, assembly and interconnection technology and the organization of external and supplier services. At the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS offers applied research, process and material development on 300 mm wafers for microchip producers, suppliers, device manufacturers and R&D partners. 4000 m² of clean room space is available for processing customer orders as well as laboratory space for over 80 processing and analytical tools.
Virtual Speaker
Dr. Sandro Koch
Business Unit Manager Acoustic Sensors and Systems
From Concept to Production: Unleashing the Potential of MEMS-based Ultrasound
Day 1 / 12:00 -
MEMS device advancements are often correlated with the basic development of specific technologies. The Fraunhofer IPMS, renowned for its expertise in MEMS technology development, offers comprehensive development services ranging from initial ideation to qualified processes and transfer towards volume production. Ultrasonic sensors have already found widespread use in numerous application areas, including medical monitoring and object detection. Micromechanical ultrasonic transducers (MUT) based on MEMS, as exemplified by the Fraunhofer IPMS, introduces unique characteristics that enable innovative applications. This presentation will cover the key development aspects, from the initial concept to a stable technology, using this technology development example and is specifically tailored for business executives and development managers.
Dr. Sandro Koch completed his physics studies at the Dresden and received his PhD in applied physics in 2015. He then joint Fraunhofer IPMS as a research scientist and held several research management positions focusing on MEMS-based acoustic and photonic sensors. Currently, Sandro Koch is working as business unit manager “Acoustic Sensors and Systems” on the development of MEMS modules in the audible and ultrasonic range and their transfer to industry.
Company Profile
Fraunhofer IPMS is a leading international research and development service provider for electronic and photonic microsystems in the application fields of Smart Industrial Solutions, Bio and Health, Mobility as well as Green and Sustainable Microelectronics. Research focuses on customer-specific miniaturized sensors and actuators, MEMS systems, microdisplays and integrated circuits as well as wireless and wired data communication, neuromorphic and quantum computing. Services range from consulting and design to process development and pilot series production.
The Fraunhofer IPMS is one of 75 institutes of the Fraunhofer-Gesellschaft, the leading organization for applied research in Europe. With nearly 32,000 employees Fraunhofer operates with an annual budget of €3.6 billion, €3.1 billion of which is generated by contract research — Fraunhofer’s core business model.
The range of services includes wafer processing, characterization & testing, assembly and interconnection technology and the organization of external and supplier services. At the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS offers applied research, process and material development on 300 mm wafers for microchip producers, suppliers, device manufacturers and R&D partners. 4000 m² of clean room space is available for processing customer orders as well as laboratory space for over 80 processing and analytical tools.
Speaker
Elpin Goh
Senior Director, Strategic Marketing, CSBG
Addressing High Volume Manufacturing Challenges and Technology Inflections in MEMS for Automotive Applications
Day 1 / 13:00 -
The average semiconductor value in a typical car is expected to grow from USD $812 per car in 2022 to USD $1,467 per car in 2029.1
MEMS devices are well established as critical components in a wide range of systems in the automotive sector. Accelerometers and gyroscopes improve safety, RF filters enable wireless connectivity, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart functions. As the demand on device performance and manufacturing volume increases, the need for improved MEMS manufacturing solutions becomes ever more prevalent.
For example, many established MEMS fabs and foundries are running at very high utilization and continuous improvements in manufacturing productivity and yield are becoming increasingly desirable. At the same time, MEMS developers are looking to the next generation of devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to piezoelectric based MEMS devices that can offer a paradigm shift in capability.
In this short overview, we will discuss how Lam Research is combining production proven high-volume manufacturing solutions, and novel process capabilities to address these challenges and technology inflections.
Source 1: S&P Global Mobility Automotive Semiconductor Tracker—April 2023
Elpin Goh is Senior Director of Specialty Technologies Business Development at Lam Research. She is responsible for business strategy development and planning in Specialty Technologies in APAC region. She works with various Lam product owners to define product strategy and drive innovative product solutions in Specialty Technologies.
Prior to this, Elpin focused on the sales account management in Lam SEA. Elpin’s experience includes process integration, product management, sales and business development in the foundry and semiconductor equipment industry. She started her career as a process integration engineer at GlobalFoundries where she held various positions in process integration, customer engineering, product management and business development.
Elpin received a Master’s degree in Electrical Engineering from National University of Singapore, Singapore. She also holds a Bachelor’s degree from University of Manchester Institute of Science and Technology, UK.
Company Profile
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Panel Moderator
Kamel Ait Mahiout
President
China Collaboration in MEMS Solutions: Challenges and Opportunities
Day 1 / 17:00 -
Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.
Company Profile
Speaker
Dr. Robert Pan
Head of Technology Development/Design Technology
Silterra’s Foundry Solutions for Emerging Technologies
Day 1 / 14:00 -
As a global semicondutor foundry. Silterra commits to its customers for innovation on processes technologies.
In this presentation, Silterra’s latest progress of emerging technologies development such as MEMS, SiPh and Life Science technologies will be presented.
Robert is current working at Silterra Malaysia as head of Technology Development. He had total of 26 years of experirnce in semiconductor industry.
His previous working experienc was with Texas Instruments and TSMC. The technologies he had developed including 45 -65 nm CMOS technologies, 0.6um to 0.13 um BCD technologies, RFLDMOS, DDI, and High voltage, Life Science, SiPh and MEMS …etc. He has a PhD degree from University of New York at Buffalo, Electrical Engineering Department.
Company Profile
SilTerra, a pure-play wafer foundry, offers various CMOS technologies from 180nm to 110nm nodes. It serves a wide range of end-market applications, including IoT, power management, consumer electronics, medical and communication products. Besides CMOS technologies, SilTerra also provides MEMS foundry services, unique and patented MEMS-on-CMOS technologies, silicon photonics, bio-photonics, and power. Its excellent customer service team helps customers realize working prototypes from proof of concept to high volume manufacturing.
Speaker
Yuanli Sun
General Manager, SPEA China
Enabling the future of Wafer-level MEMS test and MEMS WLCSP final test
Day 1 / 15:00 -
MEMS testing is facing new challenges in terms of wafer-level solutions for production volumes. On one hand, there is no doubt that testing prior to packaging is beneficial for several reasons, resulting at the end in production cost reduction and faster time to market. On the other hand, a reliable wafer-level test of MEMS and sensors cannot be limited to the electrical characteristics of the devices. Dynamic testing of MEMS devices requires a new-generation of test equipment, able to determine and analyze also the device mechanical functions by measuring its non-electrical behavior. Field-proven equipment for the wafer-level sensor test of MEMS devices like accelerometers, gyroscopes, pressure sensors, magnetic sensors, are expected to be adopted as a standard by the industry. Another test challenge concerns the growing adoption of the wafer-level chip scale packaging technology (WLCSP) for MEMS sensors and actuators, in both consumer and automotive fields. The adoption of a complete solution for the production final test of WLCSP MEMS devices will be essential. Such equipment must be able to perform the high-throughput, soft handling of the devices directly from a diced wafer on film frame, to stimulate and test the devices at tri-temp, to perform the finishing on reel after testing. This presentation will explore these challenges, providing possible solutions, raising open points and questions.
Yuanli Sun received her M.S. degree in Industrial Management from the Polytechnic of Turin (Italy) in July 2012. She joined SPEA during her last academic year as a semiconductor testing equipment application engineer. She rapidly achieved being responsible for application development projects for IC, Power and MEMs devices，technical expertise that involve data modeling and analysis, C/C++ program languages, also, she participated in the design of extremely accurate measurement modules that are widely used in MEMS wafer testing.
With such a strong and well prepared background, in 2014, Yuanli establishes a wholly owned subsidiary of SPEA in China, where she’s responsible in full for SPEA’s business development and after-sales service in China. Riding the wave of success, Yuanli establishes more offices in Suzhou, Shenzhen, and Chongqing to enhance the popularity and reputation of SPEA in China.
Today, as General Manager of SPEA China, her group has worked directly with SPEA’s customers to develop state-of-the-art technology for testing high volume Power Modules, MEMS test cell, wafer level tester high parallelism solutions.
孙媛丽于2012年7月获得了意大利都灵理工学院的工业管理硕士学位。她在最后一个学年加入 SPEA，担任半导体测试设备应用工程师，主要负责IC、Power和MEMS器件的应用开发项目，她精通数据建模和分析、C/C++语言编程等专业技能，参与设计了广泛应用于MEMS晶圆测试的高精密测量模块。
凭借雄厚的技术背景，她于2014年在中国成立了SPEA的全资子公司，全面负责SPEA在中国的业务发展和售后服务。她抓住风口乘势而上，在苏州、深圳和重庆设立了更多的办事处，持续提升SPEA在国内的知名度和声誉。
如今，作为 SPEA 中国区总经理，她的团队直接与 SPEA 的客户合作，开发最先进的技术用于测试高功率模块、MEMS 测试单元、晶圆级测试仪高并行度解决方案。
Company Profile
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
- SPEA product portfolio includes test equipment for:
- Automotive, linear, analog mixed signal & SoC devices requiring the most advanced and powerful instrumentation. SPEA’s DOT platform addresses today’s and future roadmap needs.
- MEMS & Sensors. SPEA has been chosen by the biggest players in this market to develop the best solutions for inertial, high-g, proximity, time-of-flight, light, pressure, environmental, magnetic, acoustic sensors. SPEA equipment combines physical stimulus with a complete electrical test, fast pick&place handling, reliable contacting, tri-temp.
- Power & Discretes. DOT800 T perforfms static and dynamic measurements with extended current/voltage ranges, on the whole range of power applications: wafers, discretes (Si, SiC, GaN based), IPMs, KGDs, DBCs, IGBT modules.
- Identification. CT1000 and CT3000 are low-cost test systems dedicated to micro-controllers, RFID, UHF, combi devices. They perform complete, highly accurate measurements, offering high throughput, with high multi-site test capability at wafer test, and a fast data transfer for memory test.
Speaker
Dr. Daniel Chang
Vice President and General Manager
Enriching Lives with TDK Sensing Solutions
Day 1 / 16:00 -
Enriching lives and enhance human interactions in a digital world through innovative sensing solution is TDK’s mission and commitment to sensor business. The company would like to build the premier MEMS sensing platform to enable innovation and create customer values by delivering unique sensor solutions into targeted markets. Our MEMS sensor product spectrum includes motion tracking devices such as accelerometer and gyroscopes, microphone, pressure sensor, ultrasonic time of flight sensors, and CO2 environmental sensors. The company has a network of design and manufacturing locations and sales offices. Of particularly importance is TDK-InvenSense regional presence; where ~300 engineers are located with all aspects of operation and engineering activities to deliver 1 Billion units of intelligent sensors per year. This presentation will start with a brief history of TDK, its business evolution, and sensor business. Operation principle and product features of TDK MEMS sensors; particularly those developed and manufactured in the region, are introduced. Among these, TDK-InvenSense’s proprietary CMOS-MEMS system-on-chip platform enables the sensors with the industry-leading performance, power, and size. Finally, the presentation is wrapped up with TDK’s mission and commitment to sensor business. Sensing solution is the foundations of smart systems. Sensor is everywhere including hearable, metaverse, entertainment, environmental, drones, automotives, mobiles, computing, wearable, and industry.
Dr. Daniel Chang is Vice President and General Manager of TDK-InvenSense Taiwan. Dr. Chang has over 25 years’ experience commercializing MEMS products and specializes in MEMS product integration. At InvenSense, he oversees the team of 300 people on various aspects of operation and engineering activities to deliver over 1 billion intelligent sensors per year. Prior to this in 2015, Dr. Chang serves as Sr Director of Product Engineering in Qualcomm MEMS Technology; where he launches several connected devices showcasing the latest Qualcomm technologies. Before joining Qualcomm in 2005, Dr. Chang has been with HannStar Display (2003), TSMC North America (2000), and Unilever Research US (1996). Dr. Chang received a BS in Chemical Engineering from National Taiwan University in 1987, and then received an MS in Chemical Engineering from the University of Texas in Austin in 1992 and a PhD in Chemical Engineering and Material Science from the University of Minnesota in 1996.
Company Profile
InvenSense, a TDK Group company, is a world-leading provider of sensor solutions, including MEMS and magnetic sensors for consumer, industrial, and automotive applications. InvenSense MEMS sensors are known to be best-in-class for reasons that include high performance and reliability, high-volume manufacturing capacity and supply stability, ongoing hardware and software innovation, and ultra-low power consumption. They can be found in Mobile, Wearable, Smart Home, Industrial, Automotive, IoT, and Robotics products, among others. Founded in 2003, InvenSense has a 20+ year history of patented sensor technology across Motion, Sound, and Ultrasonic solutions, including the invention of the 6-axis IMU. InvenSense is dedicated to enabling partner success and enhancing lives through sustainable sensor innovation. In May of 2017, InvenSense became part of the MEMS Sensors Business Group of TDK Corporation, based in Tokyo, Japan. InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia, and Italy.
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